1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Changes to table I. Clarification made in figure 1. Technical changes to table IIA. Replaced pin description in section 6.7. Editorial changes throughout. 93-02-24 Monica L. Poelking B Update boilerplate to MIL-PRF-38535 requirements. - CFS 03-08
2、-05 Charles F. Saffle C Update boilerplate to current MIL-PRF-38535 requirements. - CFS 08-07-17 Thomas M. Hess REV SHET REV C C C C SHEET 15 16 17 18 REV STATUS REV C C C C C C C C C C C C C C OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Jeffery Tunstall DEFENSE SUPPLY CENT
3、ER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Thomas M. Hess COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Monica L. Poelking MICROCIRCUIT, DIGITAL, MANCHESTER AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 9
4、2-09-04 ENCODER/DECODER, MONOLITHIC SILICON AMSC N/A REVISION LEVEL C SIZE A CAGE CODE 67268 5962-90549 SHEET 1 OF 18 DSCC FORM 2233 APR 97 5962-E383-08 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90549 D
5、EFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlin
6、es and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example. 5962 - 90549 01 M Q A Federal stock class designator RHA
7、 designator (see 1.2.1) Device type (see 1.2.2)Device class designatorCase outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA de
8、signator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number
9、 Circuit function 01 HD1-15531 Manchester encoder/decoder 1.25 megabit/s 02 HD1-15531B Manchester encoder/decoder 2.50 megabit/s 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements document
10、ation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and a
11、s follows: Outline letter Descriptive designator Terminals Package style Q GDIP1-T40 or CDIP2-T40 40 Dual-in-line 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproducti
12、on or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90549 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ Supply voltage +7.0 V dc Input, output or I/O voltage appli
13、ed GND 0.5 V dc to VCC+ 0.5 V dc Junction temperature (TJ). +175C Storage temperature range -65C to +150C Lead temperature (soldering, 10 seconds). +300C Power dissipation (PD) 1.44 W Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Thermal resistance, junction-to-ambient (JA) 34.8C/W 1.
14、4 Recommended operating conditions. Supply voltage range (VCC) +4.5 V dc to +5.5 V dc Encoder/decoder clock rise time (tECR, tDCR). 8.0 ns max Encoder/decoder clock fall time (tECF, tDCF) 8.0 ns max Sync transition span (tD2) . 18 tDC2/ Short data transition span (tD4). 6.0 tDC2/ Long data transitio
15、n span (tD5) 12 tDC2/ Case operating temperature range (TC) . -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, th
16、e issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface S
17、tandard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or from the Standardization Docu
18、ment Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable la
19、ws and regulations unless a specific exemption has been obtained. _ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ tDC= decoder clock period = 1/fDC. Provided by IHSNo
20、t for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90549 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 4 DSCC FORM 2234 APR 97 3. REQUIREMENTS 3.1 Item requirements. The individual item requirem
21、ents for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements
22、 for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device class
23、es Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outline. The case outline shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Block diagram. The block diagram shall be as specified o
24、n figure 2. 3.2.4 Timing waveforms and test circuit. The timing waveforms and test circuit shall be as specified on figure 3. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradia
25、tion parameter limits are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. 3.5 Mark
26、ing. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA
27、product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device
28、classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manuf
29、acturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted t
30、o DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of
31、conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notifica
