1、DESC-DWG-85148 REV A 57 W 7777775 0004bb W LV R DESCAIPTIOM . DATE 20 Aug 87 A Add device type 03. Add case outline Y. Change supply vol tage range , o *- -I APPROVED Defense Electronics Supply Center Dayton, Ohio Original date of drawing: 20 May 1986 AMSC NIA IPREPARED BY -1 MklTARY DRAWING This dr
2、awing is available for use by all Departments and Agencies of the Depart. ment of Defense - . .- I TITLE: MICROPROCESSOR, 16-BIT , N-CHANNEL , MONOLITHIC SILICON MI CROC I RCU IT 5962-85148 DWQ NO. I REV A PACIE 1 OF 28 f - DISTRIBUTION STATEMENT A. Approved for public re DESC FORM 193 5962-E534 eas
3、e; distribution is un1 irni ted. I Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-L I + l 1. SCOPE 1.1 - Scope. This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 01 MIL-STD-883, “Provisions for the use of
4、MIL-STD-883 in conjunction with compliant non-JAN devices I 1.2 Part number. -The complete part number shall be as shown in the following example: 5962-85148 o1 X X I 9 7 -I i I 1 i I I I I i I I Drawing number Devi ce type Case outline Lead finish per (1.21) (1.2.2) MIL-M-38510 1.2.1 Device types.
5、The device types shall identify the circuit function as follows: Frequency Circuit function Device type Generic number o1 M80286-8 a MH 16-bi t microprocessor 02 M80286-6 6 MHz 16-bit microprocessor 03 M80286-10 10 MHz 16-bi t microprocessor 1.2.2 Case outlines. The cace outlines shall be as designa
6、ted in appendix C of MIL-M-38510, and as fol 1 ows : Out1 ine letter Case outline X Y P-AC 68-terminal (1.160 by 1.160“) pin grid array 68-teminal ceramic quad package (see figure 3) 1.3 Absolute maximum ratings. Supply voltage range with respect to ground (VCC)- - - - - Storage temperature range- -
7、 - - - - - - - - - - - - - - - Maximum power dissipation (PD) (per device type) - - - - - Lead temperature (soldering, 5 seconds)- - - - - - - - - - -1.g to t7.0 1( dc -65 C to +150 C 3.3 W dc +3OO0C Junction temperature (TJ)- - - - - - - - - - - - - - - - - +20O0C Thermal resistance, junction-to-ca
8、se (eJC) - - - - - - - - +9.5“C/W 1,4 Recommended operating condi tionc. Supply voltage (Y c) - - - - - - - I - - - - - - - - - - - Minimum high leve! input voltage (VIH): Maximum low level input voltage (VIL): Minimum high level output voltage- - - - - - - - - - - - - Maximum low level output volta
9、ge - - - - - - - - - - - - - Frequency of operati on : 4.75 Y dc minimum to 5.25 V dc maximum Logic inputs - - - - - - - - Clock input- Logic inputs - - Clock Input- - - - - - - - - - - - - 2.0 V dc to Vcc+ -5 V dc 3.8 V dc to Vcc+ e5 V dc -0.5 V dc to 0.8 V dC - - - - - - - - - - - - - - - - - - -0
10、.5 Y dC to 0.6 V dC - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 2.4 V dc 0.45 V dc 01- 8 MHz 02- 6MHz 03- Case operating temperature range - - - - - - - - - - - - - 10 IjHz i! -55.C to +125C SIZE CODE IDENT. NO. DWG NO. L MILITARY DRAWkNG A 67268 5962-85148 DEFENSE
11、ELECTRONICS SUPPLY CENTER . DAYTON, OHIO REV A PAGE 2 t - DESC FORM 193A FE8 86 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-1 DESC-DWG-85148 REV A 57 7777775 DOO4b8 L W - L * MILITARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER 2. APPLICABLE DOCUME
12、NTS SIZE CODE IDENT. NO. DWG NO. A 67268 5962-85148 I I 2.1 Government specification and standard. Unless otherwise specified, the following specification nd standard, of the issue listed in that issue of the Department of Defense Index of Specifications nd Standards specified in the solicitation, f
