1、 KSKSKSKSKSKSKSK KSKSKS KSKSK KSKS KSK KS KS C IEC PAS 62239 KS C IEC PAS 62239:2008 2008 11 28 http:/www.kats.go.krKS C IEC PAS 62239:2008 : ( ) ( ) FITI ( ) : (http:/www.standard.go.kr) ： ： 2003 8 27 ： 2008 11 28 2008-0810 ： ： ( 025097294) (http:/www.kats.go.kr). 10 5 , . KS C IEC PAS 62239:2008 i
2、 ii 0 1 1 1 2 1 2.1 2 2.2 2 3 .3 4 5 4.1 .6 4.2 .8 4.3 .9 4.4 11 4.5 11 4.6 12 4.7 14 5 .15 5.1 .15 5.2 16 5.3 16 5.4 .16 5.5 16 5.6 16 5.7 16 5.8 16 KS C IEC PAS 62239:2008 ii (KS) (IS) 2001 1.0 IEC PAS 62239, Electronic component management plans , . . , , . , , . KS C IEC PAS 62239:2008 Electroni
3、c component management plans 0 , , ( .) . , , . . . , . . . 1 . . . , , , , , , , , , 2 KS C IEC PAS 62239:2008 2 2.1 . 2.2 KS C IEC 61340 5-1： 2005, 5-1： KS C IEC 61340 5-2： 2005, 5-2： AS 9000, Aerospace basic quality system standard, appendix 1 revised 1998, society of automotive engineers BSI PD
4、6503： 1990, Toxicity of combustion products BSI BS EN 190000, Harmonized system of quality assurance for electronic components, generic specification monolithic integrated circuits CDF AEC Q100, Stress test qualification for automotive-grade integrated circuits, chrysler-delco-ford automotive electr
5、onics council CDF AEC Q101, Stress test qualification for automotive-grade discrete semiconductors, chrysler-delco-ford automotive electronics council CDF AEC Q200, Stress test qualification for automotive-grade passive components, chrysler-delco-ford automotive electronics council CECC EN 190000, H
6、armonized system of quality assurance for electronic components, generic specification monolithic integrated circuits CECC 00114, Rules of procedure quality assessment procedures EIA JESD 22 A112-A, JEDEC standard Test method A112-A, moisture induced stress sensitivity for plastic surface mount devi
7、ces EIA JESD 22 A113-B： 1999, Test method A113-B preconditioning of non-hermetic surface mount devices prior to reliability testing EN 100015 1： 1992, Basic specification Protection of electrostatic sensitive devices Part 1：General requirements EN 100015 2： 1993, Basic specification Protection of el
8、ectrostatic sensitive devices Part 2：Requirements for low humidity conditions EN 100015 3： 1993, Basic specification Protection of electrostatic sensitive devices Part 3：Requirements for clean room area EN 100015 4： 1993, Basic specification Protection of electrostatic sensitive devices Part 4：Requi
9、rements for high-voltage environments EN 100114 1 ： 1996, Rules of procedure 14 Quality assessment procedures Part 1 ： CECC requirements for the approval of an organization EN 100114 6： 1996, Rules of procedure 14 Quality assessment procedures Part 1： Technology approval of electronic component manu
10、facturers EN ISO 9000 1： 1994, Quality management and quality assurance standards Part 1： Guidelines for selection and use EN ISO 9000 2： 1997, Quality management and quality assurance standards Part 2： Generic guidelines for the application of ISO 9001, ISO 9002 and ISO 9003 EN ISO 9000 3： 1997, Qu
11、ality management and quality assurance standards Part 3： Guidelines for the application of ISO 9001： 1994 to the development, supply, installation and maintenance of computer software EN ISO 9000 4： 1993, Quality management and quality assurance standards Part 4： Guide for dependability program mana
12、gement. IEC/CEI 300 1 IEC 107/3/PAS, IEC PAS pre-standard 62240 avionics industry： Use of semiconductor devices outside KS C IEC PAS 62239:2008 3 manufacturers specified temperature ranges IEC 107/4/PAS, Avionics industry： Reliability assessment of electronic equipment IEC QC 001002 3, Rules of proc
13、edures Part 3： Approval procedures IEC QC 001004, Specification list IEC 47A/532/CD： 1998, Draft Integrated circuits, measurement of electromagnetic emissions, 150 kHz to 1 GHz(IEC Project No.6 1967) IPC/JEDEC J STD 020A： 1999, Moisture/reflow sensitivity classification for non-hermetic solid state
14、surface mount devices ISO 9000, Quality management and quality assurance standards ISO 9001, Quality systems Model for quality assurance in design, development, production, installation and servicing MIL PRF 38535, Microcircuit manufacturing, general requirements for MIL PRF 19500, Semiconductor dev
15、ices, general specification for MIL STD 883, Test method standards, microcircuits QS 9000, Quality system requirements Automotive industry S 0001, General requirements for integrated Circuits, stack international 3 . 3.1 (airborne equipment environment) . 3.2 (capable) . 3.3 (certified) , , . 3.4 (c
16、haracterization) 3.5 (component application) 3.6 (component manufacturer) KS C IEC PAS 62239:2008 4 3.7 (component obsolescence management) ( ) . ( ). 3.8 (component qualification) 3.9 (component quality assurance) 3.10 (component selection) 3.11 (dependability) , , 3.12 (distributor) , , , , . 3.13
17、 (electronic component management plan) ECMP . , , , , . 3.14 (electronic components) , (electronic parts) (piece parts) . , , , , , , . 3.15 (electronic equipment) . , , , . 3.16 (normative reference) KS C IEC PAS 62239:2008 5 3.17 (informative reference) . 3.18 (obsolete component) , . 3.19 (risk)
18、 , , 2 . a) ( ) b) ( ) 3.20 (risk management) . , ( ), , , ( ). 3.21 (single event effect) , / . ( ) ( ) . 3.22 (subcontractor) 3.23 (substitute or substitute component) , ( .) 3.24 (documented process) 4 0. , . KS C IEC PAS 62239:2008 6 . 0. , , 0. . , . 3 , 3 . . ( , , ) . . . 4.1 , . 4.1.1 . ( )
19、 , , , , . 4.1.2 . 1 , (EMI) . IEC 47A/532/NP . 2 , , . 4.1.3 (de-rating) , . . KS C IEC PAS 62239:2008 7 . , . , . 4.1.4 . , IEC CA AWG/ 2/DC . 1 . . 2 . , . 3 , , , , . 4.1.5 . , , . , , , , . 4.1.6 . 4.1.7 , , . 1 . (3 ) , , (equipment level) . , . 2 , , . . 4.1.8 KS C IEC PAS 62239:2008 8 (SEU：
20、 single event upset), (SEL： single event latch-up), (SEB： single event burnout) . , . 4.1.9 . 1 , , , , . . 2 BSI PD 6503 1 2 . 4.2 . , IEC CA AWG/2/DC . (4.2.1), (4.2.2), (4.2.3) . 4.2.1 . a) ISO 9000 . b) , , . c) . 4.2.2 4.2.1 . a) , , . b) , , , . . , 3 . c) , KS C IEC PAS 62239:2008 9 , , , . , , . d) (以前 ) . . . MIL PRF 38535, AEC Q100, MIL PRF 19500 . (CMOS), , , 0.5 , 0.35 . , , , .
