IEC 60749-29-2011 Semiconductor devices - Mechanical and climatic test methods - Part 29 Latch-up test《半导体器件.机械和气候试验方法.第29部分 闭锁试验》.pdf

1、 IEC 60749-29 Edition 2.0 2011-04 INTERNATIONAL STANDARD NORME INTERNATIONALE Semiconductor devices Mechanical and climatic test methods Part 29: Latch-up test Dispositifs semiconducteurs Mthodes dessai mcaniques et climatiques Partie 29: Essai de verrouillage IEC 60749-29:2011 THIS PUBLICATION IS C

2、OPYRIGHT PROTECTED Copyright 2011 IEC, Geneva, Switzerland All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from either

3、 IEC or IECs member National Committee in the country of the requester. If you have any questions about IEC copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or your local IEC member National Committee for further information. Droits

4、 de reproduction rservs. Sauf indication contraire, aucune partie de cette publication ne peut tre reproduite ni utilise sous quelque forme que ce soit et par aucun procd, lectronique ou mcanique, y compris la photocopie et les microfilms, sans laccord crit de la CEI ou du Comit national de la CEI d

5、u pays du demandeur. Si vous avez des questions sur le copyright de la CEI ou si vous dsirez obtenir des droits supplmentaires sur cette publication, utilisez les coordonnes ci-aprs ou contactez le Comit national de la CEI de votre pays de rsidence. IEC Central Office 3, rue de Varemb CH-1211 Geneva

6、 20 Switzerland Email: inmailiec.ch Web: www.iec.ch About the IEC The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes International Standards for all electrical, electronic and related technologies. About IEC publications The technical c

7、ontent of IEC publications is kept under constant review by the IEC. Please make sure that you have the latest edition, a corrigenda or an amendment might have been published. Catalogue of IEC publications: www.iec.ch/searchpub The IEC on-line Catalogue enables you to search by a variety of criteria

8、 (reference number, text, technical committee,). It also gives information on projects, withdrawn and replaced publications. IEC Just Published: www.iec.ch/online_news/justpub Stay up to date on all new IEC publications. Just Published details twice a month all new publications released. Available o

9、n-line and also by email. Electropedia: www.electropedia.org The worlds leading online dictionary of electronic and electrical terms containing more than 20 000 terms and definitions in English and French, with equivalent terms in additional languages. Also known as the International Electrotechnica

10、l Vocabulary online. Customer Service Centre: www.iec.ch/webstore/custserv If you wish to give us your feedback on this publication or need further assistance, please visit the Customer Service Centre FAQ or contact us: Email: csciec.ch Tel.: +41 22 919 02 11 Fax: +41 22 919 03 00 A propos de la CEI

11、 La Commission Electrotechnique Internationale (CEI) est la premire organisation mondiale qui labore et publie des normes internationales pour tout ce qui a trait llectricit, llectronique et aux technologies apparentes. A propos des publications CEI Le contenu technique des publications de la CEI es

12、t constamment revu. Veuillez vous assurer que vous possdez ldition la plus rcente, un corrigendum ou amendement peut avoir t publi. Catalogue des publications de la CEI: www.iec.ch/searchpub/cur_fut-f.htm Le Catalogue en-ligne de la CEI vous permet deffectuer des recherches en utilisant diffrents cr

13、itres (numro de rfrence, texte, comit dtudes,). Il donne aussi des informations sur les projets et les publications retires ou remplaces. Just Published CEI: www.iec.ch/online_news/justpub Restez inform sur les nouvelles publications de la CEI. Just Published dtaille deux fois par mois les nouvelles

14、 publications parues. Disponible en-ligne et aussi par email. Electropedia: www.electropedia.org Le premier dictionnaire en ligne au monde de termes lectroniques et lectriques. Il contient plus de 20 000 termes et dfinitions en anglais et en franais, ainsi que les termes quivalents dans les langues

15、additionnelles. Egalement appel Vocabulaire Electrotechnique International en ligne. Service Clients: www.iec.ch/webstore/custserv/custserv_entry-f.htm Si vous dsirez nous donner des commentaires sur cette publication ou si vous avez des questions, visitez le FAQ du Service clients ou contactez-nous

16、: Email: csciec.ch Tl.: +41 22 919 02 11 Fax: +41 22 919 03 00 IEC 60749-29 Edition 2.0 2011-04 INTERNATIONAL STANDARD NORME INTERNATIONALE Semiconductor devices Mechanical and climatic test methods Part 29: Latch-up test Dispositifs semiconducteurs Mthodes dessai mcaniques et climatiques Partie 29:

17、 Essai de verrouillage INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE T ICS 31.080.01 PRICE CODE CODE PRIX ISBN 978-2-88912-434-3 Registered trademark of the International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internationale

18、2 60749-29 IEC:2011 CONTENTS FOREWORD . 3 1 Scope and object 5 2 Terms and definitions . 5 3 Classification and levels . 8 3.1 Classification . 8 3.2 Levels . 8 4 Apparatus and material 8 4.1 Latch-up tester 8 4.1.1 General . 8 4.1.2 V supplyand their qualification method. 9 4.1.3 Trigger source qua

19、lification method . 9 4.2 Automated test equipment (ATE) . 10 4.3 Heat source . 10 5 Procedure 10 5.1 General latch-up test procedure 10 5.2 Detailed latch-up test procedure 13 5.2.1 I-test 13 5.2.2 V supplyovervoltage test 17 5.2.3 Testing dynamic devices . 19 5.2.4 DUT disposition . 19 5.2.5 Recor

