1、 IEC/TS 62610-1 Edition 1.0 2009-09 TECHNICAL SPECIFICATIONMechanical structures for electronic equipment Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series Part 1: Design guide: Interface dimension and provision for thermoelectrical cooling systems (Peltier effect) IE
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10、ance, please visit the Customer Service Centre FAQ or contact us: Email: csciec.ch Tel.: +41 22 919 02 11 Fax: +41 22 919 03 00 IEC/TS 62610-1 Edition 1.0 2009-09 TECHNICAL SPECIFICATIONMechanical structures for electronic equipment Thermal management for cabinets in accordance with IEC 60297 and IE
11、C 60917 series Part 1: Design guide: Interface dimension and provision for thermoelectrical cooling systems (Peltier effect) INTERNATIONAL ELECTROTECHNICAL COMMISSION T ICS 31.240 PRICE CODE ISBN 2-8318-1061-1 Registered trademark of the International Electrotechnical Commission colour inside 2 TS 6
12、2610-1 IEC:2009(E) CONTENTS FOREWORD.4 INTRODUCTION.6 1 Scope.7 2 Normative references .7 3 Arrangement overview7 4 Mounting location 1: cabinet with inside or outside mounted thermoelectrical cooling system in a vertical alignment 8 4.1 Cabinet with inside mounted thermoelectrical cooling system in
13、 a vertical alignment 8 4.1.1 General .8 4.1.2 Overview .8 4.1.3 Performance guideline for cabinets with inside or outside mounted thermoelectrical cooling system.10 4.2 Cabinet with inside mounted thermoelectrical cooling system in a horizontal alignment 12 5 Mounting location 2: cabinet with top m
14、ounted thermoelectrical cooling system for the cooling of a whole cabinet 13 5.1 Overview.13 5.2 Cooling performance in cabinets with top mounted thermoelectrical cooling systems.14 6 Mounting location 3: cabinet with inbuilt thermoelectrical cooling system for hot spot cooling14 6.1 Overview.14 6.2
15、 Cooling performance for an inbuilt thermoelectrical cooling system for hot spot cooling.16 7 Remark 16 Annex A (informative) Heat management under environmental aspects .18 Bibliography23 Figure 1 Arrangement overview .8 Figure 2 Mounting location 19 Figure 3 Mounting location 1: arrangement of two
16、 cabinets with inside mounted Peltier system and minimized distance W 1 10 Figure 4 Performance guideline for cabinets with inside mounted thermoelectrical cooling system11 Figure 5 Mounting location 1a: cabinet with side mounted thermoelectrical cooling system in a horizontal alignment.12 Figure 6
17、Mounting location 2: cabinet with top mounted thermoelectrical cooling system13 Figure 7 Performance guideline for a top mounted thermoelectrical cooling system .14 Figure 8 Mounting location 315 Figure 9 Performance guideline for inbuilt thermoelectrical cooling system for hot spot cooling 16 Figur
18、e A.1 Current CO 2emission situation.19 Figure A.2 Changes in greenhouse gases from ice-core and modern data 5 19 Figure A.3 Radiative forcing of climate between 1750 and 2005 420 TS 62610-1 IEC:2009(E) 3 Figure A.4 Coefficient of performance depending on the cooling power at the boundary conditions
19、 of T a= 50 C 21 Figure A.5 Electrical power usage of compressor cooling unit versus Peltier cooling unit at given ambient temperature and given heating dissipation to keep the internal temperature fixed22 Table A.1 Advantages and disadvantages of different cooling systems 22 4 TS 62610-1 IEC:2009(E
20、) INTERNATIONAL ELECTROTECHNICAL COMMISSION _ MECHANICAL STRUCTURES FOR ELECTRONIC EQUIPMENT THERMAL MANAGEMENT FOR CABINETS IN ACCORDANCE WITH IEC 60297 AND IEC 60917 SERIES Part 1: Design guide: Interface dimension and provision for thermoelectrical cooling systems (Peltier effect) FOREWORD 1) The
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33、ears of publication to decide whether they can be transformed into International Standards. IEC 62610-1, which is a technical specification, has been prepared by subcommittee 48D: Mechanical structures for electronic equipment, of IEC technical committee 48: Electromechanical components and mechanic
34、al structures for electronic equipment. TS 62610-1 IEC:2009(E) 5 The text of this technical specification is based on the following documents: Enquiry draft Report on voting 48D/393/DTS 48D/405/RVC Full information on the voting for the approval of this technical specification can be found in the re
35、port on voting indicated in the above table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. A list of all parts of the IEC 62610 series can be found, under the general title Mechanical structures for electronic equipment Thermal management for cabinets in accord
