1、 IEC 62610-4 Edition 1.0 2013-08 INTERNATIONAL STANDARD NORME INTERNATIONALE Mechanical structures for electronic equipment Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series Part 4: Cooling performance tests for water supplied heat exchangers in electronic cabinets St
2、ructures mcaniques pour quipements lectroniques Gestion thermique pour les armoires conformes aux sries CEI 60297 et CEI 60917 Partie 4: Essais de performances de refroidissement pour les changeurs de chaleur aliments par de leau dans des baies lectroniques IEC 62610-4:2013 THIS PUBLICATION IS COPYR
3、IGHT PROTECTED Copyright 2013 IEC, Geneva, Switzerland All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from either IEC
4、 or IECs member National Committee in the country of the requester. If you have any questions about IEC copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or your local IEC member National Committee for further information. Droits de
5、reproduction rservs. Sauf indication contraire, aucune partie de cette publication ne peut tre reproduite ni utilise sous quelque forme que ce soit et par aucun procd, lectronique ou mcanique, y compris la photocopie et les microfilms, sans laccord crit de la CEI ou du Comit national de la CEI du pa
6、ys du demandeur. Si vous avez des questions sur le copyright de la CEI ou si vous dsirez obtenir des droits supplmentaires sur cette publication, utilisez les coordonnes ci-aprs ou contactez le Comit national de la CEI de votre pays de rsidence. IEC Central Office Tel.: +41 22 919 02 11 3, rue de Va
7、remb Fax: +41 22 919 03 00 CH-1211 Geneva 20 infoiec.ch Switzerland www.iec.ch About the IEC The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes International Standards for all electrical, electronic and related technologies. About IEC p
8、ublications The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the latest edition, a corrigenda or an amendment might have been published. Useful links: IEC publications search - www.iec.ch/searchpub The advanced search enables you to f
9、ind IEC publications by a variety of criteria (reference number, text, technical committee,). It also gives information on projects, replaced and withdrawn publications. IEC Just Published - webstore.iec.ch/justpublished Stay up to date on all new IEC publications. Just Published details all new pub
10、lications released. Available on-line and also once a month by email. Electropedia - www.electropedia.org The worlds leading online dictionary of electronic and electrical terms containing more than 30 000 terms and definitions in English and French, with equivalent terms in additional languages. Al
11、so known as the International Electrotechnical Vocabulary (IEV) on-line. Customer Service Centre - webstore.iec.ch/csc If you wish to give us your feedback on this publication or need further assistance, please contact the Customer Service Centre: csciec.ch. A propos de la CEI La Commission Electrot
12、echnique Internationale (CEI) est la premire organisation mondiale qui labore et publie des Normes internationales pour tout ce qui a trait llectricit, llectronique et aux technologies apparentes. A propos des publications CEI Le contenu technique des publications de la CEI est constamment revu. Veu
13、illez vous assurer que vous possdez ldition la plus rcente, un corrigendum ou amendement peut avoir t publi. Liens utiles: Recherche de publications CEI - www.iec.ch/searchpub La recherche avance vous permet de trouver des publications CEI en utilisant diffrents critres (numro de rfrence, texte, com
14、it dtudes,). Elle donne aussi des informations sur les projets et les publications remplaces ou retires. Just Published CEI - webstore.iec.ch/justpublished Restez inform sur les nouvelles publications de la CEI. Just Published dtaille les nouvelles publications parues. Disponible en ligne et aussi u
15、ne fois par mois par email. Electropedia - www.electropedia.org Le premier dictionnaire en ligne au monde de termes lectroniques et lectriques. Il contient plus de 30 000 termes et dfinitions en anglais et en franais, ainsi que les termes quivalents dans les langues additionnelles. Egalement appel V
16、ocabulaire Electrotechnique International (VEI) en ligne. Service Clients - webstore.iec.ch/csc Si vous dsirez nous donner des commentaires sur cette publication ou si vous avez des questions contactez-nous: csciec.ch. IEC 62610-4 Edition 1.0 2013-08 INTERNATIONAL STANDARD NORME INTERNATIONALE Mecha
17、nical structures for electronic equipment Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series Part 4: Cooling performance tests for water supplied heat exchangers in electronic cabinets Structures mcaniques pour quipements lectroniques Gestion thermique pour les armoire
18、s conformes aux sries CEI 60297 et CEI 60917 Partie 4: Essais de performances de refroidissement pour les changeurs de chaleur aliments par de leau dans des baies lectroniques INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE R ICS 31.240 PRICE CODE CODE PRIX ISBN
19、978-2-8322-1037-6 Registered trademark of the International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internationale Warning! Make sure that you obtained this publication from an authorized distributor. Attention! Veuillez vous assurer que vous avez obtenu cette publ
20、ication via un distributeur agr. 2 62610-4 IEC:2013 CONTENTS FOREWORD . 3 INTRODUCTION . 5 1 Scope and object 6 2 Normative references . 6 3 Terms and definitions, symbols and units . 6 3.1 Terms and definitions 6 3.2 Symbols and units . 7 4 Performance test for the heat exchanger 8 4.1 General . 8
21、4.2 Test setup . 9 Test room 9 4.2.1Simulating the equipment heat load in the test sample. 9 4.2.2Chilled-water flow rate and temperatures . 10 4.2.3Measurement of the air temperature 10 4.2.4Temperature difference between chilled water supply and equipment 4.2.5 air inlet temperature 11 4.3 Assessm
