1、 ENGINEERING MATERIAL SPECIFICATIONDate Action Revisions 2003 09 30 Revised Para 3.0 inserted; para 3.6 and 4 deleted 1978 07 13 Metricated and Retyped CF4H-RD567168-24 1975 05 15 Released CF6E-DR760799 Printed copies are uncontrolled Copyright 2003, Ford Global Technologies, Inc. Page 1 of 1 COPPER
2、 FOIL, FLEXIBLE PRINTED CIRCUIT ESF-M6A92-A 1. SCOPE The material defined by this specification is an electrodeposited copper foil suitable for use as the electrical conductor for printed circuits. 2. APPLICATION This specification was released originally for material used as the conductor for the f
3、lexible printed circuit used in the instrument cluster. 3. REQUIREMENTS 3.0 STANDARD REQUIREMENTS FOR PRODUCTION MATERIALS Material suppliers and part producers must conform to the Companys Standard Requirements For Production Materials (WSS-M99P1111-A). 3.1 MATERIAL DESCRIPTION The material must be
4、 a high density electrodeposited copper. 3.2 CHEMICAL COMPOSITION Copper plus silver 99.8 min 3.3 SURFACE ROUGHNESS, max 17 in AA (0.43 mm) 3.4 SURFACE TREATMENT The foil shall have an anti-tarnish treatment compatible with the subsequent bonding or laminating process and which will not significantly increase the electrical resistance between the foil and any component. 3.5 BULGE HEIGHT, min 0.180 in (4.57 mm) (Appendix to SAE J771)
