IEC TS 62610-3-2009 Mechanical structures for electronic equipment - Thermal management for cabinets in accordance with IEC 60297 and 60917 series - Part 3 Design guide Evaluation .pdf

1、 IEC/TS 62610-3 Edition 1.0 2009-12 TECHNICAL SPECIFICATIONMechanical structures for electronic equipment Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series Part 3: Design guide: Evaluation method for thermoelectrical cooling systems (Peltier effect) IEC/TS 62610-3:200

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10、, please visit the Customer Service Centre FAQ or contact us: Email: 6Hcsciec.ch Tel.: +41 22 919 02 11 Fax: +41 22 919 03 00 IEC/TS 62610-3 Edition 1.0 2009-12 TECHNICAL SPECIFICATIONMechanical structures for electronic equipment Thermal management for cabinets in accordance with IEC 60297 and IEC

11、60917 series Part 3: Design guide: Evaluation method for thermoelectrical cooling systems (Peltier effect) INTERNATIONAL ELECTROTECHNICAL COMMISSION U ICS 31.240 PRICE CODE ISBN 2-8318-1071-6 Registered trademark of the International Electrotechnical Commission colour inside 2 TS 62610-3 IEC:2009(E)

12、 CONTENTS FOREWORD. 0H3 INTRODUCTION. 1H5 1 Scope and object 2H6 2 Normative references . 3H6 3 Abbreviations, symbols and indices 4H6 3.1 Abbreviations 5H6 3.2 Symbols 6H7 3.3 Indices 7H7 4 Theory of the thermoelectrical cooling system 8H7 4.1 The Peltier element . 9H7 4.2 Thermoelectrical cooling

13、systems 10H8 5 Measurement setup 11H12 6 Interpretation and evaluation 12H13 Annex A (informative) Sample calculation 13H17 Bibliography 14H30 Figure 1 Principles of the thermoelectrical cooling system . 15H9 Figure 2 Thermal resistances. 16H10 Figure 3 Thermodynamic system boundaries of a thermoele

14、ctrical cooling system attached to a closed cabinet . 17H11 Figure 4 Measurement setup 18H12 Figure 5 Results of the measurement. 19H14 Figure 6 Example for a specification sheet of a thermoelectrical cooling system (Peltier) 20H16 Figure A.1 Mollier h-x-diagram for humid air 21H20 Figure A.2 Princi

15、ples of the Peltier effect . 22H21 Figure A.3 Illustration for Z dependent on the number of charge carrier . 23H22 Figure A.4 Influence of the Figure of Merit ZT on the efficiency of the Peltier device 24H22 Figure A.5 Thermodynamic system boundaries of a Peltier device . 25H23 Figure A.6 Thermal re

16、sistance of a thermoelectrical cooling system 26H24 Figure A.7 Typical temperature curve of a thermoelectrical cooling system 27H25 Figure A.8 Example for the thermal resistance between air and a heat sink as a function of the air velocity . 28H26 Figure A.9 Temperature distribution of a common heat

17、 sink for given boundary conditions . 29H26 Figure A.10 Illustration of the importance of the Thermal Interface Material (TIM) 30H27 Figure A.11 Dependency of the effective cooling power Q Con the difference T between inside temperature and ambient temperature 31H28 Table A.1 Measurement dataset. 32

18、H17 TS 62610-3 IEC:2009(E) 3 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ MECHANICAL STRUCTURES FOR ELECTRONIC EQUIPMENT THERMAL MANAGEMENT FOR CABINETS IN ACCORDANCE WITH IEC 60297 AND IEC 60917 SERIES Part 3: Design guide: Evaluation method for thermoelectrical cooling systems (Peltier effect) FORE

19、WORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the ele

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31、 possibility of an agreement on an International Standard. Technical specifications are subject to review within three years of publication to decide whether they can be transformed into International Standards. 4 TS 62610-3 IEC:2009(E) IEC 62610-3, which is a technical specification, has been prepa

32、red by subcommittee 48D: Mechanical structures for electronic equipment, of IEC technical committee 48: Electromechanical components and mechanical structures for electronic equipment. The text of this technical specification is based on the following documents: Enquiry draft Report on voting 48D/40

33、1/DTS 48D/414/RVC Full information on the voting for the approval of this technical specification can be found in the report on voting indicated in the above table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. A list of all parts of the IEC 62610 series can be

