IEC 62435-5-2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 5 Die and wafer devices《电子元件 电子半导体设备的长期储存 第5部分 晶粒和晶元设备》.pdf

1、 IEC 62435-5 Edition 1.0 2017-01 INTERNATIONAL STANDARD NORME INTERNATIONALE Electronic components Long-term storage of electronic semiconductor devices Part 5: Die and wafer devices Composants lectroniques Stockage de longue dure des dispositifs lectroniques semiconducteurs Partie 5: Dispositifs de

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19、iec.ch/csc Si vous dsirez nous donner des commentaires sur cette publication ou si vous avez des questions contactez-nous: csciec.ch. IEC 62435-5 Edition 1.0 2017-01 INTERNATIONAL STANDARD NORME INTERNATIONALE Electronic components Long-term storage of electronic semiconductor devices Part 5: Die an

20、d wafer devices Composants lectroniques Stockage de longue dure des dispositifs lectroniques semiconducteurs Partie 5: Dispositifs de puces et plaquettes INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE ICS 31.020 ISBN 978-2-8322-3837-0 Registered trademark of the

21、 International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internationale Warning! Make sure that you obtained this publication from an authorized distributor. Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agr. 2 IEC 62435-

22、5:2017 IEC 2017 CONTENTS FOREWORD . 4 INTRODUCTION . 6 1 Scope 8 2 Normative references 8 3 Terms, definitions and abbreviated terms 8 3.1 Terms and definitions 8 3.2 Abbreviations 9 4 Storage requirements 9 4.1 General . 9 4.2 Assembly data 9 4.3 Prerequisite for storage. 9 4.4 Damage to die produc

23、ts during long-term storage . 9 4.5 Mechanical storage conditions 10 4.6 Long-term storage environment 10 4.7 Recommended inert atmosphere purity . 11 4.8 Chemical contamination 11 4.9 Vacuum packing . 11 4.9.1 General . 11 4.9.2 Vacuum dry pack . 11 4.10 Positive pressure systems for packing 11 4.1

24、1 Use of packing material having sacrificial properties . 11 4.12 Use of bio-degradable material . 12 4.13 Plasma cleaning . 12 4.14 Electrical effects . 12 4.15 Protection from radiation . 12 4.16 Periodic qualification of stored die products 12 5 Long-term storage failure mechanisms 13 6 LTS conce

25、rns, method, verification and limitations 13 6.1 General . 13 6.2 Wafers 13 6.3 Bare dice 14 7 Deterioration mechanisms specific to bare die and wafers . 15 7.1 Wire bondability 15 7.2 Staining 15 7.3 Topside delamination 16 8 Specific handling concerns 16 8.1 Die on wafer film frames . 16 8.2 Devic

26、es and dice embossed or punched tape storage . 16 8.3 Handling damage 16 Annex A (informative) Audit checklist . 17 Bibliography 20 IEC 62435-5:2017 IEC 2017 3 Table 1 LTS exposure concerns for wafers 14 Table 2 LTS exposure concerns for bare dice 15 Table A.1 Planning checklist 17 4 IEC 62435-5:201

27、7 IEC 2017 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ ELECTRONIC COMPONENTS LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES Part 5: Die and wafer devices FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national ele

28、ctrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specif

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37、ed in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifyi

38、ng any or all such patent rights. International Standard IEC 62435-5 has been prepared by IEC technical committee 47: Semiconductor devices. The text of this standard is based on the following documents: FDIS Report on voting 47/2328/FDIS 47/2351/RVD Full information on the voting for the approval o

39、f this International Standard can be found in the report on voting indicated in the above table. This document has been drafted in accordance with the ISO/IEC Directives, Part 2. IEC 62435-5:2017 IEC 2017 5 A list of all parts in the IEC 62435 series, published under the general title Electronic com

40、ponents Long-term storage of electronic semiconductor devices, can be found on the IEC website. The committee has decided that the contents of this document will remain unchanged until the stability date indicated on the IEC website under “http:/webstore.iec.ch“ in the data related to the specific d

41、ocument. At this date, the document will be reconfirmed, withdrawn, replaced by a revised edition, or amended. 6 IEC 62435-5:2017 IEC 2017 INTRODUCTION This document applies to the long-duration storage of electronic components. This is a document for long-term storage (LTS) of electronic devices dr

42、awing on the best long- term storage practices currently known. For the purposes of this document, LTS is defined as any device storage whose duration may be more than 12 months for product scheduled for long duration storage. While intended to address the storage of unpackaged semiconductors and pa

43、ckaged electronic devices, nothing in this document precludes the storage of other items under the storage levels defined herein. Although it has always existed to some extent, obsolescence of electronic components and particularly of integrated circuits, has become increasingly intense over the las

44、t few years. Indeed, with the existing technological boom, the commercial life of a component has become very short compared with the life of industrial equipment such as that encountered in the aeronautical field, the railway industry or the energy sector. The many solutions enabling obsolescence t

45、o be resolved are now identified. However, selecting one of these solutions should be preceded by a case-by-case technical and economic feasibility study, depending on whether storage is envisaged for field service or production, for example: remedial storage as soon as components are no longer mark

46、eted; preventive storage anticipating declaration of obsolescence. Taking into account the expected life of some installations, sometimes covering several decades, the qualification times, and the unavailability costs, which can also be very high, the solution to be adopted to resolve obsolescence s

47、hould often be rapidly implemented. This is why the solution retained in most cases consists in systematically storing components which are in the process of becoming obsolescent. The technical risks of this solution are, a priori, fairly low. However, it requires perfect mastery of the implemented

48、process and especially of the storage environment, although this mastery becomes critical when it comes to long-term storage. All handling, protection, storage and test operations are recommended to be performed according to the state of the art. The application of the approach proposed in this stan

49、dard in no way guarantees that the stored components are in perfect operating condition at the end of this storage. It only comprises a means of minimizing potential and probable degradation factors. Some electronic device users have the need to store electronic devices for long periods of time. Lifetime buys are commonly made to support production runs of assemblies that well exceed the production timeframe of its