1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED E Remove vendors CAGE 18324, 27014 and 34335. Convert to military drawing format. Editorial changes throughout. Add LCC package. 87-06-19 N. A. Hauck F Update to reflect latest changes in format and requirements. Editorial changes throughout. -les
2、03-01-09 Raymond Monnin G Update to reflect latest changes in format and requirements. Correct paragraph in 3.5. Editorial changes throughout. les 05-08-01 Raymond Monnin THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED. CURRENT CAGE CODE 67268 REV SHET REV SHET REV STATUS REV G G G G G G G
3、 G G G G OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 PMIC N/A PREPARED BY Joseph A. Kirby DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY D. A. DiCenzo COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY N. A. Hauck MI
4、CROCIRCUIT, DIGITAL, LOW-POWER SCHOTTKY TTL, MULTIPLEXER, MONOLITHIC AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 77-10-25 SILICON AMSC N/A REVISION LEVEL G SIZE A CAGE CODE 14933 76010 SHEET 1 OF 11 DSCC FORM 2233 APR 97 5962-E397-05 Provided by IHSNot for ResaleNo reproduction o
5、r networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76010 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN cla
6、ss level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 76010 01 E X Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type. The device type ide
7、ntify the circuit function as follows: Device type Generic number Circuit function 01 54LS151 8-line to 1-line data selector/multiplexer 1.2.2 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style E GDIP1-T16
8、or CDIP2-T16 16 dual-in-line F GDFP2-F16 or CDFP3-F16 16 flat 2 CQCC1-N20 20 square chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage . -0.5 V dc to +7.0 V dc Input voltage range . -1.5 V dc at -18 mA to +5.5 V
9、dc Storage temperature range -65C to +150C Maximum power dissipation (PD) 1/ . 55 mW Lead temperature (soldering, 10 seconds) . +300C Thermal resistance, junction-to-case (JC): Cases E, F and 2 . See MIL-STD-1835 Junction temperature (TJ) +175C 1.4 Recommended operating conditions. Supply voltage ra
10、nge (VCC) . 4.5 V dc minimum to 5.5 V dc maximum Minimum high level input voltage (VIH) . 2.0 V dc Maximum low level input voltage (VIL) 0.7 V dc Case operating temperature range (TC) -55C to +125C _ 1/ Maximum power dissipation is defined as VCCx ICC, and must withstand the added PDdue to short-cir
11、cuit test; e.g., IOS. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76010 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Gover
12、nment specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICAT
13、ION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard M
14、icrocircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
15、2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENT
16、S 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or
17、a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) pla
18、n may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML fl
19、ow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The term
20、inal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performanc
21、e characteristics are as specified in table I and shall apply over the full case operating temperature range. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76010 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 432
22、18-3990 REVISION LEVEL G SHEET 4 DSCC FORM 2234 APR 97 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, app
23、endix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicato
24、r “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-
25、HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of
26、 conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.9 Verification and review. DSCC, DSCCs agent,
27、and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS
28、-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76010 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TC +125C unless otherwise specified Group A subgroupsDevice type Limits
29、 Unit Min Max High-level output voltage VOH VCC = 4.5 V, IOH = -400 A VIN= 0.7 V or 2.0 V 1, 2, 3 All 2.5 V Low-level output voltage VOL VCC= 4.5 V, IOL= 4 mA VIN= 0.7 V or 2.0 V 1, 2, 3 All 0.4 V Input clamp voltage VIC VCC= 4.5 V, IIN= -18 mA, TC= +25C 1 All -1.5 V High level input current IIH1 VC
