IEC 61189-5-1-2016 Test methods for electrical materials printed boards and other interconnection structures and assemblies - Part 5-1 General test methods for materials and assemb.pdf

1、 IEC 61189-5-1 Edition 1.0 2016-07 INTERNATIONAL STANDARD NORME INTERNATIONALE Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 5-1: General test methods for materials and assemblies Guidance for printed board assemblies Mthodes dessai po

2、ur les matriaux lectriques, les cartes imprimes et autres structures dinterconnexion et ensembles Partie 5-1: Mthodes dessai gnrales pour les matriaux et les assemblages Lignes directrices pour les assemblages de cartes circuit imprim IEC 61189-5-1:2016-07(en-fr) THIS PUBLICATION IS COPYRIGHT PROTEC

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20、ous avez des questions contactez-nous: csciec.ch. IEC 61189-5-1 Edition 1.0 2016-07 INTERNATIONAL STANDARD NORME INTERNATIONALE Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 5-1: General test methods for materials and assemblies Guidan

21、ce for printed board assemblies Mthodes dessai pour les matriaux lectriques, les cartes imprimes et autres structures dinterconnexion et ensembles Partie 5-1: Mthodes dessai gnrales pour les matriaux et les assemblages Lignes directrices pour les assemblages de cartes circuit imprim INTERNATIONAL EL

22、ECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE ICS 31.180 ISBN 978-2-8322-3506-5 Registered trademark of the International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internationale Warning! Make sure that you obtained this publication from an aut

23、horized distributor. Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agr. 2 IEC 61189-5-1:2016 IEC 2016 CONTENTS FOREWORD . 4 INTRODUCTION . 6 1 Scope 8 2 Normative references. 8 3 Accuracy, precision and resolution . 8 3.1 General . 8 3.2 Accuracy . 8 3.3

24、 Precision . 9 3.4 Resolution. 10 3.5 Report 10 3.6 Students t distribution . 10 3.7 Suggested uncertainty limits 11 4 Catalogue of approved test methods 12 5 List of contents of the IEC 61189-5 series 12 Annex A (informative) Tests . 13 Annex B (informative) Guidance documents and handbooks . 15 B.

25、1 General . 15 B.2 Handbook and guide to supplement IPC-J-STD-001 . 15 B.3 Guidelines for Electrically Conductive Surface Mount Adhesives (IPC-3406) . 15 B.4 Users Guide for Cleanliness of Unpopulated Printed Boards (IPC-5701) . 15 B.5 Guidelines for OEMs in Determining Acceptable Levels of Cleanlin

26、ess of Unpopulated Printed Boards (IPC-5702) 15 B.6 Surface Insulation Resistance Handbook (IPC-9201) . 16 B.7 Material and Process Characterisation / Qualification Test Protocol for Assessing Electrochemical Performance (IPC-9202) 16 B.8 User Guide for the IPC/IEC B52 Process Qualification Test Veh

27、icle (IPC-9203) 16 B.9 PWB Assembly Soldering Process Guideline for Electronic Components (IPC-9502) 16 B.10 Aqueous Post Solder Cleaning Handbook (IPC-AC-62A) 17 B.11 Guidelines for Cleaning of Printed Boards and Assemblies (IPC-CH-65A) . 17 B.12 Handbook (IPC-J-STD-005) . 17 B.13 Acceptability of

28、Electronic Assemblies (IPC-HDBK-610) . 18 B.14 Guidelines for Design, Selection and Application of Conformal Coatings (IPC-HDBK-830) . 18 B.15 Solder mask Handbook (IPC-HDBK-840) . 18 B.16 Guidelines and Requirements for Electrical Testing of Unpopulated Printed Boards (IPC-9252) 19 B.17 In-Process

29、DPMO and Estimated Yield for PCAs (IPC-9261A) 19 B.18 Assembly Soldering Process Guideline for Electronic Components (IPC-9502 PWB) . 20 B.19 Users Guide for IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation (IPC-9631) 20 B.20 High Temperature Printed Board Flatness Gu

30、ideline (IPC-9641) 20 B.21 User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance Test (Electrochemical Migration Testing) (IPC-9691A) 21 IEC 61189-5-1:2016 IEC 2016 3 B.22 Mechanical Shock Test Guidelines for Solder Joint Reliability (IPC-JEDEC- 9703) 21 B.23 Prin

31、ted Circuit Assembly Strain Gage Test Guideline (IPC-JEDEC-9704A) . 22 Bibliography . 23 Table 1 Students t distribution . 11 Table A.1 General test methods for materials and assemblies . 13 4 IEC 61189-5-1:2016 IEC 2016 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ TEST METHODS FOR ELECTRICAL MATERIA

32、LS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES Part 5-1: General test methods for materials and assemblies Guidance for printed board assemblies FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all nati

33、onal electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technica

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38、ser. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publicatio

39、n shall be clearly indicated in the latter. 5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any services carried out by independent

40、certification bodies. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any persona

41、l injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative refere

42、nces cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for i

43、dentifying any or all such patent rights. International Standard IEC 61189-5-1 has been prepared by IEC technical committee 91: Electronics assembly technology. The text of this standard is based on the following documents: CDV Report on voting 91/1273/CDV 91/1354/RVC Full information on the voting

44、for the approval of this standard can be found in the report on voting indicated in the above table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. IEC 61189-5-1:2016 IEC 2016 5 A list of all parts in the IEC 61189 series, published under the general title Test

45、methods for electrical materials, printed boards and other interconnection structures and assemblies, can be found on the IEC website. The committee has decided that the contents of this publication will remain unchanged until the stability date indicated on the IEC website under “http:/webstore.iec

46、.ch“ in the data related to the specific publication. At this date, the publication will be reconfirmed, withdrawn, replaced by a revised edition, or amended. 6 IEC 61189-5-1:2016 IEC 2016 INTRODUCTION IEC 61189 relates to test methods for printed boards and printed board assemblies, as well as rela

47、ted materials or component robustness, irrespective of their method of manufacture. The standard is divided into separate parts, covering information for the designer and the test methodology engineer or technician. Each part has a specific focus. Methods are grouped according to their application a

48、nd numbered sequentially as they are developed and released. In some instances test methods developed by other technical committees (for example, TC 104) have been reproduced from existing IEC standards in order to provide the reader with a comprehensive set of test methods. When this situation occu

49、rs, it will be noted on the specific test method. If the test method is reproduced with minor revisions, those paragraphs that are different are identified. This part of IEC 61189 contains test methods for evaluating printed board assemblies as well as materials used in the manufacture of electronic assemblies. The methods are self- contained, with sufficient detail and description so as to achieve uni