1、BSI Standards PublicationBS EN 16602-60-05:2014Space product assurance Generic procurementrequirements for hybridsBS EN 16602-60-05:2014 BRITISH STANDARDNational forewordThis British Standard is the UK implementation of EN16602-60-05:2014.The UK participation in its preparation was entrusted to Tech
2、nicalCommittee ACE/68, Space systems and operations.A list of organizations represented on this committee can beobtained on request to its secretary.This publication does not purport to include all the necessaryprovisions of a contract. Users are responsible for its correctapplication. The British S
3、tandards Institution 2014. Published by BSI StandardsLimited 2014ISBN 978 0 580 84271 9ICS 49.140Compliance with a British Standard cannot confer immunity fromlegal obligations.This British Standard was published under the authority of theStandards Policy and Strategy Committee on 30 September 2014.
4、Amendments issued since publicationDate Text affectedBS EN 16602-60-05:2014EUROPEAN STANDARD NORME EUROPENNE EUROPISCHE NORM EN 16602-60-05 September 2014 ICS 49.140 English version Space product assurance - Generic procurement requirements for hybrids Assurance produit des projets spatiaux - exigen
5、ces gnriques dapprovisionement des composants hybridesRaumfahrtproduktsicherung - Allgemeine Beschaffungsanforderungen an Hybride This European Standard was approved by CEN on 13 March 2014. CEN and CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the con
6、ditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CEN and CENELEC member. This European S
7、tandard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CEN and CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status as the official versions. CEN and
8、CENELEC members are the national standards bodies and national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, L
9、uxembourg, Malta, Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and United Kingdom. CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels 2014 CEN/CENELEC All rights of exploitation in any form and by any means reserved worldwide fo
10、r CEN national Members and for CENELEC Members. Ref. No. EN 16602-60-05:2014 EBS EN 16602-60-05:2014EN 16602-60-05:2014 (E) 2 Table of contents Foreword 6 Introduction 7 1 Scope . 8 2 Normative references . 9 3 Terms, definitions and abbreviated terms 10 3.1 Terms from other standards 10 3.2 Terms s
11、pecific to the present standard . 10 3.3 Abbreviated terms. 11 4 Sequence of procurement activities . 13 5 Selection of hybrid microcircuit manufacturer 16 5.1 General . 16 5.2 Hybrid microcircuit manufacturer categories . 16 5.2.1 Category 1 manufacturer (preferred case) 16 5.2.2 Category 2 manufac
12、turer (non-preferred case) . 16 6 Validation procedure for a hybrid microcircuit manufacturer 17 6.1 General . 17 6.2 Hybrid circuit technology identification form (HTIF) . 17 6.2.1 General . 17 6.2.2 HTIF for approved manufacturers (category 1) 17 6.2.3 HTIF for manufacturer pending capability appr
13、oval by the approving authority (category 1) 18 6.2.4 HTIF for manufacturer not approved by the approving authority (category 2) . 18 6.3 Validation of category 2 manufacturers . 19 6.3.1 General . 19 6.3.2 Construction analysis on representative samples 19 6.3.3 Quality and technical audit 19 7 Des
14、ign requirements 21 BS EN 16602-60-05:2014EN 16602-60-05:2014 (E) 3 7.1 General . 21 7.1.1 Overview . 21 7.1.2 Design activities 21 7.2 Detail specification for hybrid circuits 22 7.3 Design approval (circuit type approval) . 22 7.3.1 General . 22 7.3.2 Procedure for a new hybrid circuit which is “n
15、on similar” to a reference circuit 23 7.3.3 Procedure for a new hybrid circuit which is “similar” to a reference circuit 24 7.3.4 Procedure for a “recurrent” hybrid circuit . 24 8 Procurement of passive and active chips 25 8.1 General . 25 8.1.1 Introduction . 25 8.1.2 Selecting chip suppliers 27 8.
