1、GEIA ENGINEERING BULLETIN The Next Generation of Systems Engineering: A Report by the GEIA G-47 Systems Engineering Panel GEIA-SE-000 1 September 03 GOVERNMENT ELECTRONICS AND INFORMATION TECHNOLOGY ASSOCIATION A Sector of the Electronic Industries Alliunc Copyright Government Electronics Ellen Purd
2、y, FCS Program Office, DARPA . 84 Guiding Principals for Next Generation SE Tools, Mark Sampson, EDS PLM Solutions, Inc. . . 89 Supporting Next Generation Systems Engineering: The CORE Engineering Environment, Joe Skipper, Vitech Corporation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3、 . . . . . . . . . . . . . . . . . . . . . . . . . . . 95 Modeling and Simulation using AP233, Jim Schier, Northrop Grumman Information Technology TASC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4、. . . . . . . . . . . . . . . . . . . . . . . . . 1 O0 Methodology for Modeling and Analysis of Threat Models, Alan Washburn, Dynetics, Inc. . 107 Deep Culture Social Engineering, Sam Alessi, DOE Idaho National Engineering and Environmental Laboratory, University of Idaho . . . . . . . . . . . . . .
5、 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 O9 Transformation: Putting It All Together. . 1 15 Conclusion . . . 1 18 Acronyms . 1 18 vii Copyright Government Electronics andor Lower Risk, that is, have a higher probability that delivered systems meet stakeh
6、olders intentions in terms of cost, schedule, and performance. Figure 1 shows this by using the figure fi-om ANSVEM-632, Processesfor Engineering a System, depicting the relationships between the major processes for engineering a system. 1-b Faster 4-1 CR a o 0 CB I “1 L Cheaper Acquisition Request
7、Figure 1. Objectives of the Next Generation of Systems Engineering Capabilities 1 Copyright Government Electronics Submit these models as a mock Request For Proposals (RFP); Respond to the mock RFP with state-based models simulating contractor input; and Participate in a Government/Contractor Lesson
8、s Learned activity. On another front, recent research shows that “touchless manufacturing”, wherein functional hardware may be deposited using laser and e-beam technologies, is within the 5-year horizon. The Agile program is sponsoring application of this research. The Agile program is funding resea
9、rch on engineering design tools that have impact on design methods similar in scope to the arrival of Computer Aided Design (CAD) tools. These will short-cut detailed design and go immediately fi-om early models to manufactured item. Figure 1 O shows the concept for Shape Deposition Manufacturing (S
10、DM) and some of the results achieved using laser deposition of various materials. This technique can create components of any possible 3D shape with included void spaces. Materials can be changed at discrete points or varied continuously throughout the deposition process enabling a degree of control
11、 over materials properties previously unobtainable. Applying SDM is another next step being taken through development of CUBESat. This small (12 cm) spacecraft is being built by students at Stanford University and will be launched via the Shuttle and Expendable Launch Vehicles through the Space Test
12、 Program. Lockheed Martin will build system models of the student-designed CUBESat. Stanford will build CAD models of the CUBESat bus with embedded power, data and thermal channels. The CAD models will be shape-deposited by Lockheed Martin. Stanford will build a unique, shape-deposited solar array m
13、ount and integrate the CUBESat with Lockheed Martins assistance. The first Agile spacecraft is planned for launch in 2003. 14 Copyright Government Electronics & Information Technology Association Reproduced by IHS under license with GEIA Not for ResaleNo reproduction or networking permitted without license from IHS-,-,-
