DLA SMD-5962-87673 REV B-2002 MICROCIRCUIT LINEAR ANALOG SWITCH WITH DRIVER MONOLITHIC SILICON《硅单块 带驱动器模拟开关 直线型微型电路》.pdf

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DLA SMD-5962-87673 REV B-2002 MICROCIRCUIT LINEAR ANALOG SWITCH WITH DRIVER MONOLITHIC SILICON《硅单块 带驱动器模拟开关 直线型微型电路》.pdf_第1页
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1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Changes in accordance with N.O.R. 5962-R167-92. 92-12-15 M. A. FRYE B Drawing updated to reflect current requirements. - ro 02-09-23 R. MONNIN THE FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED. REV SHET REV SHET REV STATUS REV B B B B B B B B B B

2、 B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 PMIC N/A PREPARED BY MARCIA B. KELLEHER DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY RAY MONNIN COLUMBUS, OHIO 43216 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY D. R. COOL MICROCIRC

3、UIT, LINEAR, ANALOG SWITCH WITH DRIVER, MONOLITHIC SILICON AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 88-06-06 AMSC N/A REVISION LEVEL B SIZE A CAGE CODE 67268 5962-87673 SHEET 1 OF 12 DSCC FORM 2233 APR 97 5962-E584-02 DISTRIBUTION STATEMENT A. Approved for public release; dist

4、ribution is unlimited.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87673 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL B SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This dra

5、wing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-87673 01 C X Drawing number Device type (see 1.2.1) Case o

6、utline (see 1.2.2) Lead finish (see 1.2.3) 1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 DG180A High-speed driver with JFET switches 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as

7、 follows: Outline letter Descriptive designator Terminals Package style A 1/ GDFP5-F14 or CDFP6-F14 14 Flat pack C GDIP1-T14 or CDIP2-T14 14 Dual-in-line I MACY1-X10 10 Can X CDFP3-F14 14 Flat pack 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum

8、ratings. Voltage, negative supply to positive supply (+VCCto -VCC) 36 V dc Voltage, drain to positive supply (+VCCto VD) 33 V dc Voltage, negative supply to drain (VDto -VCC) . 33 V dc Voltage, source to drain (VDto VS). 22 V dc Voltage, negative supply to logic supply (VLto -VCC). 36 V dc Voltage,

9、input to logic supply (VLto VIN) . 8 V dc Voltage, reference supply to logic supply (VLto VR) 8 V dc Voltage, reference supply to input (VINto VR) . 8 V dc Voltage, negative supply to reference supply (VRto -VCC) 27 V dc Voltage, input to reference supply (VRto VIN) 2 V dc Current, source or drain .

10、 200 mA Current, all other pins . 30 mA Lead temperature (soldering, 10 seconds) +300C Storage temperature range -65C to +150C _ 1/ This package is inactive for new design. Acceptable only for use in equipment designed or redesigned on or before 29 November 1986. Provided by IHSNot for ResaleNo repr

11、oduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87673 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL B SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings Continued. Junction temperature (TJ) +175C Power dissipat

12、ion (PD): 2/ Case A 750 mW Case C 825 mW Case I . 450 mW Case X 900 mW Thermal resistance, junction-to-case (JC) See MIL-STD-1835 1.4 Recommended operating conditions. Positive supply voltage (+VCC) +15 V dc Negative supply voltage (-VCC) -15 V dc Reference supply voltage (VR) GND Logic supply volta

13、ge (VL) . +5 V dc Ambient operating temperature range (TA) -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the i

14、ssues of these documents are those listed in the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the solicitation. SPECIFICATION DEPARTMENT OF DEFENSE MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. STA

15、NDARDS DEPARTMENT OF DEFENSE MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. HANDBOOKS DEPARTMENT OF DEFENSE MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Unless otherwise

16、 indicated, copies of the specification, standards, and handbooks are available from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) _ 2/ Power ratings based on device mounted with all leads welded or soldered to PC board. Derate at +75C the fo

17、llowing cases: case A at 10 mW/C, case C at 11 mW/C, case I at 6 mw/C, and case X at 10 mW/C. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87673 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REV

18、ISION LEVEL B SHEET 4 DSCC FORM 2234 APR 97 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific

19、 exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (Q

20、ML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as d

21、ocumented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-3

22、8535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2

23、herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3. 3.2.5 AC switching diagram. The AC switching diagram shall b

24、e as specified on figure 4. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test r

25、equirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may al

26、so be marked as listed in MIL-HDBK-103 (see 6.6 herein). For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall b

27、e marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compl

28、iance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements o

29、f MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA sha

30、ll be required in accordance with MIL-PRF-38535, appendix A. 3.9 Verification and review. DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option o

31、f the reviewer. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87673 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL B SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance ch