16、1.3 Specifications 27 8.1.4 Requirements for chip lots . 27 8.2 Procurement of passive chips . 28 8.2.1 General . 28 8.2.2 Bondability test 28 8.2.3 Lot acceptance test (LAT) . 28 8.3 Procurement of active chips 29 8.3.1 General . 29 8.3.2 Bondability test 30 8.3.3 User LAT . 30 8.4 Procurement of h
17、ermetically encapsulated chips 32 9 Procurement of materials and piece parts . 33 9.1 Overview 33 9.2 Selection of materials and piece parts 33 9.3 Specifications . 33 9.4 Requirements for materials and piece parts 34 10 Manufacturing and screening of hybrid circuit lots 35 10.1 Manufacturing . 35 1
18、0.2 Marking . 35 10.2.1 General . 35 10.2.2 Special cases 36 10.3 Screening . 36 BS EN 16602-60-05:2014EN 16602-60-05:2014 (E) 4 10.3.1 General . 36 10.3.2 Thermographic test . 39 10.3.3 Pre-seal burn-in 40 10.3.4 Photograph of circuits . 40 10.3.5 Conditions for constant acceleration and mechanical
19、 shock 40 10.3.6 Test condition for PIND . 40 10.3.7 Leak tests . 41 10.3.8 Physical dimensions 41 10.3.9 Burn-in test . 41 10.3.10 Radiographic inspection 41 10.4 Lot rejection 41 10.4.1 Definition of failure modes . 41 10.4.2 Criteria for lot rejection 42 10.4.3 Disposition of rejected lots 43 10.
20、5 Repair provisions 43 10.5.1 General . 43 10.5.2 Element replacement 43 10.5.3 Wire re-bonding 43 10.5.4 Compound bonding . 44 10.5.5 Delidding of hybrid circuits 44 11 Customer inspection and review 45 12 Lot acceptance tests for hybrid circuits . 46 12.1 General . 46 12.1.1 Overview . 46 12.1.2 S
21、amples 46 12.2 Category 1 manufacturer 47 12.2.1 Option 1: Production lot control . 47 12.2.2 Option 2: Lines under TRB management and statistical process control . 48 12.3 Category 2 manufacturer (validated for the project) 49 13 Hybrid delivery and data package . 53 13.1 General . 53 13.2 Data doc
22、umentation 53 13.2.1 General . 53 13.2.2 Cover sheets . 54 13.2.3 Certificate of conformity 54 13.3 Packaging and despatch. 54 BS EN 16602-60-05:2014EN 16602-60-05:2014 (E) 5 14 DPA test sequence . 55 Bibliography . 76 Figures Figure 4-1: Sequence of activities in the procurement of hybrid microcirc
23、uits . 14 Figure 4-2: Hybrids procurement flow . 15 Figure 8-1: Flow of Procurement of Active and Passive components . 26 Figure 10-1: Screening test sequence . 37 Figure 12-1: Lot acceptance tests for the first production lot manufactured by a category 2 manufacturer 51 Tables Table 8-1: Sample siz
24、e and acceptance criteria for LAT of passive chips 29 Table 8-2: Sample size and acceptance criteria for user LAT on active chips . 31 Table 10-1: Test conditions for constant acceleration and mechanical shock . 40 Table 12-1: Sample size for hybrids lot acceptance tests . 47 Table 12-2: Lot accepta
25、nce tests and sample size . 47 Table 12-3: Production acceptance tests and sampling 50 Table 12-4: Definition of tests . 51 BS EN 16602-60-05:2014EN 16602-60-05:2014 (E) 6 Foreword This document (EN 16602-60-05:2014) has been prepared by Technical Committee CEN/CLC/TC 5 “Space”, the secretariat of w
26、hich is held by DIN. This standard (EN 16602-60-05:2014) originates from ECSS-Q-ST-60-05C Rev. 1. This European Standard shall be given the status of a national standard, either by publication of an identical text or by endorsement, at the latest by March 2015, and conflicting national standards sha
27、ll be withdrawn at the latest by March 2015. Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CEN and/or CENELEC shall not be held responsible for identifying any or all such patent rights. This document has been prepared under a m
28、andate given to CEN by the European Commission and the European Free Trade Association. This document has been developed to cover specifically space systems and has therefore precedence over any EN covering the same scope but with a wider domain of applicability (e.g. : aerospace). According to the
29、CEN-CENELEC Internal Regulations, the national standards organizations of the following countries are bound to implement this European Standard: Austria, Belgium, Bulgaria, Croatia, Cyprus, Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hun
30、gary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom. BS EN 16602-60-05:2014EN 16602-60-05:2014 (E) 7 Introduction The objective of this Standard is to define
31、 the requirements for the procurement of hybrid microcircuits for use in space systems. This Standard covers the following requirement domains: Validation procedure for a hybrid microcircuit manufacturer. Design of hybrid microcircuits. Procurement of active and passive chips. Procurement of materia
32、ls and piece parts. Screening of hybrid microcircuit lots. Lot acceptance tests for hybrid microcircuits. Customer involvement, key inspection points. Repair provisions. Hybrids and data package delivery. BS EN 16602-60-05:2014EN 16602-60-05:2014 (E) 8 1 Scope The procurement requirements for hermet
33、ic hybrid microcircuits for use in space projects are defined in this Standard. This Standard also provides details concerning the documentation requirements and the procedures relevant to obtain approval for the use of hybrid microcircuits in the fabrication of space systems and associated equipmen
