IEC TS 62610-1-2009 Mechanical structures for electronic equipment - Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 - Part 1 Design guide Interface dime.pdf

1、 IEC/TS 62610-1 Edition 1.0 2009-09 TECHNICAL SPECIFICATIONMechanical structures for electronic equipment Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series Part 1: Design guide: Interface dimension and provision for thermoelectrical cooling systems (Peltier effect) IE

2、C/TS 62610-1:2009(E) colour inside THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2009 IEC, Geneva, Switzerland All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form or by any means, electronic or mechanical, including photocopying

3、and microfilm, without permission in writing from either IEC or IECs member National Committee in the country of the requester. If you have any questions about IEC copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or your local IEC m

4、ember National Committee for further information. Droits de reproduction rservs. Sauf indication contraire, aucune partie de cette publication ne peut tre reproduite ni utilise sous quelque forme que ce soit et par aucun procd, lectronique ou mcanique, y compris la photocopie et les microfilms, sans

5、 laccord crit de la CEI ou du Comit national de la CEI du pays du demandeur. Si vous avez des questions sur le copyright de la CEI ou si vous dsirez obtenir des droits supplmentaires sur cette publication, utilisez les coordonnes ci-aprs ou contactez le Comit national de la CEI de votre pays de rsid

6、ence. IEC Central Office 3, rue de Varemb CH-1211 Geneva 20 Switzerland Email: inmailiec.ch Web: www.iec.ch About IEC publications The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the latest edition, a corrigenda or an amendment might

7、 have been published. Catalogue of IEC publications: www.iec.ch/searchpub The IEC on-line Catalogue enables you to search by a variety of criteria (reference number, text, technical committee,). It also gives information on projects, withdrawn and replaced publications. IEC Just Published: www.iec.c

8、h/online_news/justpub Stay up to date on all new IEC publications. Just Published details twice a month all new publications released. Available on-line and also by email. Electropedia: www.electropedia.org The worlds leading online dictionary of electronic and electrical terms containing more than

9、20 000 terms and definitions in English and French, with equivalent terms in additional languages. Also known as the International Electrotechnical Vocabulary online. Customer Service Centre: www.iec.ch/webstore/custserv If you wish to give us your feedback on this publication or need further assist

10、ance, please visit the Customer Service Centre FAQ or contact us: Email: csciec.ch Tel.: +41 22 919 02 11 Fax: +41 22 919 03 00 IEC/TS 62610-1 Edition 1.0 2009-09 TECHNICAL SPECIFICATIONMechanical structures for electronic equipment Thermal management for cabinets in accordance with IEC 60297 and IE

11、C 60917 series Part 1: Design guide: Interface dimension and provision for thermoelectrical cooling systems (Peltier effect) INTERNATIONAL ELECTROTECHNICAL COMMISSION T ICS 31.240 PRICE CODE ISBN 2-8318-1061-1 Registered trademark of the International Electrotechnical Commission colour inside 2 TS 6

12、2610-1 IEC:2009(E) CONTENTS FOREWORD.4 INTRODUCTION.6 1 Scope.7 2 Normative references .7 3 Arrangement overview7 4 Mounting location 1: cabinet with inside or outside mounted thermoelectrical cooling system in a vertical alignment 8 4.1 Cabinet with inside mounted thermoelectrical cooling system in

13、 a vertical alignment 8 4.1.1 General .8 4.1.2 Overview .8 4.1.3 Performance guideline for cabinets with inside or outside mounted thermoelectrical cooling system.10 4.2 Cabinet with inside mounted thermoelectrical cooling system in a horizontal alignment 12 5 Mounting location 2: cabinet with top m

14、ounted thermoelectrical cooling system for the cooling of a whole cabinet 13 5.1 Overview.13 5.2 Cooling performance in cabinets with top mounted thermoelectrical cooling systems.14 6 Mounting location 3: cabinet with inbuilt thermoelectrical cooling system for hot spot cooling14 6.1 Overview.14 6.2

15、 Cooling performance for an inbuilt thermoelectrical cooling system for hot spot cooling.16 7 Remark 16 Annex A (informative) Heat management under environmental aspects .18 Bibliography23 Figure 1 Arrangement overview .8 Figure 2 Mounting location 19 Figure 3 Mounting location 1: arrangement of two

16、 cabinets with inside mounted Peltier system and minimized distance W 1 10 Figure 4 Performance guideline for cabinets with inside mounted thermoelectrical cooling system11 Figure 5 Mounting location 1a: cabinet with side mounted thermoelectrical cooling system in a horizontal alignment.12 Figure 6

17、Mounting location 2: cabinet with top mounted thermoelectrical cooling system13 Figure 7 Performance guideline for a top mounted thermoelectrical cooling system .14 Figure 8 Mounting location 315 Figure 9 Performance guideline for inbuilt thermoelectrical cooling system for hot spot cooling 16 Figur

18、e A.1 Current CO 2emission situation.19 Figure A.2 Changes in greenhouse gases from ice-core and modern data 5 19 Figure A.3 Radiative forcing of climate between 1750 and 2005 420 TS 62610-1 IEC:2009(E) 3 Figure A.4 Coefficient of performance depending on the cooling power at the boundary conditions

19、 of T a= 50 C 21 Figure A.5 Electrical power usage of compressor cooling unit versus Peltier cooling unit at given ambient temperature and given heating dissipation to keep the internal temperature fixed22 Table A.1 Advantages and disadvantages of different cooling systems 22 4 TS 62610-1 IEC:2009(E