22、ent of the heat exchanger performance . 11 Determination of the cooling capacity by means of simplified tests 11 4.3.1Determination of the cooling capacity by way of an extended test 12 4.3.2Complete identification of the cooling capacity. 14 4.3.3 4.4 Electrical power consumption 16 4.5 Water circu
23、it pressure resistance 16 Annex A (normative) Test conditions 17 Annex B (normative) Test results . 18 Figure 1 Principle of the heat exchanger performance test . 9 Figure 2 Test setup of simplified tests 12 Figure 3 Test setup of extended tests 14 Figure 4 Test setup, test for complete identificati
24、on of the cooling capacity 15 Figure 5 Diagram of electrical power consumption versus cooling capacity 16 Figure 6 Diagram of water pressure resistance versus water flow rate . 16 Figure B.1 System cooling capacity and water flow rate . 19 Table B.1 Test result recording template 18 Table B.2 Test f
25、or closed air loop air to water heat exchanger for high density cooling systems for IT equipment and server cooling 19 62610-4 IEC:2013 3 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ MECHANICAL STRUCTURES FOR ELECTRONIC EQUIPMENT THERMAL MANAGEMENT FOR CABINETS IN ACCORDANCE WITH IEC 60297 AND IEC 60
26、917 SERIES Part 4: Cooling performance tests for water supplied heat exchangers in electronic cabinets FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The ob
27、ject of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specificat
28、ions (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non- governmental organizations lia
29、ising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters expre
30、ss, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC National Committees. 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committ
31、ees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National
32、 Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC itself does not
33、 provide any attestation of conformity. Independent certification bodies provide conformity assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any services carried out by independent certification bodies. 6) All users should ensure that they have th
34、e latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever
35、, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications
36、 is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard I
37、EC 62610-4 has been prepared by subcommittee 48D: Mechanical structures for electronic equipment, of IEC technical committee 48: Electromechanical components and mechanical structures for electronic equipment. The text of this standard is based on the following documents: FDIS Report on voting 48D/5
38、42/FDIS 48D/545/RVD Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. 4 62610-4 IEC:2013 A list of all parts of IEC 62610 series, und
39、er the general title Mechanical structures for electronic equipment Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series, can be found on the IEC website. The committee has decided that the contents of this publication will remain unchanged until the stability date indic
40、ated on the IEC web site under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication will be reconfirmed, withdrawn, replaced by a revised edition, or amended. 62610-4 IEC:2013 5 INTRODUCTION Electronic cabinets of the IEC 60297 and IEC 60917 series a
41、re used for the housing of electronic devices in many different fields of application. A wide field of application is represented by installations of communication networks with electronic devices in information technology (IT) environments. The classic way is to install rows of cabinets into define
42、d foot print patterns and interconnect them via cables managed from overhead cable trays or raised floor cable management. So far, cooling has been facilitated by equipping the entire IT room with air conditioning in order to provide for air flow and air temperatures required for the safe operation
43、of the electronic devices. With the growing heat load in data centers, this form of cooling has become more and more inefficient. Thermal problems with respect to high- performance electronic devices have become more difficult to solve. The environmental aspect is gaining crucial importance forcing
44、us to cut down on wasting resources and to reduce CO 2emissions. Alternatives to the air conditioning of rooms need to be looked at more closely. Under the aspect of increasing cooling efficiency, there are some major concepts, two cases serve as examples here: Case 1. The equipped group of cabinets
45、, with dedicated temperature control. This method is the cold aisles / hot aisles arrangement of a smaller number of cabinets, typically four to twelve. Its advantage over the air conditioning of rooms is the smaller air volume which allows a focused heat management with optimised dimensioning of po
46、wer consumption for the cooling devices and increased temperatures in the warm zones of the room. In such cases, efficiency can be increased by adopting exhaust heat recovery for room heating in cold periods. Due to the improved energy efficiency contained aisles are becoming more and more popular.
47、Case 2. Single cabinets with water-air heat exchangers. This method is used for cabinets accommodating high-performance/heat dissipating electronic equipment, typically servers and mainframe computers. Its advantage over the room air conditioning or cold aisles consists in the high degree of constan
48、t air inlet temperature for sensitive electronic devices. Closed air circulation within a cabinet allows a very precise temperature control. The power consumption aspect may be similar to that of the cold aisle, but the temperature control aspect is more important and favourable to a longer life-cyc
49、le of costly equipment. This standard has been created for case 2: Cooling performance tests for water-supplied heat exchangers in single electronic cabinet configurations. The parameters with reference to the described test sample are shown in diagrams which may be useful to provide for a standardized calculation method for specific cabinet dimensions and heat exchanger cooling requirements. The typical required coolin