34、t. The provisions of this Standard apply to all participants in the production of space systems, at all levels and are applicable to manned and unmanned spacecraft, launchers, satellites, payloads, experiments, and their corresponding organizations. This standard may be tailored for the specific cha
35、racteristic and constraints of a space project in conformance with ECSS-S-ST-00. BS EN 16602-60-05:2014EN 16602-60-05:2014 (E) 9 2 Normative references The following normative documents contain provisions which, through reference in this text, constitute provisions of this ECSS Standard. For dated r
36、eferences subsequent amendments to, or revisions of any of these publications do not apply. However, parties to agreements based on this ECSS Standard are encouraged to investigate the possibility of applying the most recent editions of the normative documents indicated below. For undated references
37、 the latest edition of the publication referred to applies. EN reference Reference in text Title EN 16601-00-01 ECSS-S-ST-00-01 ECSS system Glossary of terms EN 16602-60 ECSS-Q-ST-60 Space product assurance Electrical, electronic and electromechanical (EEE) components EN 16602-60-12 ECSS-Q-ST-60-12
38、Space product assurance - Design, selection, procurement and use of die form monolithic microwave integrated circuits (MMICs) EN 16602-30-11 ECSS-Q-ST-30-11 Space product assurance Derating - EEE components EN 16602-70 ECSS-Q-ST-70 Space product assurance Materials, mechanical parts and processes MI
39、L-STD-883G Tests methods and procedures for microelectronics MIL-STD-750D Test method standard for semiconductor devices ESCC 20600 Preservation, packaging and despatch of ESCC components ESCC 2043000 Internal visual inspection of capacitors ESCC 2044000 Internal visual inspection of resistors ESCC
40、2045010 Internal visual inspection of microwave devices ESCC 2049010 Internal visual inspection of monolithic microwave devices ESCC 2053000 External visual inspection of capacitors ESCC 2054000 External visual inspection of resistors ESCC 2093000 Radiographic inspection of capacitors ESCC 2094000 R
41、adiographic inspection of resistors BS EN 16602-60-05:2014EN 16602-60-05:2014 (E) 10 3 Terms, definitions and abbreviated terms 3.1 Terms from other standards For the purpose of this standard, the terms and definitions of ECSS-S-ST-00-01 apply. 3.2 Terms specific to the present standard 3.2.1 approv
42、ing authority organization supplying approval certificate NOTE In Europe the approving authority for space systems components is the ESCC system. 3.2.2 category 1 manufacturer manufacturer with a technology domain approved or pending approval by the approving authority 3.2.3 category 2 manufacturer
43、manufacturer with a technology domain not approved by the approving authority 3.2.4 EM quality level hybrid hybrid manufactured with the same parts (types, sources and design), materials, and processes as flight models but with acceptance of a lower quality level for visual inspection or screening d
44、uring procurement or manufacturing 3.2.5 hybrid see “hybrid microcircuit” 3.2.6 hybrid circuit see “hybrid microcircuit” 3.2.7 hybrid microcircuit combination of elements (interconnection substrate, added active or passive chips) sealed inside a package in order to perform an electronic function NOT
45、E 1 Interconnection substrate (e.g. thick film, thin film, co-fired, DBC) can be with or without integrated BS EN 16602-60-05:2014EN 16602-60-05:2014 (E) 11 passive components (e.g. resistors, inductors, capacitors). NOTE 2 Active parts can be monolithic or discrete, chips or packaged components. NO
46、TE 3 Electronic functions that are performed by hybrids include digital or analog, low frequency or radiofrequency, low power or high power functions. These functions may be mixed according to the application. NOTE 4 The terms “hybrid circuits” and “hybrids” are synonymous for “Hybrid microcircuits”
47、. 3.2.8 process identification document document that defines the approved technology domain, the reference of approval status, and one that freezes the configuration of the manufacturing line and the approved domain 3.2.9 process performance index the long-term capability of the process which refle
48、cts the process centering and the variability with respect to specification requirements 3.2.10 production lot number of units of a single device type manufactured on the same production line using the same production techniques, in one uninterrupted period, according to the same component or part d
49、esign and having the same chips lots and the same materials 3.2.11 representative production lot lot that represents several production lots grouping products from the same family, covered by one SEC type, manufactured on the same production line, in one uninterrupted period, using the same materials and processes 3.2.12 standard evaluation circuit device that represents a family of products using the same materials and processes and which is processed on the same production line with the same manufacturing equipment and tools 3.2.13 technology review board
