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IEC 61375-3-1-2012 Electronic railway equipment - Train Communication Network (TCN) - Part 3-1 Multifunction Vehicle Bus (MVB)《电子铁路设备.列车通讯网络(TCN).第3-1部分 多功能列车总线(MVB)》.pdf 272

IEC 61375-3-1-2012 Electronic railway equipment - Train Communication Network (TCN) - Part 3-1 Multifunction Vehicle Bus (MVB)《电子铁路设备.列车通讯网络(TCN).第3-1部分 多功能列车总线(MVB)》.pdfIEC 61375-3-1-2012 Electronic railway equipment - Train Communication Network (TCN) - Part 3-1 Multifunction Vehicle Bus (MVB)《电子铁路设备.列车通讯网络(TCN).第3-1部分 多功能列车总线(MVB)》.pdf

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IEC 61375-2-5-2014 Electronic railway equipment - Train communication network (TCN) - Part 2-5 Ethernet train backbone《铁路电子设备 列车通信网络(TCN) 第2-5部分 以太网列车骨干网》.pdf 262

IEC 61375-2-5-2014 Electronic railway equipment - Train communication network (TCN) - Part 2-5 Ethernet train backbone《铁路电子设备 列车通信网络(TCN) 第2-5部分 以太网列车骨干网》.pdfIEC 61375-2-5-2014 Electronic railway equipment - Train communication network (TCN) - Part 2-5 Ethernet train backbone《铁路电子设备 列车通信网络(TCN) 第2-5部分 以太网列车骨干网》.pdf

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IEC 61375-2-3-2015 Electronic railway equipment - Train communication network (TCN) - Part 2-3 TCN communication profile《铁路电子设备 列车通信网络 (TCN) 第2-3部分 TCN通信简介》.pdf 280

IEC 61375-2-3-2015 Electronic railway equipment - Train communication network (TCN) - Part 2-3 TCN communication profile《铁路电子设备 列车通信网络 (TCN) 第2-3部分 TCN通信简介》.pdfIEC 61375-2-3-2015 Electronic railway equipment - Train communication network (TCN) - Part 2-3 TCN communication profile《铁路电子设备 列车通信网络 (TCN) 第2-3部分 TCN通信简介》.pdf

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IEC 61375-2-2-2012 Electronic railway equipment - Train communication network (TCN) - Part 2-2 Wire Train Bus conformance testing《电子铁路设备.列出通讯网络(TCN).第2-2部分 列车总线一致性测试》.pdf 208

IEC 61375-2-2-2012 Electronic railway equipment - Train communication network (TCN) - Part 2-2 Wire Train Bus conformance testing《电子铁路设备.列出通讯网络(TCN).第2-2部分 列车总线一致性测试》.pdfIEC 61375-2-2-2012 Electronic railway equipment - Train communication network (TCN) - Part 2-2 Wire Train Bus conformance testing《电子铁路设备.列出通讯网络(TCN).第2-2部分 列车总线一致性测试》.pdf

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IEC 61189-5-1-2016 Test methods for electrical materials printed boards and other interconnection structures and assemblies - Part 5-1 General test methods for materials and assemb.pdf 58

IEC 61189-5-1-2016 Test methods for electrical materials printed boards and other interconnection structures and assemblies - Part 5-1 General test methods for materials and assemb.pdfIEC 61189-5-1-2016 Test methods for electrical materials printed boards and other interconnection structures and assemblies - Part 5-1 General test methods for materials and assemb.pdf

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IEC 61188-7-2017 Printed boards and printed board assemblies - Design and use - Part 7 Electronic component zero orientation for CAD library construction《印制板和印制板组件.设计和使用.第7部分 用于CAD文库构建的电子元件零方向》.pdf 24

IEC 61188-7-2017 Printed boards and printed board assemblies - Design and use - Part 7 Electronic component zero orientation for CAD library construction《印制板和印制板组件.设计和使用.第7部分 用于CAD文库构建的电子元件零方向》.pdfIEC 61188-7-2017 Printed boards and printed board assemblies - Design and use - Part 7 Electronic component zero orientation for CAD library construction《印制板和印制板组件.设计和使用.第7部分 用于CAD文库构建的电子元件零方向》.pdf

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IEC 61188-5-2-2003 Printed boards and printed board assemblies - Design and use - Part 5-2 Attachment (land joint) considerations Discrete components《印制电路板和印制电路板组件.设计和使用.第5-2部分 焊接(焊接区 焊缝)考虑.分立器件.pdf 112

IEC 61188-5-2-2003 Printed boards and printed board assemblies - Design and use - Part 5-2 Attachment (land joint) considerations Discrete components《印制电路板和印制电路板组件.设计和使用.第5-2部分 焊接(焊接区 焊缝)考虑.分立器件.pdfIEC 61188-5-2-2003 Printed boards and printed board assemblies - Design and use - Part 5-2 Attachment (land joint) considerations Discrete components《印制电路板和印制电路板组件.设计和使用.第5-2部分 焊接(焊接区 焊缝)考虑.分立器件.pdf

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IEC 61188-5-1-2002 Printed boards and printed board assemblies - Design and use - Part 5-1 Attachment (land joint) considerations Generic requirements《印制电路板和印制电路板组件.设计和使用.第5-1部分 总要求.附属物(所有的 共同的).pdf 150

IEC 61188-5-1-2002 Printed boards and printed board assemblies - Design and use - Part 5-1 Attachment (land joint) considerations Generic requirements《印制电路板和印制电路板组件.设计和使用.第5-1部分 总要求.附属物(所有的 共同的).pdfIEC 61188-5-1-2002 Printed boards and printed board assemblies - Design and use - Part 5-1 Attachment (land joint) considerations Generic requirements《印制电路板和印制电路板组件.设计和使用.第5-1部分 总要求.附属物(所有的 共同的).pdf

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IEC 61188-1-2-1998 Printed boards and printed boards assemblies - Design and use - Part 1-2 Generic requirements - Controlled impedance《印制电路板和印制电路板组件 设计和使用 第1-2部分 一般要求 控制阻抗》.pdf 92

IEC 61188-1-2-1998 Printed boards and printed boards assemblies - Design and use - Part 1-2 Generic requirements - Controlled impedance《印制电路板和印制电路板组件 设计和使用 第1-2部分 一般要求 控制阻抗》.pdfIEC 61188-1-2-1998 Printed boards and printed boards assemblies - Design and use - Part 1-2 Generic requirements - Controlled impedance《印制电路板和印制电路板组件 设计和使用 第1-2部分 一般要求 控制阻抗》.pdf

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IEC 61000-6-6-2003 Electromagnetic compatibility (EMC) - Part 6-6 Generic standards HEMP immunity for indoor equipment《电磁兼容性(EMC).第6-6部分 总标准.室内设备的HEMP抗扰性》.pdf 48

IEC 61000-6-6-2003 Electromagnetic compatibility (EMC) - Part 6-6 Generic standards HEMP immunity for indoor equipment《电磁兼容性(EMC).第6-6部分 总标准.室内设备的HEMP抗扰性》.pdfIEC 61000-6-6-2003 Electromagnetic compatibility (EMC) - Part 6-6 Generic standards HEMP immunity for indoor equipment《电磁兼容性(EMC).第6-6部分 总标准.室内设备的HEMP抗扰性》.pdf

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