1、EIA JESDL2-b 91 3234b00 0078257 9 H I .-,- =, *- Reproduced By GLOBAL =- ENGINEERING DOCUMENTS - _L 3 With The Pennittion of EIA Under Royalty Agreement -= JEDEC STANDARD Interface .Standard for Semicustom Integrated Circuits JESDI 2-6 MARCH 1991 ELECTRONIC INDUSTRIES ASSOCIATION ENGINEERING DEPARTM
2、ENT I - - OMaind fmm - - - GLOBAL ENGIAEERIRG OOCUMEAIS - 3 2M)5 YCGaw Avr. hviw. CA 92714 -. - (714) 261-1455 (100) 854-7179 - - EIA JESD12-6 91 W 3234b00 0078258 O 1 NOTICE JEDEC Standards and Publications contain material that has been prepared, progressively reviewed, and approved through the JE
3、DEC Council level and subsequently reviewed and approved by the EIA General Counsel. JEDEC Standards and Publications are designed to sewe the public interest through eliminating misunderstandings between manufacturers and purchases, facilitating interchangeability and improvement of products, and a
4、ssisting the purchaser is selecting and obtaining with minimum delay the proper product for his particular need. Existence of such standards shall not in any respect preclude any member or nonmember of JEDEC from manufacturing or selling products not conforming to such standards nor shall the existe
5、nce of such standards preclude their voluntary use by those other than EIA members, whether the standard is to be used either domestically or internationally. JEDEC Standards and Publications are adopted without regard to whether their adoption may involve patents or articles, materials, or processe
6、s. By such action, JEDEC does not assume any liability to any patent owner, nor does it assume any obligation whatever to parties adopting the JEDEC Standards or Publications. The .information included in JEDEC Standards and Publications represents a sound approach to product specification and appli
7、cation, principally from the solid state device manufacturer viewpoint. Within the JEDEC organization there are procedures whereby a JEDEC Standardor Publication may be further processed and ultimately became an HA Standard. Inquiries, comments and suggestions relative to the content of this JEDEC S
8、tandard should be addressed to the JEDEC Executive Secretary at EIA Headquarters, 2001 Pennsylvania Ave., N.W., Washington, D.C. 2OO6. COPYRIGHT 1991 Published by I. ELECTRONIC INDUSTRIES ASSOCIATION Engineering Department 2001 Pennsylvania Ave., N.W. Washington, D.C. 2OOO6 PRICE: Please refer to th
9、e current Catalog of EIA a fan provides needed air flow. Air flow is measured using a hot-wire anemometer: air temperature is measured using an iron-constantan thermocouple which is particularly sensitive over the measuring temperature range of usual interest. The thermocouple is positioned between
10、the fan and he packaged unit. Measurements are typically made at room temperature and at a series of air velocities. Measurements are made with the assembly at the power in question, with the calibrated diode providing the value of the junction temperature. Example: where: TJ = junction temperature
11、TA = ambient temperature Pd = power dissipation I* EIA JESDL2-b 91 3234b00 O078268 3 i D RELATED EINJEDEC PUBLICATIONS In addition to this JEDEC Standard, the following documents are considered applicable: JESD12-4 JESD12-5 JESD99 Method of specification of Performance Parameters for CMOS Sernicusto
12、rn Integrated Circuits $1 1 .O0 (April 1987) Design for Testability Guidelines $33.00 (August 1988) Glossary of Microelectronic Terms, Definitions, and Symbols $26.00 (June 1985) For a complete list of EINJEDEC Standards and Publications contact: EINJ E D EC Standard Sales 2001 Pennsylvania Avenue, NW Washington, D.C. 20006 Tel. (202) 457-4966
