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HD 480 S1-1988 Test Method for Evaluating Thermal Endurance of Flexible Sheet Materials Using the Wrapped Tube Method《用绕扎管法评价软板材耐热性的试验方法》.pdf 3

HD 480 S1-1988 Test Method for Evaluating Thermal Endurance of Flexible Sheet Materials Using the Wrapped Tube Method《用绕扎管法评价软板材耐热性的试验方法》.pdfHD 480 S1-1988 Test Method for Evaluating Thermal Endurance of Flexible Sheet Materials Using the Wrapped Tube Method《用绕扎管法评价软板材耐热性的试验方法》.pdf

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HD 479-1986 Oscilloscopes and Peak Voltmeters for Impulse Tests《示波器和峰值电压表的冲击试验》.pdf 2

HD 479-1986 Oscilloscopes and Peak Voltmeters for Impulse Tests《示波器和峰值电压表的冲击试验》.pdfHD 479-1986 Oscilloscopes and Peak Voltmeters for Impulse Tests《示波器和峰值电压表的冲击试验》.pdf

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HD 313 2 10 S3-1990 Base Materials for Printed Circuits Part 2 Specifications Specification No 10 Epoxide Non-Woven Woven Glass Reinforced Copper- Clad Laminate.pdf 5

HD 313 2 10 S3-1990 Base Materials for Printed Circuits Part 2 Specifications Specification No 10 Epoxide Non-Woven Woven Glass Reinforced Copper- Clad Laminate.pdfHD 313 2 10 S3-1990 Base Materials for Printed Circuits Part 2 Specifications Specification No 10 Epoxide Non-Woven Woven Glass Reinforced Copper- Clad Laminate.pdf

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HD 313 2 10 S2-1990 Base Materials for Printed Circuits Part 2 Specifications Specification No 10 Epoxide Non-Woven Glass Reinforced Copper-Clad Laminated Sheet.pdf 3

HD 313 2 10 S2-1990 Base Materials for Printed Circuits Part 2 Specifications Specification No 10 Epoxide Non-Woven Glass Reinforced Copper-Clad Laminated Sheet.pdfHD 313 2 10 S2-1990 Base Materials for Printed Circuits Part 2 Specifications Specification No 10 Epoxide Non-Woven Glass Reinforced Copper-Clad Laminated Sheet.pdf

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HD 313 2 10 S1-1989 Base Materials for Printed Circuits-Part 2 Specifications Specification No 10 Epoxide Non-Woven Woven Glass Reinforced Copper- Clad Laminate.pdf 3

HD 313 2 10 S1-1989 Base Materials for Printed Circuits-Part 2 Specifications Specification No 10 Epoxide Non-Woven Woven Glass Reinforced Copper- Clad Laminate.pdfHD 313 2 10 S1-1989 Base Materials for Printed Circuits-Part 2 Specifications Specification No 10 Epoxide Non-Woven Woven Glass Reinforced Copper- Clad Laminate.pdf

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HD 313 2 1-1987 Base Materials for Printed Circuits Part 2 Specifications Specification No 1 Phenolic Cellulose Paper Copper - Clad Laminated Sheet High Electri.pdf 3

HD 313 2 1-1987 Base Materials for Printed Circuits Part 2 Specifications Specification No 1 Phenolic Cellulose Paper Copper - Clad Laminated Sheet High Electri.pdfHD 313 2 1-1987 Base Materials for Printed Circuits Part 2 Specifications Specification No 1 Phenolic Cellulose Paper Copper - Clad Laminated Sheet High Electri.pdf

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HD 313 2 1 S2-1990 Base Materials for Printed Circuits Part 2 Specifications Specification No 1 Phenolic Cellulose Paper Copper-Clad Laminated Sheet High Electr.pdf 3

HD 313 2 1 S2-1990 Base Materials for Printed Circuits Part 2 Specifications Specification No 1 Phenolic Cellulose Paper Copper-Clad Laminated Sheet High Electr.pdfHD 313 2 1 S2-1990 Base Materials for Printed Circuits Part 2 Specifications Specification No 1 Phenolic Cellulose Paper Copper-Clad Laminated Sheet High Electr.pdf

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【计算机类职业资格】软件评测师-16及答案解析.doc 13

【计算机类职业资格】软件评测师-16及答案解析.doc【计算机类职业资格】软件评测师-16及答案解析.doc

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【计算机类职业资格】软件评测师-15及答案解析.doc 10

【计算机类职业资格】软件评测师-15及答案解析.doc【计算机类职业资格】软件评测师-15及答案解析.doc

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【计算机类职业资格】软件评测师-14及答案解析.doc 14

【计算机类职业资格】软件评测师-14及答案解析.doc【计算机类职业资格】软件评测师-14及答案解析.doc

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