1、 KSKSKSKSKSKSKSK KSKSKS KSKSK KSKS KSK KS KS C IEC 60862 1 1： KS C IEC 60862 1： 2007(2012 ) 2007 11 30 http:/www.kats.go.krKS C IEC 60862 1： 2007 : ( ) ( ) ( ) : (http:/www.standard.go.kr) ： ：2007 11 30 ：2012 12 31 2012-0857 ： ： ( 02-509-7294) (http:/www.kats.go.kr). 10 5 , . KS C IEC 60862 1： 2007
2、i .1 1 1 1.1 .1 1.2 .1 1.3 .2 2 , , .2 2.1 .2 2.2 3 2.3 .11 3 13 3.1 13 3.2 13 4 13 4.1 .13 4.2 14 4.3 14 4.4 14 4.5 14 4.6 14 4.7 .15 4.8 .15 4.9 16 4.10 (screening) .16 4.11 .16 4.12 (lots) 16 4.13 .16 4.14 .16 4.15 16 5 17 5.1 .17 5.2 .17 5.3 18 5.4 .18 5.5 .18 5.6 .26 5.7 .31 32 KS C IEC 60862 1
3、： 2007 (2012 ) 1： Surface acoustic wave(SAW) filters of assessed quality Part 1： Generic specification 2003 2 IEC 60862 1, Surface acoustic wave(SAW) filters of assessed quality Part 1： Generic specification , . 1 1.1 . 1.2 . . ( ) . KS A ISO 1000： 2002, (SI) KS C IEC 60027 1, 1： KS C IEC 60027 2, 2
4、： KS C IEC 60027 3, 3： KS C IEC 60027 4, 4： KS C IEC 60068 2 20： 2007, 2 20： T： KS C IEC 60068 2 58： 2007, 2 58： Td：(SMD) , KS C IEC 60068 2 78： 2002, ( ) KS C IEC 60695 2 2： 2002, 2： 2： KS C IEC 61000 4 2： 2005, (EMC) 4： 2： IEC 60050 561： 1991, International Electrotechnical Vocabulary(IEV) Chapter
5、 561： Piezoelectric devices for frequency control and selection IEC 60068 1： 1988, Environmental testing Part 1： General and guidance IEC 60068 2 1： 1990, Environmental testing Part 2： Tests Tests A： Cold KS C IEC 60862 1： 2007 2 IEC 60068 2 2： 1974, Environmental testing Part 2： Tests Tests B： Dry
6、heat IEC 60068 2 6： 1995, Environmental testing Part 2： Tests Test Fc： Vibration(sinusoidal) IEC 60068 2 7： 1983, Environmental testing Part 2： Tests Test Ga： Acceleration, steady state IEC 60068 2 13： 1983, Environmental testing Part 2： Tests Test M： Low air pressure IEC 60068 2 14： 1984, Environme
7、ntal testing Part 2： Tests Test N： Change of temperature IEC 60068 2 17： 1994, Environmental testing Part 2： Tests Test Q： Sealing IEC 60068 2 21： 1999, Environmental testing Part 2 21： Tests Test U： Robustness of terminations and integral mounting devices IEC 60068 2 27： 1987, Environmental testing
8、 Part 2： Tests Test Ea and guidance： Shock IEC 60068 2 29： 1987, Environmental testing Part 2： Tests Test Eb and guidance： Bump IEC 60068 2 30： 1980, Environmental testing Part 2： Tests Test Db and guidance： Damp heat, cyclic (12 12 hour cycle) IEC 60068 2 32： 1975, Environmental testing Part 2： Tes
9、ts Test Ed： Free fall(Procedure 1) IEC 60068 2 45： 1980, Environmental testing Part 2： Tests Test XA and guidance： Immersion in cleaning solvents IEC 60068 2 52： 1996, Environmental testing Part 2： Tests Test Kb： Salt mist, cyclic(sodium chloride solution) IEC 60068 2 64： 1993, Environmental testing
