1、KSC-STD-132D OCTOBER 24, 2008 Supersedes KSC-STD-132C June 12, 1997 National Aeronautics and Space Administration METRIC/INCH-POUND POTTING AND MOLDING ELECTRICAL CABLE ASSEMBLY TERMINATIONS, STANDARD FOR EAR 99 NO LICENSE REQUIRED The information contained in the document is technical in content, b
2、ut not technical data as defined by the ITAR or the EAR and therefore is EAR 99 NLR; no export license required. (General Prohibition Six (Embargo) applies to all items subject to the EAR, i.e. items on the CCL and within EAR 99 NLR. You may not make an export or re-export contrary to the provi-sion
3、s of part 746 (Embargos and Other Special Controls) of the EAR and 22 CFR part 126.1 of the ITAR.) EDDS #8573 ENGINEERING DIRECTORATEJohn F. Kennedy Space Center KSC FORM 16-12 (REV. 6/95) PREVIOUS EDITIONS ARE OBSOLETE (CG 11/95) Provided by IHSNot for ResaleNo reproduction or networking permitted
4、without license from IHS-,-,-Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-METRIC/INCH-POUND IKSC-STD-132DOCTOBER 24,2008SupersedesKSC-STD-132CJune 12, 1997POTTING AND MOLDINGELECTRICAL CABLE ASSEMBLY TERMINATIONS,STANDARD FORApU!Patrick A. Simpkin
5、s, D.BADirector, Engineering DirectorateJOHN F. KENNEDY SPACE CENTER, NASAProvided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-KSC-STD-132D October 24, 2008
6、CONTENTS 1. SCOPE .1 2. APPLICABLE DOCUMENTS .1 2.1 Government Specifications1 2.2 Government Standards.2 2.3 Government Drawings.2 2.4 Order of Preference3 3. DEFINITIONS.3 4. GENERAL REQUIREMENTS.4 4.1 Materials 4 4.1.1 Epoxy .4 4.1.2 Elastomeric 5 4.1.3 Storage Life of Materials .6 4.1.3.1 Compou
7、nds and Activators6 4.1.3.2 Primers .6 4.1.3.3 Containers 6 4.2 Configuration and Dimensions 6 4.3 Equipment7 4.3.1 Vacuum Chamber 7 4.3.2 Mixing Containers .7 4.3.3 Air-Pressurization Equipment7 4.3.4 Brushes.7 4.3.5 Weighing Equipment .7 4.3.6 Holding Rack .7 4.3.7 Injection Gun .8 4.3.8 Cable Mol
8、ds.8 4.3.9 Thermometer8 4.3.10 Abrasive Paper.8 4.3.11 Metal Spatula .8 4.3.12 Hot Plate.8 4.3.13 Curing Apparatus.8 5. DETAILED REQUIREMENTS9 5.1 Facilities.9 5.1.1 Molding and Potting Area9 5.1.2 Ventilating9 5.1.3 Environmental Conditions .9 5.1.4 Cleanliness .9 5.1.5 Health and Safety Precaution
9、s .10 5.1.6 Inspection.11 KSC-STD-132D_EW_10242008.doc iii Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-KSC-STD-132D October 24, 2008 5.1.7 Personnel11 5.2 Preparation for Potting and Molding .12 5.2.1 Preparation of Cable Assemblies.12 5.2.1.1 Ad
10、hesion 12 5.2.1.1.1 Pretest.12 5.2.1.1.2 Cleaning .12 5.2.1.2 Potting or Molding Over Epoxy 13 5.2.2 Preparation of Connectors13 5.2.2.1 Protection Caps 13 5.2.2.2 Mating Connectors.13 5.2.2.3 Abrading 13 5.2.2.4 Priming.13 5.2.2.5 Assembly14 5.2.3 Preparation of Cable 16 5.2.3.1 Primer.16 5.2.3.2 W
11、icking16 5.2.3.3 Preparation of Neoprene Sheath 16 5.2.3.4 Preparation of PVC Sheath 17 5.2.3.5 Preparation of Polyethylene Sheath.17 5.2.4 Potting Setup18 5.2.5 Mold Preparation .18 5.2.6 Molding Setup19 5.3 Preparation of Compounds 20 5.3.1 Epoxy Potting Compounds 20 5.3.2 Preparation of Elastomer
12、ic Compounds 21 5.3.2.1 Liquid.21 5.3.2.2 Thawing of Premixed, Frozen Cartridges22 5.4 Potting Instructions 22 5.4.1 Inspection.22 5.4.2 Injection .23 5.4.3 Curing 23 5.4.4 Inspection After Curing .24 5.4.4.1 Connectors .24 5.4.4.2 Potting24 5.4.5 Repair.24 5.5 Molding Instructions24 5.5.1 Inspectio
13、n.24 5.5.2 Injection .25 5.5.3 Curing 25 5.5.3.1 Curing Schedule.25 5.5.3.2 Molded Assembly 25 5.5.4 Inspection After Curing .25 5.5.4.1 Inspection Test.25iv Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-KSC-STD-132D October 24, 2008 5.5.4.2 Transp
