IEC 60068-2-58-2015 Environmental testing - Part 2-58 Tests - Test Td Test methods for solderability resistance to dissolution of metallization and to soldering.pdf

1、 IEC 60068-2-58 Edition 4.0 2015-03 INTERNATIONAL STANDARD NORME INTERNATIONALE Environmental testing Part 2-58: Tests Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) Essais denvironnement Partie 2-58: Essais

2、 Essai Td: Mthodes dessai de la soudabilit, rsistance de la mtallisation la dissolution et rsistance la chaleur de brasage des composants pour montage en surface (CMS) IEC 60068-2-58:2015-03(en-fr) colourinsideTHIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2015 IEC, Geneva, Switzerland All rights

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20、ions contactez-nous: csciec.ch. IEC 60068-2-58 Edition 4.0 2015-03 INTERNATIONAL STANDARD NORME INTERNATIONALE Environmental testing Part 2-58: Tests Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) Essais den

21、vironnement Partie 2-58: Essais Essai Td: Mthodes dessai de la soudabilit, rsistance de la mtallisation la dissolution et rsistance la chaleur de brasage des composants pour montage en surface (CMS) INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE ICS 19.040; 31.1

22、90 ISBN 978-2-8322-2436-6 Registered trademark of the International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internationale Warning! Make sure that you obtained this publication from an authorized distributor. Attention! Veuillez vous assurer que vous avez obtenu ce

23、tte publication via un distributeur agr. colourinside 2 IEC 60068-2-58:2015 IEC 2015 CONTENTS FOREWORD . 5 1 Scope 7 2 Normative references. 7 3 Terms and definitions 8 4 Grouping of soldering processes and related test severities 9 5 Test equipment 10 5.1 Solder bath . 10 5.2 Reflow equipment . 10

24、6 Test Td1: Solderability of terminations . 11 6.1 Object and general description of the test 11 6.2 Specimen preparation . 11 6.3 Accelerated ageing . 11 6.4 Initial measurements . 11 6.5 Method 1: Solder bath . 11 Solder bath 11 6.5.1Solder and flux . 11 6.5.2Test procedure and conditions 12 6.5.3

25、6.6 Method 2: Reflow 14 Reflow equipment 14 6.6.1Solder paste 14 6.6.2Test substrates 14 6.6.3Test procedure . 14 6.6.4Reflow temperature profile for Test Td115 6.6.5Test conditions 16 6.6.67 Test Td2: Resistance to soldering heat 16 7.1 Object and general description of the test 16 7.2 Specimen pre

26、paration . 16 7.3 Preconditioning . 16 7.4 Initial measurements . 16 7.5 Method 1: Solder bath . 17 Solder bath 17 7.5.1Solder and flux . 17 7.5.2Test procedure and conditions 17 7.5.37.6 Method 2: Reflow 19 Reflow equipment 19 7.6.1Solder paste 19 7.6.2Test substrates 19 7.6.3Test procedure and con

27、ditions 19 7.6.48 Test Td3: Dewetting and resistance to dissolution of metallization 21 8.1 Object and general description of the test 21 8.2 Specimen preparation . 21 8.3 Initial measurements . 22 8.4 Method 1: Solder bath . 22 Solder bath 22 8.4.1Solder and flux . 22 8.4.2IEC 60068-2-58:2015 IEC 2

28、015 3 Test procedure and conditions 22 8.4.38.5 Method 2: Reflow 22 Reflow equipment 22 8.5.1Specimen. 22 8.5.2Solder paste 22 8.5.3Flux . 22 8.5.4Reflow profile . 22 8.5.5Placement of the specimen 23 8.5.6Application of the reflow profile. 23 8.5.7Evaluation 23 8.5.89 Final measurements 23 9.1 Flux

29、 removal . 23 9.2 Recovery conditions 23 9.3 Evaluation . 23 Wetting 23 9.3.1Dewetting 24 9.3.2Resistance to soldering heat 24 9.3.3Resistance to dissolution of metallization 24 9.3.410 Information to be given in the relevant specification 25 10.1 General . 25 10.2 Solderability 25 10.3 Resistance t

30、o soldering heat, dewetting and resistance to dissolution of metallization 25 Annex A (normative) Criteria for visual examination 27 A.1 Wetting . 27 A.2 Evaluation of wetting . 27 A.3 Evaluation of method 2 (Td1) . 28 A.4 Evaluation of method 2 (Td3) . 29 Annex B (informative) Guidance . 30 B.1 Gen

31、eral . 30 B.2 Limitations 30 B.3 Choice of severity . 30 B.3.1 Test Td1: Solderability by solder bath method . 30 B.3.2 Test Td2: Resistance to soldering heat Solder bath method . 31 B.3.3 Test Td2: Resistance to soldering heat Reflow method . 31 B.3.4 Immersion attitude . 32 B.3.5 Test Td3: Dewetti

32、ng and resistance to dissolution of metallization for 30 s at 260 C 32 Annex C (normative) Application of the test methods to through hole reflow soldering components (THR) 33 C.1 Solderability 33 C.2 Resistance to soldering heat . 33 C.3 Dewetting 33 C.4 Criteria for evaluation 33 Annex X (informat

33、ive) Cross reference for references to the prior revision of this specification . 34 Bibliography . 36 4 IEC 60068-2-58:2015 IEC 2015 Figure 1 Examples of immersion attitudes 13 Figure 2 Reflow temperature profile for solderability . 15 Figure 3 Examples of immersion attitude 18 Figure 4 Reflow temp

34、erature profile for resistance to soldering heat 20 Figure 5 Example for placement of a specimen to a test substrate 23 Figure 6 Identification of areas on metallic termination 24 Figure A.1 Evaluation of wetting . 28 Table 1 Grouping of soldering processes and typical test severities Overview 10 Ta

35、ble 2 Solder alloy and flux for test Td112 Table 3 Solderability Test conditions and severity, solder bath method . 14 Table 4 Solder paste specification 14 Table 5 Solderability Test conditions Method 2: Reflow . 16 Table 6 Resistance to soldering heat Test conditions and severity, solder bath meth

36、od . 19 Table 7 Resistance to soldering heat Test conditions and severity, reflow method 21 Table 8 Dewetting and resistance to dissolution of metallization Test conditions and severity, solder bath method . 22 Table B.1 Test conditions . 31 Table C.1 Test conditions for solderability test 33 IEC 60

37、068-2-58:2015 IEC 2015 5 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ ENVIRONMENTAL TESTING Part 2-58: Tests Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) FOREWORD 1) The International Electrotechnical Commi

38、ssion (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and i

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48、n may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 60068-2-58 has been prepared by IEC technical committee 91: Electronics assembly technology. This fourth edition cancels and replaces the third edition,

49、published in 2004 and constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition: the addition of Sn-Bi low temperature solder alloy; the addition of several reflow test conditions in Table 7 Resistance to soldering heat Test conditions and severity, reflow method; introduction of reflow test m