13、orm a part of this drawing to the extent specified herein. SPECIFICATION . MILITARY DAYTON, OHIO REV A I MI L -M-38510 - Microcircuits, General Specification for. PAGE 3 STANDARD MILITARY MIL-STD-883 - Test Methods and Procedures for Microelectronics. (Copies of the specification and standard requir
14、ed by manufacturers in connection with specific cquisition functions should be obtained from the contracting activity or as directed by the ontracting activity. 1 eferences cited herein, the text of this drawing shall take precedence. 2.2 Order of precedence. 3. REQUIREMENTS In the event of a confli
15、ct between the text of this drawing and the 3.1 Item requirements. The individual item requirements shall be in accordance with 1.2.1 of IL - STD - s specif!% herein. “Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices“ and 3.2 Design, construction, and physical dime
16、nsions. The design, construction, and physical imensions snai I be as Specitled in MIL-M-38510 and herein. 3.2.1 Terniinal connections. 3.2.2 Block diagram. The block diagram shall be as specified on figure 2. 3.2.3 Case outlines. The case outlines shall be in accordance with 1.2.2 and figure 3. The
17、 terminal connections shall be as specified on figure 1. 3.3 Electrical performance characteristics. Unless otherwise specified, the electrical performance haracteristlcs are as specified in table I and apply over the full recommended case operating - emperature range. arked with the part number lis
18、ted in 1.2 herein. In addition, the manufacturers part number may also e marked as listed in 6.5 herein. 3.4 Marking. Marking shall be in accordance with MIL-STD-883 (see 3.1 herein). The part shall be Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-
19、TABLE I. Electrical performance characteristics. MILITARY DRAWING DEFENSEELECTRONICSSUPPLYCENTER DAYTON, OHIO Test SIZE CODE IDENT. NO. DWG NO. A 67268 5962-85148 REV A PAGE 4 Symbol - I Input low vol tage IVIL I Input high voltage IVIH I CLK input low voltage VILC I I I Conditions -55C FIGURE 1. Te
20、rminal connections - Continued. 9 ! I REV A I PAGE I DAYTON, OHIO I FEE 86 I Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-I I I I I I I I I I 1 SIZE CODE IDENT. NO. A 67268 MILITARY DRAW1 NG “ K W K ,O “O II P q o I- 4 I DWG NO. 5962-85148 r- L7 -
21、 DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO ,- - 10 REV A PAGE Ir I I I I I I I I ,J L, . I. J -. I I 1, I Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-. REV A -+ 11 PAGE I ( .O 2 0 1 4 5 o C HA M FER INDEX CORNER LPIN NO. 1 INDICATOR AREA S E
22、AT1 N G AND BASE- PLANE ALL CORNER BRAZE PADS ARE 45 CHAMFER FIGURE 3. Case outline Y. MILITARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO DESC FORM 193A FEE 86 SIZE I CODE IDENT. NO. I DWG NO 5962-85148 Provided by IHSNot for ResaleNo reproduction or networking permitted without license
23、 from IHS-,-,-+ J 7 SIZE CODE IDENT. NO. DWG NO. MILITARY DRAWING A 67268 5962-85148 DEFENSE ELECTRONICS SUPPLY CENTER I DAYTON, OHIO REV A PAGE 12 DECC FORM 193A FEB 86 I I I I 1 Min I Max I Min I Max I I I I I I I I I I I A 10.080 10,106 2.03 I 2.69 1 I I I I I I I I I 10.016 10.020 I 0.41 1 0.51
24、f Bi iO.040 10.060 i 1.02 i 1.52 I I I I I I I I I 1 62 10.030 10.040 I 0.76 I 1.02 I I I I I I i B3 10.005 (0.020 i 0.13 f 0.51 i I I I I I I I I I I I D 11.640 11.870 141.66 147.50 I I I I I I 1 D1 10.935 10.970 123.75 124.64 I I I I I 1 I 1 D2 I 0.800 BSC I 20.32 BSC 1 I I I 1 I I i I 0.050 BSC I