14、arency26 5.5.4.3 Adhesion 26 5.5.4.4 Connectors .26 5.6 Repair and Rework 27 5.6.1 Repairable Defects.27 5.6.2 Rework Procedure27 5.6.2.1 Minor Cavity27 5.6.2.2 Major Cavities27 5.6.3 Inspection.28 5.7 Reports .28 6. NOTES.28 6.1 Intended Use 28 APPENDIX A. ILLUSTRATIONS 31 FIGURES Figure 1. Definit
15、ion of Potting and Molding Terms .32 Figure 2. MIL-DTL-26482 Connectors (Sheet 1 of 2)33 Figure 3. Shield/Shield Adapter 35 Figure 4. MIL-DTL-5015 Connectors (Sheet 1 of 2)36 Figure 5. MIL-DTL-22992 Connectors (Sheet 1 of 3)38 Figure 6. Banana Plug (Configuration 1) 41 Figure 7. Banana Plug (Configu
16、ration 2) 41 TABLES Table 1. Torque Values for Backshells and Shield Compression Nuts .15 v Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-KSC-STD-132D October 24, 2008 This page intentionally left blank. vi Provided by IHSNot for ResaleNo reproduct
17、ion or networking permitted without license from IHS-,-,-KSC-STD-132D October 24, 2008 ABBREVIATIONS, ACRONYMS, AND SYMBOLS C degree Celsius F degree Fahrenheit APPROX approximately CL centerline conn connector dim dimension FSCM Federal supply code for manufacturers ft foot in inch KSC John F. Kenn
18、edy Space Center m meter MAX maximum MEK methyl-ethyl-ketone MIL military MIN minimum mm millimeter (1 103m) MSDS Material Safety Data Sheet MSFC George C. Marshall Space Flight Center MTG mounting NASA National Aeronautics and Space Administration no. number psi pound per square inch PVC polyvinyl
19、chloride R radius RECP receptacle REF reference REQD required RFI radio frequency interference SPEC specification vii Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-KSC-STD-132D October 24, 2008 STD standard TYP typical .viii Provided by IHSNot for
20、ResaleNo reproduction or networking permitted without license from IHS-,-,-KSC-STD-132D October 24, 2008 POTTING AND MOLDING ELECTRICAL CABLE ASSEMBLY TERMINATIONS, STANDARD FOR 1. SCOPE The purpose of this document is to establish a standard process for potting and molding electrical cable assembly
21、 terminations using epoxy-resin potting compositions and elastomeric dielectric compounds. This standard describes the materials and methods to be used in potting and molding electrical cable assembly terminations with epoxy-resin potting compositions and elastomeric dielectric compounds and describ
22、es the facilities and equipment required to perform the potting and mold-ing processes. The standard dimensional requirements for potting and molding specific types of cable assemblies are specified in Appendix A. 2. APPLICABLE DOCUMENTS The following documents form a part of this document to the ex
23、tent specified herein. When this document is used for procurement, including solicitations, or is added to an existing contract, the specific revision levels, amendments, and approval dates of said documents shall be specified in an attachment to the Solicitation/Statement of Work/Contract. The spec
24、ific revision levels amendments and approval of said documents shall be specified in an attachment to the Solicita-tion/Statement of Work/Contract/Task Order 2.1 Government Specifications John F. Kennedy Space Center (KSC), NASA KSC-E-165 Electrical Ground-Support Equipment Fabrication, Specificatio
25、n for KSC-SPEC-E-0029 Compounds, Potting and Molding, Elastomeric, Specification for George C. Marshall Space Flight Center (MSFC), NASA MSFC-SPEC-222 Resin Compounds, Electrical and Environmental Federal ASTM D 4080 Standard Specification for Trichloroethylene, Tech-nical and Vapor-Degreasing Grade