10、 Part 2： Tests Test Fh： Vibration, broad-band random (digital control) and guidance IEC 60122 1： 2002, Quartz crystal units of assessed quality Part 1： Generic specification IEC 60617, Graphical symbols for diagrams IEC 60642： 1979, Piezoelectric ceramic resonators and resonator units for frequency
11、control and selection Chapter I： Standard values and conditions Chapter II： Measuring and test conditions IEC QC 001001： 2000, IEC Quality Assessment System for Electronic Components(IECQ) Basic Rules IEC QC 001002 2： 1998, IEC Quality Assessment System for Electronic Components(IECQ) Rules of Proce
12、dure Part 2： Documentation IEC QC 001002 3： 1998, IEC Quality Assessment system for Electronic Components(IECQ) Rules of Procedure Part 3： Approval Procedures IEC QC 001005： 2000, Register of Firms, Products and Services approved under the IECQ System, including ISO 9000 1.3 , . ( IEC) . 2 , , 2.1 ,
13、 , , . KS C IEC 60862 1： 2007 3 KS C IEC 60027 IEC 60050 561 IEC 60617 IEC 60642 IEC 60122 1 KS A ISO 1000 2.2 . 2.2.1 2.2.1.1 (Surface Acoustic Wave： SAW) , 2.2.1.2 (Surface Acoustic Wave filter： SAW filter) . , . 2.2.1.3 (power flow vector) (poynting) , 2.2.1.4 (propagation vector) 2.2.1.5 (power
14、flow angle) 2.2.1.6 (SAW beam steering) 0 2.2.1.7 (SAW diffraction) (wave front) ( ) 2.2.1.8 (SAW coupling coefficient： ks2) . ss2s2vvk= KS C IEC 60862 1： 2007 4 vs： vs ： vs/vs： 2.2.1.9 (InterDigital Transducer： IDT) . . 2.2.1.10 (UniDirectional interdigital Transducer： UDT) 2.2.1.11 (multiphase tra
15、nsducer) . . 2.2.1.12 (finger) 2.2.1.13 (dummy finger) 2.2.1.14 (split finger) 2.2.1.15 (bus bar) 2.2.1.16 (weighted-response transducer) . 2.2.1.17 2.2.1.22 2.2.1.17 (finger overlap or source strength) 2.2.1.18 (apodization) 2.2.1.19 (withdrawal weighting) KS C IEC 60862 1： 2007 5 2.2.1.20 (capacit
16、ive weighting) 2.2.1.21 (series weighting) . . 2.2.1.22 (phase weighting) 2.2.1.23 (aperture) 2.2.1.24 (MultiStrip Coupler： MSC) , . 2.2.1.25 (reflector) (groove) 2.2.1.26 (spurious reflections) 2.2.1.27 (Triple Transit Echo： TTE) . . 2.2.1.28 (bulk wave signals) 2.2.1.29 ( ) feedthrough signals(sig
17、nals of electromagnetic interference) 2.2.1.30 (suppression corrugation) 2.2.1.31 (acoustic absorber) KS C IEC 60862 1： 2007 6 2.2.1.32 (shielding electrode) 2.2.1.33 (Interdigitated InterDigital Transducer： IIDT) 3 . , (IIDT multi-IDT) IDT . 2.2.2 (response characteristics) ( 1 ) 2.2.2.1 (nominal f
18、requency) 2.2.2.2 (center frequency) 2.2.2.3 (reference frequency) 2.2.2.4 (cut-off frequency) 2.2.2.5 (total power loss) 2.2.2.6 (insertion attenuation) 2.2.2.7 (nominal insertion attenuation) 2.2.2.8 (relative attenuation) 2.2.2.9 (pass band) KS C IEC 60862 1： 2007 7 2.2.2.10 (pass bandwidth) 2.2.
