FORD WSK-M3G204-A1-2010 LABEL PLASTIC SHEET PRESSURE SENSITIVE TO BE USED WITH FORD WSS-M99P1111-A 《压敏式塑料薄膜标签 与标准FORD WSS-M99P1111-A一起使用 [使用 FORD WSS-M99P41-A10 FORD WSS-M99P41.pdf

上传人:roleaisle130 文档编号:750577 上传时间:2019-01-14 格式:PDF 页数:2 大小:24.41KB
下载 相关 举报
FORD WSK-M3G204-A1-2010 LABEL PLASTIC SHEET PRESSURE SENSITIVE  TO BE USED WITH FORD WSS-M99P1111-A  《压敏式塑料薄膜标签  与标准FORD WSS-M99P1111-A一起使用  [使用 FORD WSS-M99P41-A10 FORD WSS-M99P41.pdf_第1页
第1页 / 共2页
FORD WSK-M3G204-A1-2010 LABEL PLASTIC SHEET PRESSURE SENSITIVE  TO BE USED WITH FORD WSS-M99P1111-A  《压敏式塑料薄膜标签  与标准FORD WSS-M99P1111-A一起使用  [使用 FORD WSS-M99P41-A10 FORD WSS-M99P41.pdf_第2页
第2页 / 共2页
亲,该文档总共2页,全部预览完了,如果喜欢就下载吧!
资源描述

1、 ENGINEERING MATERIAL SPECIFICATIONDate Action Revisions 2010 06 22 N-STATUS Replaced by WSS-M99P41-A10/A72 G. Eaton, NA 2006 01 31 Revised Inserted 3.0; Deleted 3.1, 3.2, 3.3, 3.10, 4 1991 08 01 Released EPOOE01089487000 KW Printed copies are uncontrolled Copyright 2010, Ford Global Technologies, L

2、LC Page 1 of 2 LABEL, PLASTIC SHEET, PRESSURE SENSITIVE WSK-M3G204-A1 LABEL, PLASTIC SHEET, PRESSURE SENSITIVE, NOT REMOVABLE WSK-M3G204-A2 NOT TO BE USED FOR NEW DESIGN 1. SCOPE The materials defined by these specifications are plastic labels. The back side of the labels is coated with a pressure s

3、ensitive adhesive, the surface is color printed according to Engineering Drawing and covered by a clear lacquer. The adhesive film is protected by release paper or polymer liner. WSK-M3G204-A2 is designed to be destroyed when removed. 2. APPLICATION These specifications were released originally for

4、certification labels fixed permanently to painted surfaces. 3. REQUIREMENTS 3.0 STANDARD REQUIREMENTS FOR PRODUCTION MATERIALS Material suppliers and part producers must conform to the Companys Standard Requirements For Production Materials (WSS-M99P1111-A). 3.4 APPEARANCE The labels shall be free o

5、f streaks, blisters, wrinkles, ragged edges or any other surface imperfections which make them unsuitable for the intended usage. Color and design shall be as specified on the Engineering Drawing. 3.5 SETTING TIME FOR NORMAL HANDLING The labels shall set sufficiently to permit normal handling immedi

6、ately after application. 3.6 THICKNESS 0.065 - 0.1 mm or as (ASTM D 1000) on Engineering Drawing Thickness of label plus adhesive without release paper or liner. 3.7 PREPARATION OF TEST SPECIMENS Prepare painted test panels according to FLTM BI 103-02, Method C. Apply the labels and press firmly usi

7、ng a rubber roller or equivalent. Condition per para 3.3. 3.8 ADHESION No loss of adhesion, no peeling, blistering or cracking permitted. The print shall not be removed by wiping with cleaning fuel. ENGINEERING MATERIAL SPECIFICATIONWSK-M3G204-A1/A2 Printed copies are uncontrolled Copyright 2010, Fo

8、rd Global Technologies, LLC Page 2 of 2 Slight color change may be accepted if the printing is still visible after test end. Labels per WSK-M3G204-A2 must be destroyed when removed, on original and on samples aged per 3.8.1, 3.8.2 and 3.8.3. Test Method: Adhesion shall be evaluated on original and a

9、ged test specimens prepared according to para 3.7. 3.8.1 Heat Aging (2 h at 70 +/- 2 C) Evaluation after cooling down to room temperature. 3.8.2 Paint Repair Oven (10 minutes at 100 +/- 2 C) Evaluation after cooling down to room temperature. 3.8.3 Cold Aging (4 h at -30 +/- 2 C) Evaluation after war

10、ming up to room temperature. 3.8.4 Environmental Cycling (FLTM BQ 104-07, Procedure 5, 5 cycles) Evaluation after 1 h conditioning at room temperature. 3.8.5 Immersion into Gasoline (Fuel per FLTM BO 101-05, 5 minutes at 23 +/- 2 C) Evaluation immediately after removal from the fuel. 3.8.6 Immersion

11、 into Engine Oil (ASTM D 471, Oil No. 3, 16 h at 23 +/- 2 C) After the immersion, the labels shall be wiped with cleaning fuel. Evaluation without reconditioning. 3.8.7 Accelerated Weathering 500 h (SAE J 1960) Evaluation after 1 h conditioning at room temperature. 5. GENERAL INFORMATION The informa

12、tion below is provided for clarification and assistance in meeting the requirements of this specification. 5.1 MATERIAL REFERENCE All related materials used for approval of labels according to this specification, e.g., paint materials or substrates, shall be noted in the Initial Sample Report of the label.