26、 ASTM D 740 Standard Specification for Methyl Ethyl Ketone 1 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-KSC-STD-132D October 24, 2008 Military MIL-DTL-5015 Connectors, Electrical, Circular Threaded, AN Type General Specification for MIL-DTL-2299
27、2 Connector, Plugs and Receptacles, Electrical, Wa-terproof, Quick Disconnect, Heavy Duty Type, General Specification for SAE-AMS-DTL-23053 Insulation Sleeving, Electrical, Heat Shrinkable, General Specification for MIL-DTL-26482 Connector, Electrical (Circular, Miniature, Quick Disconnect, Environm
28、ent, Resisting), Receptacle and Plugs, General Specification for MIL-DTL-38999 Connectors, Electrical, Circular, Miniature, High Density, Quick Disconnect (Bayonet, Threaded, and Breech Coupling), Environmental, Resistant, Re-movable Crimp and Hermetic Solder Contacts, General Specification for 2.2
29、Government Standards Military MIL-STD-171 Finishing of Metal and Wood Surfaces 2.3 Government Drawings John F. Kennedy Space Center (KSC), NASA 79K14177 Instructions for Potting and Molding Connector As-semblies 79K19600 Electrical Cable Fabrication Requirements George C. Marshall Space Flight Cente
30、r (MSFC), NASA MSFC-SPEC-40M38277 Connectors, Electrical, Circular, Miniature High Density, Environment Resisting, Specification for MSFC-SPEC-40M38298 Connector, Electrical, Special Miniature High Den-sity, Circular, Environment Resisting, 200 Deg. C, Specification for 2 Provided by IHSNot for Resa
31、leNo reproduction or networking permitted without license from IHS-,-,-KSC-STD-132D October 24, 2008 MSFC-SPEC-40M39569 Connectors, Electrical, Miniature High Density, Circular, Environment Resisting, Specification for 75M13302 Connector, Inspection, Specification Copies of specifications, standards
32、, drawings, and publications required by contractors in con-nection with the application of this procedure should be obtained from the procuring activity or as directed by the Contracting Officer. 2.4 Order of Preference In the event of conflict between the documents referenced herein and the conten
33、ts of this docu-ment, the contents of this document shall supersede except where otherwise noted. The applica-ble NASA contract or purchase/procurement order shall take precedence over the contents of this document in the event of conflicting requirements. Nothing in this document supersedes applica
34、-ble laws and regulations unless a specific exemption has been obtained. The Contracting Officer or other authorized Government official shall be notified of any such conflict in documentation. 3. DEFINITIONS For the purpose of this standard, the following definitions shall apply. a. abrade: to remo
35、ve gloss or roughen surface using an abrasive such as sandpaper. b. chlorinated polyethylene (CPE): a rugged thermoplastic polymer with high ul-traviolet (UV), chemical, tear, and ignition resistance. CPE is also an electrical insulator. c. elastomeric: adjective for a rubberlike synthetic polymer,
36、such as silicone rubber and polyurethane. d. epoxy: a durable, corrosion-resistant resin used in coatings. e. mix: to completely blend two or more materials or compounds into one uniform homogenous mass. f. molding: a process for creating a physical form to protect a cable termination from hazards i
