IEC 62610-4-2013 Mechanical structures for electronic equipment - Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series - Part 4 Cooling performance tes.pdf

1、 IEC 62610-4 Edition 1.0 2013-08 INTERNATIONAL STANDARD NORME INTERNATIONALE Mechanical structures for electronic equipment Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series Part 4: Cooling performance tests for water supplied heat exchangers in electronic cabinets St

2、ructures mcaniques pour quipements lectroniques Gestion thermique pour les armoires conformes aux sries CEI 60297 et CEI 60917 Partie 4: Essais de performances de refroidissement pour les changeurs de chaleur aliments par de leau dans des baies lectroniques IEC 62610-4:2013 THIS PUBLICATION IS COPYR

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17、nical structures for electronic equipment Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series Part 4: Cooling performance tests for water supplied heat exchangers in electronic cabinets Structures mcaniques pour quipements lectroniques Gestion thermique pour les armoire

18、s conformes aux sries CEI 60297 et CEI 60917 Partie 4: Essais de performances de refroidissement pour les changeurs de chaleur aliments par de leau dans des baies lectroniques INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE R ICS 31.240 PRICE CODE CODE PRIX ISBN

19、978-2-8322-1037-6 Registered trademark of the International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internationale Warning! Make sure that you obtained this publication from an authorized distributor. Attention! Veuillez vous assurer que vous avez obtenu cette publ

20、ication via un distributeur agr. 2 62610-4 IEC:2013 CONTENTS FOREWORD . 3 INTRODUCTION . 5 1 Scope and object 6 2 Normative references . 6 3 Terms and definitions, symbols and units . 6 3.1 Terms and definitions 6 3.2 Symbols and units . 7 4 Performance test for the heat exchanger 8 4.1 General . 8

21、4.2 Test setup . 9 Test room 9 4.2.1Simulating the equipment heat load in the test sample. 9 4.2.2Chilled-water flow rate and temperatures . 10 4.2.3Measurement of the air temperature 10 4.2.4Temperature difference between chilled water supply and equipment 4.2.5 air inlet temperature 11 4.3 Assessm

22、ent of the heat exchanger performance . 11 Determination of the cooling capacity by means of simplified tests 11 4.3.1Determination of the cooling capacity by way of an extended test 12 4.3.2Complete identification of the cooling capacity. 14 4.3.3 4.4 Electrical power consumption 16 4.5 Water circu

23、it pressure resistance 16 Annex A (normative) Test conditions 17 Annex B (normative) Test results . 18 Figure 1 Principle of the heat exchanger performance test . 9 Figure 2 Test setup of simplified tests 12 Figure 3 Test setup of extended tests 14 Figure 4 Test setup, test for complete identificati

24、on of the cooling capacity 15 Figure 5 Diagram of electrical power consumption versus cooling capacity 16 Figure 6 Diagram of water pressure resistance versus water flow rate . 16 Figure B.1 System cooling capacity and water flow rate . 19 Table B.1 Test result recording template 18 Table B.2 Test f

25、or closed air loop air to water heat exchanger for high density cooling systems for IT equipment and server cooling 19 62610-4 IEC:2013 3 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ MECHANICAL STRUCTURES FOR ELECTRONIC EQUIPMENT THERMAL MANAGEMENT FOR CABINETS IN ACCORDANCE WITH IEC 60297 AND IEC 60

26、917 SERIES Part 4: Cooling performance tests for water supplied heat exchangers in electronic cabinets FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The ob

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37、EC 62610-4 has been prepared by subcommittee 48D: Mechanical structures for electronic equipment, of IEC technical committee 48: Electromechanical components and mechanical structures for electronic equipment. The text of this standard is based on the following documents: FDIS Report on voting 48D/5

38、42/FDIS 48D/545/RVD Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. 4 62610-4 IEC:2013 A list of all parts of IEC 62610 series, und

39、er the general title Mechanical structures for electronic equipment Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series, can be found on the IEC website. The committee has decided that the contents of this publication will remain unchanged until the stability date indic

40、ated on the IEC web site under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication will be reconfirmed, withdrawn, replaced by a revised edition, or amended. 62610-4 IEC:2013 5 INTRODUCTION Electronic cabinets of the IEC 60297 and IEC 60917 series a

41、re used for the housing of electronic devices in many different fields of application. A wide field of application is represented by installations of communication networks with electronic devices in information technology (IT) environments. The classic way is to install rows of cabinets into define

42、d foot print patterns and interconnect them via cables managed from overhead cable trays or raised floor cable management. So far, cooling has been facilitated by equipping the entire IT room with air conditioning in order to provide for air flow and air temperatures required for the safe operation

43、of the electronic devices. With the growing heat load in data centers, this form of cooling has become more and more inefficient. Thermal problems with respect to high- performance electronic devices have become more difficult to solve. The environmental aspect is gaining crucial importance forcing

44、us to cut down on wasting resources and to reduce CO 2emissions. Alternatives to the air conditioning of rooms need to be looked at more closely. Under the aspect of increasing cooling efficiency, there are some major concepts, two cases serve as examples here: Case 1. The equipped group of cabinets

45、, with dedicated temperature control. This method is the cold aisles / hot aisles arrangement of a smaller number of cabinets, typically four to twelve. Its advantage over the air conditioning of rooms is the smaller air volume which allows a focused heat management with optimised dimensioning of po

46、wer consumption for the cooling devices and increased temperatures in the warm zones of the room. In such cases, efficiency can be increased by adopting exhaust heat recovery for room heating in cold periods. Due to the improved energy efficiency contained aisles are becoming more and more popular.

47、Case 2. Single cabinets with water-air heat exchangers. This method is used for cabinets accommodating high-performance/heat dissipating electronic equipment, typically servers and mainframe computers. Its advantage over the room air conditioning or cold aisles consists in the high degree of constan

48、t air inlet temperature for sensitive electronic devices. Closed air circulation within a cabinet allows a very precise temperature control. The power consumption aspect may be similar to that of the cold aisle, but the temperature control aspect is more important and favourable to a longer life-cyc

49、le of costly equipment. This standard has been created for case 2: Cooling performance tests for water-supplied heat exchangers in single electronic cabinet configurations. The parameters with reference to the described test sample are shown in diagrams which may be useful to provide for a standardized calculation method for specific cabinet dimensions and heat exchanger cooling requirements. The typical required coolin