1、 IEC 62132-3Edition 1.0 2007-09INTERNATIONAL STANDARD NORME INTERNATIONALEIntegrated circuits Measurement of electromagnetic immunity, 150 kHz to 1 GHz Part 3: Bulk current injection (BCI) method Circuits intgrs Mesure de limmunit lectromagntique, 150 kHz 1 GHz Partie 3: Mthode dinjection de courant
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16、 le FAQ du Service clients ou contactez-nous: Email: csciec.ch Tl.: +41 22 919 02 11 Fax: +41 22 919 03 00 IEC 62132-3Edition 1.0 2007-09INTERNATIONAL STANDARD NORME INTERNATIONALEIntegrated circuits Measurement of electromagnetic immunity, 150 kHz to 1 GHz Part 3: Bulk current injection (BCI) metho
17、d Circuits intgrs Mesure de limmunit lectromagntique, 150 kHz 1 GHz Partie 3: Mthode dinjection de courant (BCI) INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE RICS 31.200 PRICE CODECODE PRIXISBN 2-8318-9320-8 2 62132-3 IEC:2007 CONTENTS FOREWORD.3 1 Scope and o
18、bject5 2 Normative references .5 3 Terms and definitions .5 4 General 5 5 Test conditions .6 5.1 General .6 5.2 Test equipment .7 5.3 Test board.7 6 Test procedure .9 6.1 Hazardous electromagnetic fields9 6.2 Calibration of forward power limitation.9 6.3 BCI test.10 6.4 BCI test set-up characterizat
19、ion procedure11 7 Test report12 Annex A (informative) Examples for test levels and frequency step selection .13 Annex B (informative) Example of BCI test board and set-up .15 Annex C (informative) Example of RF test board and set-up 18 Bibliography19 Figure 1 Principal current path when using BCI6 F
20、igure 2 Schematic diagram of BCI test set-up 7 Figure 3 Example test board, top view .8 Figure 4 Calibration set-up.10 Figure 5 BCI test procedure flowchart for each frequency step.11 Figure 6 Impedance validation test set-up11 Figure B.1 General view.15 Figure B.2 Example of top view of the test bo
21、ard .16 Figure B.3 Test board build-up.16 Figure B.4 Test board and copper fixture .17 Figure B.5 Example of a non-conductive probes support fixture .17 Figure C.1 Compact RF coupling to differential IC ports.18 Table A.1 Test severity levels 13 Table A.2 Linear frequency step 14 Table A.3 Logarithm
22、ic frequency step 14 62132-3 IEC:2007 3 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ INTEGRATED CIRCUITS MEASUREMENT OF ELECTROMAGNETIC IMMUNITY, 150 kHz TO 1 GHz Part 3: Bulk current injection (BCI) method FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization fo
23、r standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publis
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33、2-3 has been prepared by subcommittee 47A: Integrated circuits, of IEC technical committee 47: Semiconductor devices. The text of this standard is based on the following documents: FDIS Report on voting 47A/773/FDIS 47A/776/RVDFull information on the voting for the approval of this standard can be f
34、ound in the report on voting indicated in the above table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. 4 62132-3 IEC:2007 A list of all parts of the IEC 62132 series, published under the general title Integrated circuits Measurement of electromagnetic immunit
35、y, 150 kHz to 1 GHz can be found on the IEC website. The committee has decided that the contents of this publication will remain unchanged until the maintenance result date indicated on the IEC web site under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the
36、publication will be reconfirmed, withdrawn, replaced by a revised edition, or amended. 62132-3 IEC:2007 5 INTEGRATED CIRCUITS MEASUREMENT OF ELECTROMAGNETIC IMMUNITY, 150 kHz TO 1 GHz Part 3: Bulk current injection (BCI) method 1 Scope and object This part of IEC 62132 describes a bulk current injec
37、tion (BCI) test method to measure the immunity of integrated circuits (IC) in the presence of conducted RF disturbances, e.g. resulting from radiated RF disturbances. This method only applies to ICs that have off-board wire connections e.g. into a cable harness. This test method is used to inject RF
38、 current on one or a combination of wires. This standard establishes a common base for the evaluation of semiconductor devices to be applied in equipment used in environments that are subject to unwanted radio frequency electromagnetic signals. 2 Normative references The following referenced documen
39、ts are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 62132-1:2006, Integrated circuits Measurement of electromagnetic immunity, 15
40、0 kHz to 1 GHz Part 1: General conditions and definitions 3 Terms and definitions For the purposes of this document, the terms and definitions given in IEC 62132-1 apply. 4 General The characterization of RF immunity (or susceptibility) of an integrated circuit (IC) is essential to define the optimu
41、m design of a printed circuit board, filter concepts and for further integration into an electronic system. This document defines a method for measuring the immunity of ICs to RF current induced by electromagnetic disturbance. This method is based on the bulk current injection (BCI) method used for
42、equipment and systems 1, 2, 3. The BCI method simulates the induced current as a result of direct radiated RF signals coupled onto the wires and cables of equipment and systems. In general, in electronic systems, off-board wire connections or traces on the printed circuit board act as antennas for e
43、lectromagnetic fields. Via this coupling path, these electro-magnetic fields will induce voltages and currents at the pins of the IC and may cause interference. ICs are often used in various configurations dependent on their application. In this case, immunity levels of electronic equipment are clos
44、ely linked to the ability of an IC to withstand the effects of an electromagnetic field represented. To characterize the RF immunity of an IC, the induced current level necessary to cause the ICs malfunction is measured. The malfunction may be classified from A to E according to the performance clas
45、ses defined in IEC 62132-1. 6 62132-3 IEC:2007 A principal set-up for the bulk current injection method is presented in Figure 1. Current monitoring Power injection Supportive circuitry and by-pass capacitor Injection probe Current probeIC under test DUT IdisturbanceIC controlling and monitoring Vss
46、GND IEC 1811/07 Figure 1 Principal current path when using BCI Two electrically shielded magnetic probes are clamped on one wires or a combination of wires that is/are connected to the device under test. The first probe is for the injection of RF power that induces Idisturbanceonto the wires. The se
47、cond probe is used for monitoring the induced current on those wires. The disturbance current flows in a loop comprising: wire(s), the selected ICs pin(s), Vssterminal, ground path and supportive circuitry. This supportive circuit provides the IC functional elements as source and/or load(s). The sup
48、portive circuitry is directly connected to the IC. When the equivalent RF impedance of the supportive circuitry is larger than 50 , then a by-pass capacitor is recommended. The by-pass capacitor, to be used at the supportive circuitry side, may also be needed to confine the loop area in which the in
49、duced current will be flowing. By default, the lumped by-pass capacitor of 1 nF shall be used. It represents the capacitance from the wire onto a cable harness or chassis. Deviation from using this bypass capacitor (e.g. as functional performance becomes affected) shall be given in the test report The by-pass capacitor may be supplemented with optional decoupling netw
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