37、n the operating environment, as well as to provide strain relief. g. neoprene: a synthetic rubber produced by the polymerization of chloroprene; it is highly resistant to oil, heat, light, and oxidation. h. polyvinyl chloride (PVC): any of a family of polymers derived from vinyl chlo-ride. They have
38、 many uses in various forms, as in rigid plastic pipes and filmy food wrappers. 3 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-KSC-STD-132D October 24, 2008 i. polyethylene: any of several thermoplastic resins made by the polymerization of ethylen
39、e; used in making translucent, lightweight, and tough plastics, fibers, etc. j. potting: a process for creating a physical form to protect a cable connector from hazards in the operating environment, to help insulate bare wire terminations in the connector from each another. k. primer: a precoating
40、material used to facilitate adhesion of the final coat. l. sheath: a protective cable jacket. m. wicking: the action of drawing a liquid or molten material through capillary action. 4. GENERAL REQUIREMENTS 4.1 Materials The following materials, substitutions, or deviations, as approved by the cogniz
41、ant design activ-ity, shall be used. NOTE If shrinkable boots are used, all solder-type or ex-posed connections shall be potted with epoxy, but crimp connections protected by grommets shall not be potted. Where molding with polyurethane, crimp connections protected by grommets shall not be prepotted
42、 with epoxy; and on solder or exposed connections, the prepotting may be omitted if con-tact dimensions and alignment conforming to 75M13302 can be maintained during molding. 4.1.1 Epoxy a. Mold Release: The following, or approved equal, mold-release compounds shall be used: Material Source 225 Mold
43、 Release Valspar Corporation MS-122 Fluorocarbon Miller Stephensen Chemical Company Krytox AR E. I. DuPont DeNemours and Company 4 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-KSC-STD-132D October 24, 2008 b. Potting Materials: Potting compounds s
44、hall conform to the requirements of MSFC-SPEC-222, Type II. c. Primers: Primers shall be of the type recommended by the manufacturer of the material. d. Solvent Cleaners: Solvents used for cleaning purposes shall conform to the re-quirements of ASTM D 740 and ASTM D 4080, as applicable. 4.1.2 Elasto
45、meric a. Methyl-Ethyl-Ketone (MEK): The MEK solvent cleaner shall conform to ASTM D 740. b. Molding and Potting Compounds: Molding and potting compounds conforming to KSC-SPEC-E-0029, Type III (supplied either as two-part units or as a pre-mixed, degassed compound frozen in cartridges), shall be use
46、d. c. Mold Release: The following, or approved equal, mold-release compounds shall be used: Material Source 225 Mold Release Valspar Corporation d. Primers: Primers, when required, shall be as specified in KSC-SPEC-E-0029 or 79K14177. e. Sealant: When required, the following repair and sealant mater
47、ial, or an approved acetic-acid-free equivalent, shall be used: Material Source 3145 RTV Adhesive/Sealant, acetic-acid-free Dow Corning Corporation f. Tape: When required, the following tape, or an approved equivalent, shall be used to build up the dam above the connector for prepotting: Material So
48、urce Tape:, electrical, plastic, polytetraflouroethylene CHR Industries 5 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-KSC-STD-132D October 24, 2008 4.1.3 Storage Life of Materials 4.1.3.1 Compounds and Activators Storage life of compounds in original unopened containers and frozen cartridges, when applica-ble, shall conform to KSC-SPEC-E-0029 (elastomeric) or MSFC-SPEC-222 (epoxy). 4.1.3.2 Primers