19、2.11 (pass band ripple) 2.2.2.12 (TTE ripple) 2.2.2.13 (minimum insertion attenuation) 2.2.2.14 (maximum insertion attenuation) 2.2.2.15 (stop band) 2.2.2.16 (stop bandwidth) 2.2.2.17 (shape factor) 2.2.2.18 (group delay) 2.2.2.19 (nominal group delay) 2.2.2.20 (group delay distortion) 2.2.2.21 (tra
20、p frequency) KS C IEC 60862 1： 2007 8 2.2.2.22 (trap attenuation) 2.2.2.23 (transition band) 2.2.2.24 (reflection coefficient) Za Zb , . babaZZZZ+ Za： Zb： 2.2.2.25 (return attenuation) . dBlog20babaZZZZ+2.2.2.26 (reflected wave signal suppression) 2.2.2.27 (feedthrough signal suppression) 2.2.2.28 (
21、unwanted response) 2.2.2.29 (input level) , , 2.2.2.30 (output level) , , 2.2.2.31 (nominal level) , , KS C IEC 60862 1： 2007 9 2.2.2.32 (input impedance) , 2.2.2.33 (output impedance) , 2.2.2.34 (terminating impedance) 2.2.2.35 (available power) 2.2.2.36 (reference temperature) . (252) 2.2.2.37 (op
22、erating temperature range) 2.2.2.38 (operable temperature range) 2.2.2.39 (storage temperature range) . . 2.2.2.40 (roll-off rate) (rise-up) . , . 2.2.2.41 (intermodulation distortion) ( ) 2.2.3 2.2.3.1 (transversal filter) . . KS C IEC 60862 1： 2007 10 2.2.3.2 (frequency symmetrical filter) 2.2.3.3
23、 (frequency asymmetrical filter) 2.2.3.4 (dispersive filter) 2.2.3.5 (comb filter) 2.2.3.6 (resonator filter) 2.2.3.7 (ladder filter) 2.2.3.8 (lattice filter) 4 . , ( ). . KS C IEC 60862 1： 2007 11 1 2.3 . 2.3.1 2.3.1.1 RF 150 MHz 280 MHz 300 MHz 800 MHz 900 MHz 1 500 MHz 1 900 MHz 2 400 MHz 2.3.1.2
24、 IF 70 MHz 130 MHz 250 MHz 400 MHz 2.3.1.3 IF 32.7 MHz 36.875 MHz 37.0 MHz 38.0 MHz 38.9 MHz 39.5 MHz 45.75 MHz 58.75 MHz 402.78 MHz 479.5 MHz 2.3.2 IF 1 dB 3 dB 5 dB 6 dB 2.3.3 30 dB 35 dB 40 dB 45 dB KS C IEC 60862 1： 2007 12 2.3.4 () 40 85 30 85 20 75 20 70 10 60 0 60 , 60 125 . 2.3.5 40/085/56(
25、IEC 60068 1 A .)： , 40 85 . 20/085/21( IEC 60068 1 A .)： 2.3.6 400 m/s2 (4 00010) (5.6.6 ). 6 ms 2.3.7 (sinusoidal) 10 Hz 55 Hz 0.75 mm ( ) 55 Hz 500 Hz 55 Hz 2 000 Hz 100 m/s2( ) 1 octave/min 3 30 (5.6.7 ) 10 Hz 55 Hz 1.5 mm ( ) 55 Hz 2 000 Hz 200 m/s2( ) 1 octave/min 3 30 (5.6.7 ) 20 Hz 2 000 Hz (
26、19.2 m/s2)2/Hz 196 m/s2 1 octave/min 3 30 (5.6.7 ) 20 Hz 2 000 Hz (48 m/s2)2/Hz 314 m/s2 1 octave/min 3 30 (5.6.7 ) KS C IEC 60862 1： 2007 13 20 Hz 2 000 Hz (19.2 m/s2)2/Hz 62 m/s2 1 octave/min 3 30 (5.6.7 ) 2.3.8 6 1 000 m/s2 . , (half sine pulse) (5.6.8 ) 2.3.9 10 1Pa cm3/s(10 6bar cm3/s) 10 3Pa cm3/s(10 8
