MSZ 9717-1959 《升降机械，大头的绳索圆盘：上升轴承输出》.pdf

相关资源

ZB B95018-1988 林用圆盘整地机圆盘与接盘的安装尺寸.pdf

MSZ 9675-1960 《升降机械 起重机电缆的测量，绳索圆盘齿轮和圆盘的挑选，应用要求》.pdf

MSZ 9194-1959 《农用机械的圆盘》.pdf

ZB B95 018-1988 林用圆盘整地机圆盘与接盘的安装尺寸.pdf

MSZ 4510-1962 《光滑的研磨圆盘》.pdf

MSZ 9720-1969 《绳索圆盘槽的外观》.pdf

MNOSZ 15635-1953 《灭火设备 凸起的圆盘》.pdf

GB T 21159.2-2007 播种和种植机械 圆盘 第2部分：D2型单边倒角的平面圆盘 尺寸.pdf

MSZ 3762-1968 《铝和铝合金圆盘的尺寸》.pdf

MSZ 9961-1963 《机器生产的仪器部件 外心圆盘》.pdf

猜你喜欢

DIN EN 60749-39-2007 Semiconductor devices - Mechanical and climatic test methods - Part 39 Measurement of moisture diffusivity and water solubility in organic materials used for s.pdf

DIN EN 60749-4-2017 Semiconductor devices - Mechanical and climatic test methods - Part 4 Damp heat steady state highly accelerated stress test (HAST) (IEC 60749-4 2017) German ver.pdf

DIN EN 60749-40-2012 Semiconductor devices - Mechanical and climatic test methods - Part 40 Board level drop test method using a strain gauge (IEC 60749-40 2011) German version EN .pdf

DIN EN 60749-42-2015 Semiconductor devices - Mechanical and climatic test methods - Part 42 Temperature and humidity storage (IEC 60749-42 2014) German version EN 60749-42 2014《半导体.pdf

DIN EN 60749-44-2017 Semiconductor devices - Mechanical and climatic test methods - Part 44 Neutron beam irradiated single event effect (SEE) test method for semiconductor devices .pdf

DIN EN 60749-6-2017 Semiconductor devices - Mechanical and climatic test methods - Part 6 Storage at high temperature (IEC 60749-6 2017) German version EN 60749-6 2017《半导体器件 机械和气候试.pdf

DIN EN 60749-7-2012 Semiconductor devices - Mechanical and climatic test methods - Part 7 Internal moisture content measurement and the analysis of other residual gases (IEC 60749-.pdf

DIN EN 60749-8-2003 Semiconductor devices - Mechanical and climatic test methods - Part 8 Sealing (IEC 60749-8 2002 + Corr 1 2003 + Corr 2 2003) German version EN 60749-8 2003《半导体器.pdf

DIN EN 60749-9-2017 Semiconductor devices - Mechanical and climatic test methods - Part 9 Permanence of marking (IEC 60749-9 2017) German version EN 60749-9 2017《半导体器件 机械和气候试验方法 第9.pdf