1、 IEC/TS 62610-3 Edition 1.0 2009-12 TECHNICAL SPECIFICATIONMechanical structures for electronic equipment Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series Part 3: Design guide: Evaluation method for thermoelectrical cooling systems (Peltier effect) IEC/TS 62610-3:200
2、9(E) colour inside THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2009 IEC, Geneva, Switzerland All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form or by any means, electronic or mechanical, including photocopying and microfilm, w
3、ithout permission in writing from either IEC or IECs member National Committee in the country of the requester. If you have any questions about IEC copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or your local IEC member National C
4、ommittee for further information. Droits de reproduction rservs. Sauf indication contraire, aucune partie de cette publication ne peut tre reproduite ni utilise sous quelque forme que ce soit et par aucun procd, lectronique ou mcanique, y compris la photocopie et les microfilms, sans laccord crit de
5、 la CEI ou du Comit national de la CEI du pays du demandeur. Si vous avez des questions sur le copyright de la CEI ou si vous dsirez obtenir des droits supplmentaires sur cette publication, utilisez les coordonnes ci-aprs ou contactez le Comit national de la CEI de votre pays de rsidence. IEC Centra
6、l Office 3, rue de Varemb CH-1211 Geneva 20 Switzerland Email: 0Hinmailiec.ch Web: 1Hwww.iec.ch About IEC publications The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the latest edition, a corrigenda or an amendment might have been p
7、ublished. Catalogue of IEC publications: 2Hwww.iec.ch/searchpub The IEC on-line Catalogue enables you to search by a variety of criteria (reference number, text, technical committee,). It also gives information on projects, withdrawn and replaced publications. IEC Just Published: 3Hwww.iec.ch/online
8、_news/justpub Stay up to date on all new IEC publications. Just Published details twice a month all new publications released. Available on-line and also by email. Electropedia: 4Hwww.electropedia.org The worlds leading online dictionary of electronic and electrical terms containing more than 20 000
9、 terms and definitions in English and French, with equivalent terms in additional languages. Also known as the International Electrotechnical Vocabulary online. Customer Service Centre: 5Hwww.iec.ch/webstore/custserv If you wish to give us your feedback on this publication or need further assistance
10、, please visit the Customer Service Centre FAQ or contact us: Email: 6Hcsciec.ch Tel.: +41 22 919 02 11 Fax: +41 22 919 03 00 IEC/TS 62610-3 Edition 1.0 2009-12 TECHNICAL SPECIFICATIONMechanical structures for electronic equipment Thermal management for cabinets in accordance with IEC 60297 and IEC
11、60917 series Part 3: Design guide: Evaluation method for thermoelectrical cooling systems (Peltier effect) INTERNATIONAL ELECTROTECHNICAL COMMISSION U ICS 31.240 PRICE CODE ISBN 2-8318-1071-6 Registered trademark of the International Electrotechnical Commission colour inside 2 TS 62610-3 IEC:2009(E)
12、 CONTENTS FOREWORD. 0H3 INTRODUCTION. 1H5 1 Scope and object 2H6 2 Normative references . 3H6 3 Abbreviations, symbols and indices 4H6 3.1 Abbreviations 5H6 3.2 Symbols 6H7 3.3 Indices 7H7 4 Theory of the thermoelectrical cooling system 8H7 4.1 The Peltier element . 9H7 4.2 Thermoelectrical cooling
13、systems 10H8 5 Measurement setup 11H12 6 Interpretation and evaluation 12H13 Annex A (informative) Sample calculation 13H17 Bibliography 14H30 Figure 1 Principles of the thermoelectrical cooling system . 15H9 Figure 2 Thermal resistances. 16H10 Figure 3 Thermodynamic system boundaries of a thermoele
14、ctrical cooling system attached to a closed cabinet . 17H11 Figure 4 Measurement setup 18H12 Figure 5 Results of the measurement. 19H14 Figure 6 Example for a specification sheet of a thermoelectrical cooling system (Peltier) 20H16 Figure A.1 Mollier h-x-diagram for humid air 21H20 Figure A.2 Princi
15、ples of the Peltier effect . 22H21 Figure A.3 Illustration for Z dependent on the number of charge carrier . 23H22 Figure A.4 Influence of the Figure of Merit ZT on the efficiency of the Peltier device 24H22 Figure A.5 Thermodynamic system boundaries of a Peltier device . 25H23 Figure A.6 Thermal re
16、sistance of a thermoelectrical cooling system 26H24 Figure A.7 Typical temperature curve of a thermoelectrical cooling system 27H25 Figure A.8 Example for the thermal resistance between air and a heat sink as a function of the air velocity . 28H26 Figure A.9 Temperature distribution of a common heat
17、 sink for given boundary conditions . 29H26 Figure A.10 Illustration of the importance of the Thermal Interface Material (TIM) 30H27 Figure A.11 Dependency of the effective cooling power Q Con the difference T between inside temperature and ambient temperature 31H28 Table A.1 Measurement dataset. 32
18、H17 TS 62610-3 IEC:2009(E) 3 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ MECHANICAL STRUCTURES FOR ELECTRONIC EQUIPMENT THERMAL MANAGEMENT FOR CABINETS IN ACCORDANCE WITH IEC 60297 AND IEC 60917 SERIES Part 3: Design guide: Evaluation method for thermoelectrical cooling systems (Peltier effect) FORE
19、WORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the ele
20、ctrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to te
21、chnical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non- governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Or
22、ganization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each techni
23、cal committee has representation from all interested IEC National Committees. 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Public
24、ations is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their natio
25、nal and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity assessment serv
26、ices and, in some areas, access to IEC marks of conformity. IEC is not responsible for any services carried out by independent certification bodies. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, serv