34、 found, under the general title Mechanical structures for electronic equipment Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series, on the IEC website. The committee has decided that the contents of this publication will remain unchanged until the maintenance result dat

35、e indicated on the IEC web site under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication will be transformed into an International standard, reconfirmed, withdrawn, replaced by a revised edition, or amended. A bilingual version of this publication

36、may be issued at a later date. IMPORTANT The colour inside logo on the cover page of this publication indicates that it contains colours which are considered to be useful for the correct understanding of its contents. Users should therefore print this document using a colour printer. TS 62610-3 IEC:

37、2009(E) 5 INTRODUCTION Besides the conventional compressor cooling there are several alternatives for cooling, for example: absorption cooling, thermoelectric cooling (Peltier), magneto caloric cooling, CO 2cooling and others. For the design of thermoelectrical cooling systems, values of the dissipa

38、tion loss depending on the ambient temperature and internal temperature are necessary. Thermoelectrical cooling systems performance is a function of ambient temperature, hot and cold side heat exchanger (heat sink) performance, thermal load, of the design of the Peltier device and of Peltier electri

39、cal parameters. Therefore an evaluation method has to be developed. This design guide allows a comparison of thermoelectrical cooling systems. 6 TS 62610-3 IEC:2009(E) MECHANICAL STRUCTURES FOR ELECTRONIC EQUIPMENT THERMAL MANAGEMENT FOR CABINETS IN ACCORDANCE WITH IEC 60297 AND IEC 60917 SERIES Par

40、t 3: Design guide: Evaluation method for thermoelectrical cooling systems (Peltier effect) 1 Scope and object This part of IEC 62610 provides an evaluation method for thermoelectrical cooling systems (Peltier effect).With this design guide it is possible to calculate the efficiency of the thermoelec

41、trical cooling system (Peltier effect) and its cooling power depending on the ambient temperature and internal temperature. This design guide can also be used to appraise thermoelectrical cooling systems by its efficiency. 2 Normative references The following referenced documents are indispensable f

42、or the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 62194:2005, Method of evaluating the thermal performance of enclosures 3 Abbreviations, symbols and

43、 indices For the purposes of this document, the following abbreviations, symbols and indices apply. 3.1 Abbreviations COP coefficient of performance - c Pheat capacity W/kgK D pipe diameter m I current A k overall heat transfer coefficient k W/ m 2 K n total number of Peltier devices - p pressures d

44、ifference Pa Q energy flow (thermal, electrical, conductivity) W Q Ceffective cooling power of the thermoelectrical cooling system (Peltier) W Q cPecooling power of a Peltier device at operating conditions W Q Dtotal dissipated heat flow on the hot side W Q Hheating power inside the cabinet W R Peel

45、ectrical resistance of the Peltier device V/A R ithermal resistance K/W S surface m 2 T temperature K V voltage V TS 62610-3 IEC:2009(E) 7 V &volume flow m 3 /s ZT Figure of Merit - 3.2 Symbols Seebeck coefficient V/K density kg/m thermal conductivity W/m 2 K electrical conductivity S/m = A/V relati

46、ve humidity 3.3 Indices 1-7 position marks A related to an air flow a ambient C effective cooling power c cold side D total dissipated and removed heat on the hot side E electrical power applied to the thermoelectrical cooling system F Fan H heating inside the cabinet h hotside i internal, inside th

47、e cabinet L heat loss m average Pe related to the Peltier device R reverse S related to the whole thermoelectrical cooling system 4 Theory of the thermoelectrical cooling system 4.1 The Peltier element The Peltier effect is the direct conversion of electric voltage to temperature differences and the

48、 reverse process is called Seebeck effect. Therefore a thermoelectrical cooling system (Peltier effect) transfers heat from one side of the device to the other side against the temperature gradient, with consumption of electrical energy. This Peltier effect is described by the following equation: ()

49、 W T T x S R I 2 1 T I Q c 4 h 4 Pe Pe Pe Pe 2 c Pe c = 1 The cooling power of one Peltier element cPe Q depends on different phenomena. 8 TS 62610-3 IEC:2009(E) The term c T I is the maximum cooling power based on the Peltier effect, whereas represents the Seebeck coefficient. The term Pe 2 R I 2 1 represents the J