32、tion to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DSCC, DSCCs agent, and the acquiring activity retain the option to review the man
33、ufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 105 (see MIL-PR
34、F-38535, appendix A). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90549 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performa
35、nce characteristics. Test Symbol Conditions 1/ -55C TC +125C +4.5 V VCC +5.5 V unless otherwise specified Group A subgroups Device type Limits Unit Min Max Input low voltage VILVCC= 4.5 V and 5.5 V 1, 2, 3 All 0.2(VCC) V Input high voltage VIHVCC= 4.5 V and 5.5 V 1, 2, 3 All 0.7(VCC) V Input low clo
36、ck voltage VILCVCC= 4.5 V and 5.5 V 1, 2, 3 All GND +0.5 V Input high clock voltage VIHCVCC= 4.5 V and 5.5 V 1, 2, 3 All VCC-0.5 V Output low voltage VOLIOL= 1.8 mA, VCC= 4.5 V 2/ 1, 2, 3 All 0.4 V Output high voltage VOHIOH= -3.0 mA, VCC= 4.5 V 2/ 1, 2, 3 All 2.4 V VI= GND, VCC= 5.5 V -1.0 0 Input
37、leakage current IIVI= VCC, VCC= 5.5 V 1, 2, 3 All 0 +1.0 A Operating power supply current ICCOPVCC= 5.5 V, f = 1.0 MHz 3/ 1, 2, 3 All 10 mA Standby supply current ICCSBVIN= VCC= 5.5 V, Output open 1, 2, 3 All 2.0 mA Input capacitance CI4 All 25 pF Input/output capacitance CI/OAll measurements refere
38、nced to device ground. VCC= open, f = 1.0 MHz, See 4.4.1b 4 All 25 pF Functional test 4/ f = 15 MHz, CL= 50 pF, VCC= 4.5 V and 5.5 V VIH= 0.7VCC, VIL= 0.2VCCVIHC= VCC 0.5 V, VILC= GND +0.5 V, See 4.4.1c 7, 8 All Encoder Timing 01 15 Encoder clock frequency fEC9, 10, 11 02 30 MHz 01 2.5 Send clock fr
39、equency fESC9, 10, 11 02 5.0 MHz 01 1.25 Encoder data rate fED9, 10, 11 02 2.50 MHz Master reset pulse width tMRVCC= 4.5 V and 5.5 V, VIH= 0.7VCC, VIL= 0.2VCC, CL = 50 pF, See figure 3. 9, 10, 11 All 150 ns See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking per
40、mitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90549 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions 1/ -55C TC +125C +4.5 V VCC
41、+5.5 V unless otherwise specified Group A subgroups Device type Limits Unit Min Max Encoder Timing - Continued. 01 125 Shift clock delay tE19, 10, 11 02 80 ns 01 75 Serial data setup tE29, 10, 11 02 50 ns 01 75 Serial data hold tE39, 10, 11 02 50 ns Enable setup tE49, 10, 11 All 90 ns Enable pulse w
42、idth tE59, 10, 11 All 100 ns Sync setup tE69, 10, 11 All 55 ns Sync pulse width tE79, 10, 11 All 150 ns Send data delay tE89, 10, 11 All 0 50 ns Bipolar output delay tE99, 10, 11 All 130 ns Enable hold tE109, 10, 11 All 10 ns Sync hold tE11VCC= 4.5 V and 5.5 V, VIH= 0.7VCC, VIL= 0.2VCC, CL = 50 pF,
43、See figure 3. 9, 10, 11 All 95 ns Decoder Timing 01 15 Decoder clock frequency fDC9, 10, 11 02 30 MHz 01 2.5 Decoder sync clock fDS9, 10, 11 02 5.0 MHz 01 1.25 Decoder data rate fDD9, 10, 11 02 2.50 MHz Decoder reset pulse width tDR9, 10, 11 All 150 ns Decoder reset setup time tDRS9, 10, 11 All 75 n
44、s Decoder reset hold time tDRH9, 10, 11 All 75 ns Master reset pulse tMRVCC= 4.5 V and 5.5 V, VIH= 0.7VCC, VIL= 0.2VCC, CL = 50 pF, See figure 3. 9, 10, 11 All 150 ns See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STAN
45、DARD MICROCIRCUIT DRAWING SIZE A 5962-90549 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions 1/ -55C TC +125C +4.5 V VCC +5.5 V unless otherwise specified Group
46、A subgroups Device type Limits Unit Min Max Decoder Timing - Continued. Bipolar data pulse width tD19, 10, 11 All tDC+ 10 5/ ns One zero overlap tD39, 10, 11 All tDC- 10 5/ ns Sync delay (ON) tD69, 10, 11 All -20 110 ns Take data delay (ON) tD79, 10, 11 All 0 110 ns Serial data out delay tD89, 10, 1
47、1 All 80 ns Sync delay (OFF) tD99, 10, 11 All 0 110 ns Take data delay (OFF) tD109, 10, 11 All 0 110 ns Valid word delay tD119, 10, 11 All 0 110 ns Sync clock to shift clock delay tD129, 10, 11 All 75 ns Sync data setup tD13VCC= 4.5 V and 5.5 V, VIH= 0.7VCC, VIL= 0.2VCC, CL = 50 pF, See figure 3. 9,
48、 10, 11 All 75 ns 1/ All tests to be performed using worst-case test conditions, unless otherwise specified. 2/ Interchanging of force and sense conditions is permitted. 3/ Guaranteed if not tested to the table I requirements. 4/ Functional tests performed to verify functionality of device as a Manchester encoder/decoder as defined by MIL-STD-1553. 5/ tDC= Decoder clock period = 1/fDC. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90549 DEFENSE SUPPLY CENTER