32、aracteristics. Test Symbol Conditions 1/ -55C TA +125C unless otherwise specified Group A subgroups Device type Limits Unit Min Max Resistance (on) drain-to-source RDSVD= -7.5 V, IS= -10 mA, 1,3 01 2 10 VIN= 0.8 V 2 2 20 Source leakage current (off) IS(OFF)+VCC= 10 V, -VCC= -20 V, VD= -10 V, VS= 10

33、V, 1 01 -10.0 10.0 nA VIN= 2 V 2,3 -1000 1000 VD= -7.5 V, VS= 7.5 V, 1 -10.0 10.0 VIN= 2 V 2,3 -1000 1000 Drain leakage current (off) ID(OFF)VD= 7.5 V, VS= -7.5 V, 1 01 -10.0 10.0 nA VIN= 2 V 2,3 -1000 1000 +VCC= 10 V, -VCC= -20 V, VD= 10 V, VS= -10 V, 1 -10.0 10.0 VIN= 2 V 2,3 -1000 1000 Channel le

34、akage current (on) ID(ON)+ VS= VD= -7.5 V, 1 01 -2.0 2.0 nA IS(ON)VIN= 0.8 V 2,3 -200 200 Low level input current IILVINunder test = 0 V, all other VIN= 5 V 1,2,3 01 -250 10.0 A High level input current IIHVINunder test = 5 V, 1 01 -10.0 10.0 A all other VIN= 0 V 2,3 -20 20 See footnotes at end of t

35、able. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87673 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL B SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characterist

36、ics Continued. Test Symbol Conditions 1/ -55C TA +125C unless otherwise specified Group A subgroups Device type Limits Unit Min Max Positive supply current +ICCVIN= 0 V 1 01 1.5 mA 2 1.5 3 2.5 VIN= 5 V 1 1.5 2 1.5 3 2.5 Negative supply current -ICCVIN= 5 V 1 01 -5.0 mA 2 -5.0 3 -8.0 VIN= 0 V 1 -5.0

37、2 -5.0 3 -8.0 Logic supply current ILVIN= 0 V and VIN= 5 V 1 01 4.5 mA 2 4.5 3 7.5 Reference supply current IRVIN= 0 V and VIN= 5 V 1 01 -2.0 mA 2 -2.0 3 -2.5 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MIC

38、ROCIRCUIT DRAWING SIZE A 5962-87673 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL B SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics Continued. Test Symbol Conditions 1/ -55C TA +125C unless otherwise specified Group A subgroups Device type Limi

39、ts Unit Min Max Functional tests See 4.3.1c 7 01 Turn on time tONSee figure 4 9 01 400 ns 10 2/ 600 11 2/ 400 Turn off time tOFFSee figure 4 9 01 250 ns 10,11 2/ 350 1/ Unless otherwise specified, +VCC= +15 V, -VCC= -15 V, VL= 5 V. 2/ If not tested, shall be guaranteed to the limits specified in tab

40、le I herein. 4. QUALITY ASSURANCE PROVISIONS 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality

41、conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A or C. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring acti

42、vity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II h

43、erein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87673 DEFENSE SUPPLY CENTER COLUMBUS COLUM

44、BUS, OHIO 43216-5000 REVISION LEVEL B SHEET 8 DSCC FORM 2234 APR 97 Device type 01 Case outlines A and X C I Terminal number Terminal symbol 1 S1S1S12 D1D1D13 NC NC IN14 NC NC +VCC5 IN1IN1VL6 +VCC+VCCVR7 VLVL-VCC8 VRVRIN29 -VCC-VCCD210 IN2IN2S211 NC NC - 12 NC NC - 13 D2D2- 14 S2S2- NC = No connecti

45、on FIGURE 1. Terminal connections. LOGIC SWITCH 0 ON 1 OFF Logic “0” 0.8 V Logic “1” 2.0 V FIGURE 2. Truth table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87673 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS,

46、 OHIO 43216-5000 REVISION LEVEL B SHEET 9 DSCC FORM 2234 APR 97 FIGURE 3. Logic diagram. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87673 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION

47、 LEVEL B SHEET 10 DSCC FORM 2234 APR 97 VOis the steady state output with the switch on. Feedthrough via switch capacitance may result in spikes at the leading and trailing edge of the output waveform. Switch output waveform shown for VS= constant with logic input waveform as shown. Note that VSmay

48、be + or as per switching time test circuit. FIGURE 4. AC switching diagram. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87673 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL B SHEET 11 DSCC FORM 2234 APR 97 TABLE II. Electrical test requirements. MIL-STD-883 test requirements Subgroups (in accordance with MIL-STD-883, method 5005, table I) Interim electrical parameters (method 5004) 1 Fina

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