30、C= 5.5 V, VIH= 2.7 V 1, 2, 3 All 20 A IIH2 VCC= 5.5 V, VIH= 5.5 V 1, 2, 3 All 100 A Low level input current IIL VCC= 5.5 V, VIL= 0.4 V 1, 2, 3 All -1.2 mA Short circuit output current IOS VCC= 5.5 V, VOUT= 0.0 V 1/ 1, 2, 3 All -6 -130 mA Supply current ICCVCC= 5.5 V 1, 2, 3 All 10 mA Functional test
31、s See 4.3.1c 7 All tPHL19 30 ns VCC= 5.0 V, RL= 2 k 5% CL= 15 pF 10% 10, 11 All 42 ns 35 Propagation delay time, high to low level, A, B, or C to Y 4 levels 2/ CL= 50 pF 10% 10, 11 All 49 ns tPLH19 43 CL= 15 pF 10% 10, 11 All 60 ns 48 Propagation delay time, low to high level, A, B, or C to Y 4 leve
32、ls CL= 50 pF 10% 10, 11 All 67 ns tPHL29 32 CL= 15 pF 10% 10, 11 All 45 ns 37 Propagation delay time, high to low level, A, B, or C to W 3 levels CL= 50 pF 10% 10, 11 All 52 ns tPLH29 23 CL= 15 pF 10% 10, 11 All 32 ns 28 Propagation delay time, low to high level, A, B, or C to W 3 levels CL= 50 pF 1
33、0% 10, 11 All 39 ns See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76010 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 6 DSCC FORM 2234 APR 97 TABL
34、E I. Electrical performance characteristics - Continued. Test Symbol Conditions -55C TC +125C unless otherwise specified Group A subgroupsDevice type Limits Unit Min Max tPHL39 All 32 ns VCC= 5.0 V, RL= 2 k 5% CL= 15 pF 10% 10, 11 All 45 ns 37 Propagation delay time, high to low level, Strobe to Y 2
35、/ CL= 50 pF 10% 10, 11 All 52 ns tPLH39 42 CL= 15 pF 10% 10, 11 All 59 ns 47 Propagation delay time, low to high level, Strobe to Y CL= 50 pF 10% 10, 11 All 66 ns tPHL49 30 CL= 15 pF 10% 10, 11 All 42 ns 35 Propagation delay time, high to low level, Strobe to W CL= 50 pF 10% 10, 11 All 49 ns tPLH49
36、24 CL= 15 pF 10% 10, 11 All 34 ns 29 Propagation delay time, low to high level, Strobe to W CL= 50 pF 10% 10, 11 All 41 ns tPHL59 26 CL= 15 pF 10% 10, 11 All 36 ns 31 Propagation delay time, high to low level, D0-D7 to Y CL= 50 pF 10% 10, 11 All 43 ns tPLH59 32 CL= 15 pF 10% 10, 11 All 45 ns 37 Prop
37、agation delay time, low to high level, D0-D7 to Y CL= 50 pF 10% 10, 11 All 52 ns See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76010 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 4
38、3218-3990 REVISION LEVEL G SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions -55C TC +125C unless otherwise specified Group A subgroupsDevice type Limits Unit Min Max tPHL69 All 20 ns VCC= 5.0 V, RL= 2 k 5% CL= 15 pF 10% 10, 11 All 28 n
39、s 23 Propagation delay time, high to low level, D0-D7 to W 2/ CL= 50 pF 10% 10, 11 All 32 ns tPLH69 21 CL= 15 pF 10% 10, 11 All 29 ns 26 Propagation delay time, low to high level, D0-D7 to W CL= 50 pF 10% 10, 11 All 36 ns 1/ Not more than one output should be shorted at a time, and the duration of t
40、he short-circuit condition should not exceed one second. 2/ Propagation delay time testing may be performed using either CL= 15 pF or CL= 50 pF. However, the manufacturer must certify and guarantee that the microcircuits meet the switching test limits specified for a 50 pF load. Provided by IHSNot f
41、or ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76010 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 8 DSCC FORM 2234 APR 97 Device types 01 01 Case outlines E, F 2 Terminal number Terminal symbols Te
42、rminal symbols 1 (INPUT) D3 N/C 2 (INPUT) D2 (INPUT) D3 3 (INPUT) D1 (INPUT) D2 4 (INPUT) D0 (INPUT) D1 5 (OUTPUT) Y (INPUT) D0 6 (OUTPUT) W N/C 7 (STROBE) S (OUTPUT) Y 8 GND (OUTPUT) W 9 (DATA SELECT) C (STROBE) S 10 (DATA SELECT) B GND 11 (DATA SELECT) A N/C 12 (INPUT) D7 (DATA SELECT) C 13 (INPUT
43、) D6 (DATA SELECT) B 14 (INPUT) D5 (DATA SELECT) A 15 (INPUT) D4 (INPUT) D7 16 VCC N/C 17 - - - (INPUT) D6 18 - - - (INPUT) D5 19 - - - (INPUT) D4 20 - - - VCC FIGURE 1. Terminal connections. Inputs Outputs Select Strobe C B A S Y W X X X H L H L L L L D0 D0 L L H L D1 D1 L H L L D2 D2 L H H L D3 D3
44、 H L L L D4 D4 H L H L D5 D5 H H L L D6 D6 H H H L D7 D7 H = High voltage level L = Low voltage level X = Irelevant D0, D1 D7 = The level of the D respective input. FIGURE 2. Truth table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICRO
45、CIRCUIT DRAWING SIZE A 76010 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 9 DSCC FORM 2234 APR 97 FIGURE 3. Logic diagram. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76010 D
46、EFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 10 DSCC FORM 2234 APR 97 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5
47、004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document rev
48、ision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. TABLE II. Electri