25、 1.27 BSC I I I I I I I IL 0.375 10.450 I 9.53 111.43 1 I I I I I I I 0.040 10.060 I 1.02 1.52 tB I I I I I 1 c Io.008 10.012 Io.20 I 0.31 I_ I lL1 I I I I I I IN I 68 I 68 I I I I MILITARY DRAWING DAYTON, OHIO I w I S 10.066 10.087 I 1.68 I T-T-f-T- I 1.27 I 10*050 I I I I I 2,21 I I 7 I I - FIGURE
26、 3. Case outline Y - Continued. 8 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-+ SIZE A A C TEST LOADING ON OUTPUTS CODE IDENT. NO. DWG NO. 67268 5962-85148 4.0V C LK REV A A C DRIVE 13 PAGE DESC-DWG-BSLqB REV A 57 7779775 0004678 LI .r -. AND MEA
27、SUREMENT POINTS CLK INPUT MILITARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO DESC FORM 193A FEB 86 FIGURE 4. Waveforms. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,- DESC-DWG-85148 REV 59 9997995 0004b97 b i , r MILITARY DRAWING DEFEN
28、SEELECTRONICSSUPPLYCENTER CLK INPUT SET UP 0.45 V SIZE CODE IDENT. NO. DWG NO. A 67268 5962-85148 I I I 2.4 V OTHER DEVICE INPUT DEVICE OUTPUT AC CET UP,HOLD AND DELAY TIME MEASUREMENT-GENERAL FIGURE 4. Waveforms - Continued. DAYTON, OHIO I REV A 14 I PAGE DESC FORM 193A FEE 86 Provided by IHSNot fo
29、r ResaleNo reproduction or networking permitted without license from IHS-,-,-DESC-DWG-85148 REV A 57 7777775 000700 7 a MILITARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 3 a L E 1 SIZE CODE IDENT. NO. DWG NO. A 67268 5962-85148 15 REV A PAGE A- 0 lm-= Provided by IHSNot for ResaleNo re
30、production or networking permitted without license from IHS-,-,-DESC-DWG-85L48 REV A 59 m 9999995 000470L O m MILITARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO Asynchronous input signal timing SIZE CODE IRENT. NO. DWG NO. A 67268 5962-85148 REV A PAGE 16 BUS CYCLE TYPE CL K PCLK (SEE N
31、OTE I) INTR NMI HOLD, PERE Q (SEE NOTE 2) - ERROR, BUSY (CEE NOTE 2 1 NOTES: 1. PCLK indicates which processor cycle phase will occur on the next CLK. PCLK may not indicate the correct phase until the first bus cycle is performed. 2, These inputs are asynchronous, The setup and hold times shown assu
32、re recognition for testing purposes. FIGURE 4. Waveforms - Continued. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DESC-DWG-85148 REV A 57 m 7777775 0004702 E m r REV A Reset input timing and subsequent processor cycle phase 17 PAGE , RESET / “C H
33、 TX - $1 92 92 CLK (SEE NOTE i 1 RESET NOTE: When RESET meets the setup time shown, the next CLK will start or repeat 42 of a processor cycle. FIGURE 4. Waveforms - Continued. MILITARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO )ESC FORM 193A FEE 86 SIZE I CODE IDENT. NO: I DWG NO. A I 6
34、7268 I 5962-85148 i Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-.I 2 o MILITARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO I I 1 I ,i W Q SIZE CODE IDENT. NO. DWG NO, A 67268 5962-85148 REV A PAGE 18 I I I I I I n O Provided by IHSNot
35、 for ResaleNo reproduction or networking permitted without license from IHS-,-,- DESC-DWG-85148 REV A 57 7777775 0004704 b W SIZE MILITARY DRAWING A -D CODE IDENT. NO. DWG NO. 67268 5962-85148 - PEREQ/PEACK timing for one transfer only. DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO BUS CYCLE TYPE 1
36、9 REV A PAGE CLK - SI ,so *235 Co D / I NTA PEACK M/IO 110 READ IF PROC. EXT. TO I MEMORY WRITE IF PROC. EXT. TO MEMORY I/O WRITE IF MEMORY TO PROC, EXT, MEMORY READ IF MEMORY / I MEMORY ADDRESS IF PROC. EXT. TO MEMORY TRANSFER 1/0 PORT ADDRESS OOFA(H) IF MEMORY TO PROC. EXT. I II ,TRANSFER I x x x
37、/ X .I/O PORT ADDRESS OOFA(H) IF PROC. EXT, TO IMEMORY TRANSFER MEMORY ADDRESS IF MEMORY TO PROC. EXT. TRANSFER I PEREQ Assuming word-aligned memory operand, if odd aligned, 80286 transfers to/from memory byte-at-a-time with two memory cycles. NOTEL 1. PEACK always goes active during the first bus o