36、ance with IEC 60297 and IEC 60917 series, on the IEC website. The committee has decided that the contents of this publication will remain unchanged until the maintenance result date indicated on the IEC web site under “http:/webstore.iec.ch“ in the data related to the specific publication. At this d
37、ate, the publication will be transformed into an International standard, reconfirmed, withdrawn, replaced by a revised edition, or amended. A bilingual version of this standard may be issued at a later date. IMPORTANT The “colour inside” logo on the cover page of this publication indicates that it c
38、ontains colours which are considered to be useful for the correct understanding of its contents. Users should therefore print this publication using a colour printer. 6 TS 62610-1 IEC:2009(E) INTRODUCTION According to the Kyoto Protocol and to the directives of the European Parliament and of the Cou
39、ncil, the usage of coolants with high potential for environmental pollution and global warming (Global Warming Potential (GWP) factor) is to be avoided. The most promising alternatives to compressor cooling with e.g. R 134a are compressor cooling with CO 2 , active cooling based on the Peltier effec
40、t and absorption cooling systems. Each of these techniques has its advantages and disadvantages. The compressor cooling with CO 2at the current state is more or less efficient, but high installation costs due to working pressures up to 100 bars makes this technique less interesting. Another disadvan
41、tage of CO 2cooling systems occurs out of the physical properties of this coolant and requires additional cooling power to run this process. This fact reduces the degree of efficiency enormously. The Peltier-effect seems to be very promising as the cooling effect is highly dependent of the propertie
42、s of the material. Newly tested materials based on either porous materials or nano- structures show an improvement of the degree of efficiency. Furthermore, Peltier techniques do not need any kind of coolant and the only moving parts are the fans. The absorption technique is a very intelligent way f
43、or cooling, but it is only profitable in combination with a heat-regenerator what makes absorption cooling system only feasible in very few applications. For more details on mentioned alternatives for cooling, please see Annex A. With respect to the demands of industry concerning high heat density/h
44、otspots cooling, available space for the cooling systems, adapting to existing infrastructures, noise emission and respectively to the fact that conventional coolants like R 134a need to be replaced, this technical specification was initiated for the definition of dimensional interfaces and performa
45、nces guidelines for thermoelectrical cooling systems based on the Peltier effect. Three different arrangements for thermoelectrical cooling systems within cabinets, called “mounting locations”, have been regarded where locations 1 and 2 are feasible for cooling a whole cabinet and location 3 is for
46、hotspot cooling inside the cabinet. Below is the definition of each mounting location for thermoelectrical cooling systems within cabinets: mounting location 1: cabinet with inside or outside mounted thermoelectrical cooling system for the cooling of a whole cabinet; mounting location 2: cabinet wit
47、h top mounted thermoelectrical cooling system for the cooling of a whole cabinet; mounting location 3: cabinet with inbuilt thermoelectrical cooling system in form of a subrack for hot spot cooling. For a clear definition of interface dimensions and cooling performance guidelines, only cabinets from
48、 the IEC 60297 (19 inch) and IEC 60917 (25 mm) series have been regarded. TS 62610-1 IEC:2009(E) 7 MECHANICAL STRUCTURES FOR ELECTRONIC EQUIPMENT THERMAL MANAGEMENT FOR CABINETS IN ACCORDANCE WITH IEC 60297 AND IEC 60917 SERIES Part 1: Design guide: Interface dimension and provision for thermoelectr
49、ical cooling systems (Peltier effect) 1 Scope This Technical Specification provides guidelines for the installation of thermoelectrical cooling systems (Peltier effect) within cabinets of the IEC 60297 (19 inch) and IEC 60917 (25 mm) series. The cooling performance is in direct relation with the mounting location within a cabinet. Three typical mounting locations are identified: mounting location 1: cabinet with inside or outsid