20、d keeping . 19 6 Failure criteria 20 7 Summary 20 Annex A (informative) Examples of special pins that are connected to passive components 21 Annex B (informative) Calculation of operating ambient or operating case temperature for a given operating junction temperature 23 Figure 1 V supplyqualificati

21、on circuit 9 Figure 2 Trigger source qualification circuit 10 Figure 3 Latch-up test flow . 11 Figure 4 Test waveform for positive I-test 14 Figure 5 Test waveform for negative I-test . 15 Figure 6 Equivalent circuit for positive input/output I-test latch-up testing 16 Figure 7 Equivalent circuit fo

22、r negative input/output I-test latch-up testing . 17 Figure 8 Test waveform for V supplyovervoltage 18 Figure 9 Equivalent circuit for V supplyovervoltage test latch-up testing . 19 Figure A.1 Examples of special pins that are connected to passive components 22 Table 1 Test matrix a. 12 Table 2 Timi

23、ng specifications for I-test and V supplyovervoltage test . 13 60749-29 IEC:2011 3 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ SEMICONDUCTOR DEVICES MECHANICAL AND CLIMATIC TEST METHODS Part 29: Latch-up test FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization

24、 for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC pub

25、lishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may

26、 participate in this preparatory work. International, governmental and non- governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreem

27、ent between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC National Committees. 3) IEC Pu

28、blications have the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used o

29、r for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the corre

30、sponding national or regional publication shall be clearly indicated in the latter. 5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for

31、any services carried out by independent certification bodies. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and members of its technical committees and

32、 IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) At

33、tention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights.

34、 IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 60749-29 has been prepared by IEC technical committee 47: Semiconductor devices. This second edition cancels and replaces the first edition published in 2003 and constitutes a technical revis

35、ion. The significant changes with respect to the previous edition include: a number of minor technical changes; the addition of two new annexes covering the testing of special pins and temperature calculations. 4 60749-29 IEC:2011 The text of this standard is based on the following documents: FDIS R

36、eport on voting 47/2083/FDIS 47/2090/RVD Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. A list of all parts in the IEC 60749 serie

37、s, under the general title Semiconductor devices Mechanical and climatic test methods, can be found on the IEC website. The committee has decided that the contents of this publication will remain unchanged until the stability date indicated on the IEC web site under “http:/webstore.iec.ch“ in the da

38、ta related to the specific publication. At this date, the publication will be reconfirmed, withdrawn, replaced by a revised edition, or amended. 60749-29 IEC:2011 5 SEMICONDUCTOR DEVICES MECHANICAL AND CLIMATIC TEST METHODS Part 29: Latch-up test 1 Scope and object This part of IEC 60749 covers the

39、I-test and the overvoltage latch-up testing of integrated circuits. This test is classified as destructive. The purpose of this test is to establish a method for determining integrated circuit (IC) latch- up characteristics and to define latch-up failure criteria. Latch-up characteristics are used i

40、n determining product reliability and minimizing “no trouble found“ (NTF) and “electrical overstress“ (EOS) failures due to latch-up. This test method is primarily applicable to CMOS devices. Applicability to other technologies must be established. The classification of latch-up as a function of tem

41、perature is defined in 3.1 and the failure level criteria are defined in 3.2 2 Terms and definitions For the purposes of this document, the following terms and definitions apply. 2.1 cool-down time period of time between successive applications of trigger pulses or the period of time between the rem

42、oval of the V supplyvoltage and the application of the next trigger pulse (See Figures 4, 5, and 8 and Table 2.) 2.2 device under test DUT semiconductor product subjected to latch-up test 2.3 ground GND common or zero-potential pin(s) of the DUT NOTE 1 Ground pins are not latch-up tested. NOTE 2 A g

43、round pin is sometimes called V ss . 2.4 input pins all address, data-in control, V refand similar pins 2.5 I/O (bi-directional) pins device pins that can be made to operate as an input or output or in a high-impedance state 6 60749-29 IEC:2011 2.6 I supplytotal supply current in each V supplypin (o

44、r pin group) with the DUT biased as indicated in Table 1 2.7 I-test latch-up test that supplies positive and negative current pulses to the pin under test 2.8 latch-up state in which a low-impedance path resulting from an overstress that triggers a parasitic thyristor structure, persists after remov

45、al or cessation of the triggering condition NOTE 1 The overstress can be a voltage or current surge, an excessive rate of change of current or voltage, or any other abnormal condition that causes the parasitic thyristor structure to become regenerative. NOTE 2 Latch-up will not damage the device pro

46、vided that the current through the low-impedance path is sufficiently limited in magnitude or duration. 2.9 logic-high level within the more positive (less negative) of the two ranges of logic levels chosen to represent the logic states NOTE 1 For digital devices, a voltage level equal to V supplyis

47、 used for latch-up testing, except where otherwise specified in the relevant specification. NOTE 2 For non-digital devices, V supply voltage level or the maximum operating voltage that can be applied to that pin as defined in the relevant specification may be used for latch-up testing. 2.10 logic-lo

48、w level within the more negative (less positive) of the two ranges of logic levels chosen to represent the logic states NOTE 1 For digital devices, ground voltage level is used for latch-up testing, except where specified in the relevant specification. NOTE 2 For non-digital devices, ground voltage

49、level or the minimum operating voltage that can be applied to that pin as defined in the relevant specification may be used for latch-up testing. 2.11 maximum V supplymaximum operating voltage for operation within performance specifications NOTE 1 The maximum voltage is not the absolute maximum voltage beyond which permanent damage is likely. NOTE 2 Maximum refers to the magnitude of V supplya