CNS 10556-1985 Copper-Clad Laminates for Printed Circuits (Paper Base Epoxy Resin)《印刷电路用铜积层板（纸基材环氧树脂）》.pdf

相关资源

JIS A6024-1998 建筑物修补用环氧树脂注入胶粘剂.pdf

JIS A6024-2008 建筑物修补用环氧树脂注入剂.pdf

JIS G5528-2006 球墨铸铁管内壁环氧树脂的涂布方法(修改件1).pdf

JIS K5551-2002 环氧树脂涂料.pdf

JIS K7236-2009 环氧树脂中环氧当量的测定(追補1).pdf

JIS C2263-2012 电绝缘用带B级环氧树脂粘合剂的玻璃衬底云母纸.pdf

JIS C2264-2012 电绝缘用带B级环氧树脂粘合剂的聚酯膜衬底云母纸.pdf

JIS C6522-1996 多层印制电路板用半固化片.环氧树脂.浸渍玻璃布.pdf

JIS G5528-1984 球墨铸铁管内壁环氧树脂的涂布方法.pdf

JIS K5555-2002 环氧树脂云母状氧化铁涂料.pdf

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