38、peration of a processor extension data operand and transfer sequence. The first bus operation will be either a memory read at operand address or I/ read at port address OOFA( H). To prevent a second processor extension data operand transfer, the worst case maximum time (shown above) is: 3 x 0- 11mXa
39、MIN. The actual con iguration dependent, maximum time is: added to either the first or second bus operation of the processor extension data operand transfer sequence. 2. 3 x :llf b MIN + A x 2 x(9. A is the number of extra TC states FIGURE 4. Waveforms - Continued. Provided by IHSNot for ResaleNo re
40、production or networking permitted without license from IHS-,-,-W a * I- !- W v) W a *Y It; 2 I2 MILITARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 3ESC FORM 193A FEE 06 m (u e !- U o SIZAE l;DET. NU. DWti NU, PAGE 2o 67268 5962-85148 - -= _ - _- =_ -. Provided by IHSNot for ResaleNo re
41、production or networking permitted without license from IHS-,-,-Pin state during reset MILITARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER NOTES : 1. Setup time for RESET+ may be violated with the consideration that 41 of the processor clock may begin one system CLK period later. 2. Setup and hold ti
42、mes for RESET+ must be met for proper operation, but RESET+ may occur during di or 42. 3. The data bus is only guaranteed to be in three-state OFF at the time shown. 4. HOLD is acknowledged during RESET, causing HLDA to go active and the appropriate pins to float. inactive, the device remains in HOL
43、D state and will not perform any bus accesses until HOLD is de-activated. If HOLD remains active while RESET goes SIZE CODE IDENT. NO. DWG NO. A 67268 5962-85148 I I FIGURE 4. Waveforms - Continued. DAYTON, OHIO I I REV A I PAGE 21 DESC FORM 193A FEB 86 Provided by IHSNot for ResaleNo reproduction o
44、r networking permitted without license from IHS-,-,- DESC-DWG-BIILIB REV A 57 I 7777775 0004707 I i- v. MILITARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO -+ SIZE CODE IDENT. NO. DWG NO. A 67268 5962-85148 22 PAGE A REV 3.5 Certificate of compliance. A certificate of compliance shall be
45、 required from a manufacturer in wder to De Iistea as an a pproved source of supply in 6.5. The certificate of compliance submitted to )ESC-ECS prior to listing as an approved source of supply shall state that the manufacturers product Reets the requirements of MIL-STD-883 (see 3.1 herein) and the r
46、equirements herein, ierein) shall be provided with each lot of microcircuits delivered to this drawing. 3.6 Certificate of conformance. A certificate of confonnance as required in MIL-STO-883 (see 3.1 3,7 Notification of change, Notification of change to DESC-ECS shall, be required in accordance wit
47、h IIL-STD-883 ( see 3.1 herein). 3.8 Verification and review, DESC, DESCs agent, and the acquiring activity retain the option to fieview the manufacturers facility and applicable required documentation. Offshore documentation shall )e made available onshore at the option of the reviewer. 4. QUALITY
48、ASSURANCE PROVISIONS 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with section I of MIL-M-38510 to the extent specified in MIL-STD-883 (see 3.1 herein). 4,2 Screening. Screening shall be in accordance with inethod 5004 of MIL-STD-883, and shall be :onducted on al 1 devices prior to quality conformance inspection. The following additional criteria ;hall ap