27、ants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publicati
28、on, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility
29、 that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. The main task of IEC technical committees is to prepare International Standards. In exceptional circumstances, a technical committe
30、e may propose the publication of a technical specification when the required support cannot be obtained for the publication of an International Standard, despite repeated efforts, or The subject is still under technical development or where, for any other reason, there is the future but no immediate
31、 possibility of an agreement on an International Standard. Technical specifications are subject to review within three years of publication to decide whether they can be transformed into International Standards. 4 TS 62610-3 IEC:2009(E) IEC 62610-3, which is a technical specification, has been prepa
32、red by subcommittee 48D: Mechanical structures for electronic equipment, of IEC technical committee 48: Electromechanical components and mechanical structures for electronic equipment. The text of this technical specification is based on the following documents: Enquiry draft Report on voting 48D/40
33、1/DTS 48D/414/RVC Full information on the voting for the approval of this technical specification can be found in the report on voting indicated in the above table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. A list of all parts of the IEC 62610 series can be
34、 found, under the general title Mechanical structures for electronic equipment Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series, on the IEC website. The committee has decided that the contents of this publication will remain unchanged until the maintenance result dat
35、e indicated on the IEC web site under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication will be transformed into an International standard, reconfirmed, withdrawn, replaced by a revised edition, or amended. A bilingual version of this publication
36、may be issued at a later date. IMPORTANT The colour inside logo on the cover page of this publication indicates that it contains colours which are considered to be useful for the correct understanding of its contents. Users should therefore print this document using a colour printer. TS 62610-3 IEC:
37、2009(E) 5 INTRODUCTION Besides the conventional compressor cooling there are several alternatives for cooling, for example: absorption cooling, thermoelectric cooling (Peltier), magneto caloric cooling, CO 2cooling and others. For the design of thermoelectrical cooling systems, values of the dissipa
38、tion loss depending on the ambient temperature and internal temperature are necessary. Thermoelectrical cooling systems performance is a function of ambient temperature, hot and cold side heat exchanger (heat sink) performance, thermal load, of the design of the Peltier device and of Peltier electri
39、cal parameters. Therefore an evaluation method has to be developed. This design guide allows a comparison of thermoelectrical cooling systems. 6 TS 62610-3 IEC:2009(E) MECHANICAL STRUCTURES FOR ELECTRONIC EQUIPMENT THERMAL MANAGEMENT FOR CABINETS IN ACCORDANCE WITH IEC 60297 AND IEC 60917 SERIES Par
40、t 3: Design guide: Evaluation method for thermoelectrical cooling systems (Peltier effect) 1 Scope and object This part of IEC 62610 provides an evaluation method for thermoelectrical cooling systems (Peltier effect).With this design guide it is possible to calculate the efficiency of the thermoelec
41、trical cooling system (Peltier effect) and its cooling power depending on the ambient temperature and internal temperature. This design guide can also be used to appraise thermoelectrical cooling systems by its efficiency. 2 Normative references The following referenced documents are indispensable f
42、or the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 62194:2005, Method of evaluating the thermal performance of enclosures 3 Abbreviations, symbols and
43、 indices For the purposes of this document, the following abbreviations, symbols and indices apply. 3.1 Abbreviations COP coefficient of performance - c Pheat capacity W/kgK D pipe diameter m I current A k overall heat transfer coefficient k W/ m 2 K n total number of Peltier devices - p pressures d
44、ifference Pa Q energy flow (thermal, electrical, conductivity) W Q Ceffective cooling power of the thermoelectrical cooling system (Peltier) W Q cPecooling power of a Peltier device at operating conditions W Q Dtotal dissipated heat flow on the hot side W Q Hheating power inside the cabinet W R Peel
45、ectrical resistance of the Peltier device V/A R ithermal resistance K/W S surface m 2 T temperature K V voltage V TS 62610-3 IEC:2009(E) 7 V &volume flow m 3 /s ZT Figure of Merit - 3.2 Symbols Seebeck coefficient V/K density kg/m thermal conductivity W/m 2 K electrical conductivity S/m = A/V relati
46、ve humidity 3.3 Indices 1-7 position marks A related to an air flow a ambient C effective cooling power c cold side D total dissipated and removed heat on the hot side E electrical power applied to the thermoelectrical cooling system F Fan H heating inside the cabinet h hotside i internal, inside th
47、e cabinet L heat loss m average Pe related to the Peltier device R reverse S related to the whole thermoelectrical cooling system 4 Theory of the thermoelectrical cooling system 4.1 The Peltier element The Peltier effect is the direct conversion of electric voltage to temperature differences and the
48、 reverse process is called Seebeck effect. Therefore a thermoelectrical cooling system (Peltier effect) transfers heat from one side of the device to the other side against the temperature gradient, with consumption of electrical energy. This Peltier effect is described by the following equation: ()
49、 W T T x S R I 2 1 T I Q c 4 h 4 Pe Pe Pe Pe 2 c Pe c = 1 The cooling power of one Peltier element cPe Q depends on different phenomena. 8 TS 62610-3 IEC:2009(E) The term c T I is the maximum cooling power based on the Peltier effect, whereas represents the Seebeck coefficient. The term Pe 2 R I 2 1 represents the J