20、) INTERNATIONAL ELECTROTECHNICAL COMMISSION _ MECHANICAL STRUCTURES FOR ELECTRONIC EQUIPMENT THERMAL MANAGEMENT FOR CABINETS IN ACCORDANCE WITH IEC 60297 AND IEC 60917 SERIES Part 1: Design guide: Interface dimension and provision for thermoelectrical cooling systems (Peltier effect) FOREWORD 1) The

21、 International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and

22、 electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical com

23、mittees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non- governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization

24、for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committ

25、ee has representation from all interested IEC National Committees. 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is a

26、ccurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and reg

27、ional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any equipment declared to be in conform

28、ity with an IEC Publication. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any

29、personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative

30、 references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsibl

31、e for identifying any or all such patent rights. The main task of IEC technical committees is to prepare International Standards. In exceptional circumstances, a technical committee may propose the publication of a technical specification when the required support cannot be obtained for the publicat

32、ion of an International Standard, despite repeated efforts, or the subject is still under technical development or where, for any other reason, there is the future but no immediate possibility of an agreement on an International Standard. Technical specifications are subject to review within three y

33、ears of publication to decide whether they can be transformed into International Standards. IEC 62610-1, which is a technical specification, has been prepared by subcommittee 48D: Mechanical structures for electronic equipment, of IEC technical committee 48: Electromechanical components and mechanic

34、al structures for electronic equipment. TS 62610-1 IEC:2009(E) 5 The text of this technical specification is based on the following documents: Enquiry draft Report on voting 48D/393/DTS 48D/405/RVC Full information on the voting for the approval of this technical specification can be found in the re

35、port on voting indicated in the above table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. A list of all parts of the IEC 62610 series can be found, under the general title Mechanical structures for electronic equipment Thermal management for cabinets in accord

36、ance with IEC 60297 and IEC 60917 series, on the IEC website. The committee has decided that the contents of this publication will remain unchanged until the maintenance result date indicated on the IEC web site under “http:/webstore.iec.ch“ in the data related to the specific publication. At this d

37、ate, the publication will be transformed into an International standard, reconfirmed, withdrawn, replaced by a revised edition, or amended. A bilingual version of this standard may be issued at a later date. IMPORTANT The “colour inside” logo on the cover page of this publication indicates that it c

38、ontains colours which are considered to be useful for the correct understanding of its contents. Users should therefore print this publication using a colour printer. 6 TS 62610-1 IEC:2009(E) INTRODUCTION According to the Kyoto Protocol and to the directives of the European Parliament and of the Cou

39、ncil, the usage of coolants with high potential for environmental pollution and global warming (Global Warming Potential (GWP) factor) is to be avoided. The most promising alternatives to compressor cooling with e.g. R 134a are compressor cooling with CO 2 , active cooling based on the Peltier effec

40、t and absorption cooling systems. Each of these techniques has its advantages and disadvantages. The compressor cooling with CO 2at the current state is more or less efficient, but high installation costs due to working pressures up to 100 bars makes this technique less interesting. Another disadvan

41、tage of CO 2cooling systems occurs out of the physical properties of this coolant and requires additional cooling power to run this process. This fact reduces the degree of efficiency enormously. The Peltier-effect seems to be very promising as the cooling effect is highly dependent of the propertie

42、s of the material. Newly tested materials based on either porous materials or nano- structures show an improvement of the degree of efficiency. Furthermore, Peltier techniques do not need any kind of coolant and the only moving parts are the fans. The absorption technique is a very intelligent way f

43、or cooling, but it is only profitable in combination with a heat-regenerator what makes absorption cooling system only feasible in very few applications. For more details on mentioned alternatives for cooling, please see Annex A. With respect to the demands of industry concerning high heat density/h

44、otspots cooling, available space for the cooling systems, adapting to existing infrastructures, noise emission and respectively to the fact that conventional coolants like R 134a need to be replaced, this technical specification was initiated for the definition of dimensional interfaces and performa

45、nces guidelines for thermoelectrical cooling systems based on the Peltier effect. Three different arrangements for thermoelectrical cooling systems within cabinets, called “mounting locations”, have been regarded where locations 1 and 2 are feasible for cooling a whole cabinet and location 3 is for

46、hotspot cooling inside the cabinet. Below is the definition of each mounting location for thermoelectrical cooling systems within cabinets: mounting location 1: cabinet with inside or outside mounted thermoelectrical cooling system for the cooling of a whole cabinet; mounting location 2: cabinet wit

47、h top mounted thermoelectrical cooling system for the cooling of a whole cabinet; mounting location 3: cabinet with inbuilt thermoelectrical cooling system in form of a subrack for hot spot cooling. For a clear definition of interface dimensions and cooling performance guidelines, only cabinets from

48、 the IEC 60297 (19 inch) and IEC 60917 (25 mm) series have been regarded. TS 62610-1 IEC:2009(E) 7 MECHANICAL STRUCTURES FOR ELECTRONIC EQUIPMENT THERMAL MANAGEMENT FOR CABINETS IN ACCORDANCE WITH IEC 60297 AND IEC 60917 SERIES Part 1: Design guide: Interface dimension and provision for thermoelectr

49、ical cooling systems (Peltier effect) 1 Scope This Technical Specification provides guidelines for the installation of thermoelectrical cooling systems (Peltier effect) within cabinets of the IEC 60297 (19 inch) and IEC 60917 (25 mm) series. The cooling performance is in direct relation with the mounting location within a cabinet. Three typical mounting locations are identified: mounting location 1: cabinet with inside or outsid