IEC 61189-5-3-2015 Test methods for electrical materials printed boards and other interconnection structures and assemblies - Part 5-3 General test methods for materials and assemb.pdf

1、 IEC 61189-5-3 Edition 1.0 2015-01 INTERNATIONAL STANDARD NORME INTERNATIONALE Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 5-3: General test methods for materials and assemblies Soldering paste for printed board assemblies Mthodes de

2、ssai pour les matriaux lectriques, les cartes imprimes et autres structures dinterconnexion et ensembles Partie 5-3: Mthodes dessai gnrales pour les matriaux et les assemblages Pte de brasage pour les assemblages de cartes imprimes IEC 61189-5-3:2015-01(en-fr) colour inside THIS PUBLICATION IS COPYR

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20、 des commentaires sur cette publication ou si vous avez des questions contactez-nous: csciec.ch. IEC 61189-5-3 Edition 1.0 2015-01 INTERNATIONAL STANDARD NORME INTERNATIONALE Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 5-3: General t

21、est methods for materials and assemblies Soldering paste for printed board assemblies Mthodes dessai pour les matriaux lectriques, les cartes imprimes et autres structures dinterconnexion et ensembles Partie 5-3: Mthodes dessai gnrales pour les matriaux et les assemblages Pte de brasage pour les ass

22、emblages de cartes imprimes INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE ICS 31.180 ISBN 978-2-8322-1998-0 Registered trademark of the International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internationale Warning! Make sure th

23、at you obtained this publication from an authorized distributor. Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agr. colour inside 2 IEC 61189-5-3:2015 IEC 2015 CONTENTS FOREWORD . 5 INTRODUCTION . 7 1 Scope 8 2 Normative references 8 3 Accuracy, precisio

24、n and resolution 8 3.1 General . 8 3.2 Accuracy . 9 3.3 Precision . 9 3.4 Resolution 10 3.5 Report. 10 3.6 Students t distribution 10 3.7 Suggested uncertainty limits . 11 4 X: Miscellaneous test methods 12 4.1 Test 5-3X01: Paste flux viscosity T-Bar spindle method . 12 Object 12 4.1.1Test specimen

25、. 12 4.1.2Apparatus and reagents . 12 4.1.3Procedure 12 4.1.4Safety notes 12 4.1.5 4.2 Test 5-3X02: Spread test, extracted solder flux, paste flux and solder paste . 12 Object 12 4.2.1Method A . 13 4.2.2Method B . 14 4.2.3Additional information 15 4.2.4 4.3 Test 5-3X03: Solder paste viscosity T-Bar

26、spin spindle method (applicable for 300 Pas to 1 600 Pas) . 15 Object 15 4.3.1Test specimen . 15 4.3.2Equipment/apparatus . 15 4.3.3Procedure 16 4.3.4Evaluation . 16 4.3.5Additional information 16 4.3.6 4.4 Test 5-3X04: Solder paste viscosity T-Bar spindle method (applicable to 300 Pas) 16 Object 16

27、 4.4.1Test specimen . 17 4.4.2Equipment/apparatus . 17 4.4.3Procedure 17 4.4.4Evaluation . 17 4.4.5Additional information 17 4.4.6 4.5 Test 5-3X05: Solder paste viscosity Spiral pump method (applicable for 300 Pas to 1 600 Pas) 18 Object 18 4.5.1Test specimen . 18 4.5.2Equipment/apparatus . 18 4.5.3

28、Procedure 18 4.5.4IEC 61189-5-3:2015 IEC 2015 3 Evaluation . 18 4.5.5Additional information 18 4.5.6 4.6 Test 5-3X06: Solder paste viscosity Spiral pump method (applicable to 300 Pas) . 19 Object 19 4.6.1Test specimen . 19 4.6.2Equipment/apparatus . 19 4.6.3Procedure 19 4.6.4Evaluation . 19 4.6.5Add

29、itional information 19 4.6.6 4.7 Test 5-3X07: Solder paste Slump test 20 Object 20 4.7.1Test specimen . 20 4.7.2Equipment/apparatus . 20 4.7.3Procedure 20 4.7.4Evaluation . 22 4.7.5 4.8 Test 5-3X08: Solder paste Solder ball test . 22 Object 22 4.8.1Test specimen . 23 4.8.2Equipment/apparatus . 23 4.

30、8.3Procedure 23 4.8.4Evaluation . 24 4.8.5 4.9 Test 5-3X09: Solder paste Tack test 25 Object 25 4.9.1Method A . 25 4.9.2Method B . 26 4.9.3Test equipment sources . 27 4.9.4 4.10 Test 5-3X10: Solder paste Wetting test 27 Object 27 4.10.1Test specimen . 27 4.10.2Equipment/materials/apparatus 27 4.10.3

31、Procedure 27 4.10.4Evaluation . 28 4.10.5 4.11 Test 5-3X11: Determination of solder powder particle size distribution Screen method for types 1-4 . 28 Object 28 4.11.1Test specimen . 28 4.11.2Equipment/apparatus . 28 4.11.3Procedure 28 4.11.4 4.12 Test 5-3X12: Solder powder particle size distributio

32、n Measuring microscope method . 30 Object 30 4.12.1Test specimen . 30 4.12.2Equipment/apparatus . 30 4.12.3Procedure 30 4.12.4 4.13 Test 5-3X13: Solder powder particle size distribution Optical image analyser method . 31 Object 31 4.13.1Test specimen . 31 4.13.2Equipment/apparatus . 31 4.13.3 4 IEC

33、61189-5-3:2015 IEC 2015 Procedure 32 4.13.4 4.14 Test 5-3X14: Solder powder particle size distribution Measuring laser diffraction method . 33 Object 33 4.14.1Test specimen . 33 4.14.2Equipment/apparatus . 33 4.14.3Preparation 34 4.14.4Test procedure 34 4.14.5Test . 34 4.14.6Evaluation . 34 4.14.7 4

34、.15 Test 5-3X15: Determination of maximum solder powder particle size 35 Object 35 4.15.1Test specimen . 35 4.15.2Evaluation . 35 4.15.3 4.16 Test 5-3X16: Solder paste metal content by weight . 36 Object 36 4.16.1Test specimen . 36 4.16.2Equipment/apparatus . 36 4.16.3Procedure 36 4.16.4 Annex A (in

35、formative) Typical comparison of particle size distributions between laser diffraction method and screen method 38 Bibliography 39 Figure 1 Slump test stencil thickness, 0,20 mm 21 Figure 2 Slump test stencil thickness, 0,10 mm 21 Figure 3 Solder-ball test evaluation 24 Figure 4 Solder wetting examp

36、les 28 Figure A.1 Typical comparison between laser diffraction and sieving . 38 Table 1 Students t distribution . 11 Table 2 Typical spread areas defined in mm 213 Table 3 Example of a test report Stencil thickness, 0,2 mm . 22 Table 4 Example of a test report Stencil thickness, 0,1 mm . 22 Table 5

37、Screen opening . 29 Table 6 Portions of particle sizes by weight % nominal values 30 Table 7 Powder particle size distribution record . 30 Table 8 Powder particle size distribution record . 31 Table 9 Powder particle size distribution record (optical analysis) 33 Table 10 Powder particle size distri

38、bution record . 34 Table 11 Acceptance of powders by particle sizes . 36 Table 12 Example of a test report on solder paste . 37 IEC 61189-5-3:2015 IEC 2015 5 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASS

39、EMBLIES Part 5-3: General test methods for materials and assemblies Soldering paste for printed board assemblies FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committee

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49、blications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 61189-5-3 has been prepared by IEC technic