展开阅读全文
相关资源
猜你喜欢
  • EN 60749-10-2002 en Semiconductor Devices - Mechanical and Climatic Test Methods Part 10 Mechanical Shock《半导体器件 机械和气候试验方法 第10部分 机械振动[替代 EN 60749 CENELEC]》.pdf EN 60749-10-2002 en Semiconductor Devices - Mechanical and Climatic Test Methods Part 10 Mechanical Shock《半导体器件 机械和气候试验方法 第10部分 机械振动[替代 EN 60749 CENELEC]》.pdf
  • EN 60749-11-2002 en Semiconductor Devices Mechanical and Climatic Test Methods Part 11 Rapid Change of Temperature Two-Fluid-Bath Method《半导体器件 机械和气候试验方法 第11部分 温度的急速变化 双液电镀槽法 IEC 60.pdf EN 60749-11-2002 en Semiconductor Devices Mechanical and Climatic Test Methods Part 11 Rapid Change of Temperature Two-Fluid-Bath Method《半导体器件 机械和气候试验方法 第11部分 温度的急速变化 双液电镀槽法 IEC 60.pdf
  • EN 60749-12-2002 en Semiconductor Devices Mechanical and Climatic Test Methods Part 12 Vibration Variable Frequency《半导体器件 机械和气候试验方法 第12部分 振动 可变频率 部分替代BS EN 60749-12-2002+A1-2000+A2.pdf EN 60749-12-2002 en Semiconductor Devices Mechanical and Climatic Test Methods Part 12 Vibration Variable Frequency《半导体器件 机械和气候试验方法 第12部分 振动 可变频率 部分替代BS EN 60749-12-2002+A1-2000+A2.pdf
  • EN 60749-13-2002 en Semiconductor Devices Mechanical and Climatic Test Methods Part 13 Salt Atmosphere《半导体器件 机械和气候试验方法 第13部分 盐性环境 IEC 60749-13-2002 部分替代 EN 60749 1999+A1-2000 和 A2-.pdf EN 60749-13-2002 en Semiconductor Devices Mechanical and Climatic Test Methods Part 13 Salt Atmosphere《半导体器件 机械和气候试验方法 第13部分 盐性环境 IEC 60749-13-2002 部分替代 EN 60749 1999+A1-2000 和 A2-.pdf
  • EN 60749-14-2003 en Semiconductor devices - Mechanical and climatic test methods Part 14 Robustness of terminations (lead integrity)《半导体器件 机械和气候试验方法 第14部分 终端装置的坚固性(引线牢固性)IEC 60749-.pdf EN 60749-14-2003 en Semiconductor devices - Mechanical and climatic test methods Part 14 Robustness of terminations (lead integrity)《半导体器件 机械和气候试验方法 第14部分 终端装置的坚固性(引线牢固性)IEC 60749-.pdf
  • EN 60749-15-2010 en Semiconductor devices - Mechanical and climatic test methods - Part 15 Resistance to soldering temperature for through-hole mounted devices (Incorporating corri.pdf EN 60749-15-2010 en Semiconductor devices - Mechanical and climatic test methods - Part 15 Resistance to soldering temperature for through-hole mounted devices (Incorporating corri.pdf
  • EN 60749-16-2003 en Semiconductor devices Mechanical and climatic test methods Part 16 Particle impact noise detection (PIND)《半导体器件 机械和气候试验方法 第16部分 粒子碰撞噪声探测(PIND)IEC 60749-16-2003》.pdf EN 60749-16-2003 en Semiconductor devices Mechanical and climatic test methods Part 16 Particle impact noise detection (PIND)《半导体器件 机械和气候试验方法 第16部分 粒子碰撞噪声探测(PIND)IEC 60749-16-2003》.pdf
  • EN 60749-17-2003 en Semiconductor devices Mechanical and climatic test methods Part 17 Neutron irradiation《半导体器件 机械和气候试验方法 第17部分 中子辐照 IEC 60749-17-2003》.pdf EN 60749-17-2003 en Semiconductor devices Mechanical and climatic test methods Part 17 Neutron irradiation《半导体器件 机械和气候试验方法 第17部分 中子辐照 IEC 60749-17-2003》.pdf
  • EN 60749-18-2003 en Semiconductor devices - Mechanical and climatic test methods Part 18 Ionizing radiation (total dose)《半导体器件 机械和气候试验方法 第18部分 电离辐射(总剂量) IEC 60749-18-2002》.pdf EN 60749-18-2003 en Semiconductor devices - Mechanical and climatic test methods Part 18 Ionizing radiation (total dose)《半导体器件 机械和气候试验方法 第18部分 电离辐射(总剂量) IEC 60749-18-2002》.pdf
  • 相关搜索

    当前位置:首页 > 标准规范 > 国际标准 > 其他

    copyright@ 2008-2019 麦多课文库(www.mydoc123.com)网站版权所有
    备案/许可证编号:苏ICP备17064731号-1