1、 IEC 60068-2-58 Edition 4.0 2015-03 INTERNATIONAL STANDARD NORME INTERNATIONALE Environmental testing Part 2-58: Tests Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) Essais denvironnement Partie 2-58: Essais
2、 Essai Td: Mthodes dessai de la soudabilit, rsistance de la mtallisation la dissolution et rsistance la chaleur de brasage des composants pour montage en surface (CMS) IEC 60068-2-58:2015-03(en-fr) colourinsideTHIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2015 IEC, Geneva, Switzerland All rights
3、 reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from either IEC or IECs member National Committee in the country of the requeste
4、r. If you have any questions about IEC copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or your local IEC member National Committee for further information. Droits de reproduction rservs. Sauf indication contraire, aucune partie de
5、cette publication ne peut tre reproduite ni utilise sous quelque forme que ce soit et par aucun procd, lectronique ou mcanique, y compris la photocopie et les microfilms, sans laccord crit de lIEC ou du Comit national de lIEC du pays du demandeur. Si vous avez des questions sur le copyright de lIEC
6、ou si vous dsirez obtenir des droits supplmentaires sur cette publication, utilisez les coordonnes ci-aprs ou contactez le Comit national de lIEC de votre pays de rsidence. IEC Central Office Tel.: +41 22 919 02 11 3, rue de Varemb Fax: +41 22 919 03 00 CH-1211 Geneva 20 infoiec.ch Switzerland www.i
7、ec.ch About the IEC The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes International Standards for all electrical, electronic and related technologies. About IEC publications The technical content of IEC publications is kept under const
8、ant review by the IEC. Please make sure that you have the latest edition, a corrigenda or an amendment might have been published. IEC Catalogue - webstore.iec.ch/catalogue The stand-alone application for consulting the entire bibliographical information on IEC International Standards, Technical Spec
9、ifications, Technical Reports and other documents. Available for PC, Mac OS, Android Tablets and iPad. IEC publications search - www.iec.ch/searchpub The advanced search enables to find IEC publications by a variety of criteria (reference number, text, technical committee,). It also gives informatio
10、n on projects, replaced and withdrawn publications. IEC Just Published - webstore.iec.ch/justpublished Stay up to date on all new IEC publications. Just Published details all new publications released. Available online and also once a month by email. Electropedia - www.electropedia.org The worlds le
11、ading online dictionary of electronic and electrical terms containing more than 30 000 terms and definitions in English and French, with equivalent terms in 15 additional languages. Also known as the International Electrotechnical Vocabulary (IEV) online. IEC Glossary - std.iec.ch/glossary More than
12、 60 000 electrotechnical terminology entries in English and French extracted from the Terms and Definitions clause of IEC publications issued since 2002. Some entries have been collected from earlier publications of IEC TC 37, 77, 86 and CISPR. IEC Customer Service Centre - webstore.iec.ch/csc If yo
13、u wish to give us your feedback on this publication or need further assistance, please contact the Customer Service Centre: csciec.ch. A propos de lIEC La Commission Electrotechnique Internationale (IEC) est la premire organisation mondiale qui labore et publie des Normes internationales pour tout c
14、e qui a trait llectricit, llectronique et aux technologies apparentes. A propos des publications IEC Le contenu technique des publications IEC est constamment revu. Veuillez vous assurer que vous possdez ldition la plus rcente, un corrigendum ou amendement peut avoir t publi. Catalogue IEC - webstor
15、e.iec.ch/catalogue Application autonome pour consulter tous les renseignements bibliographiques sur les Normes internationales, Spcifications techniques, Rapports techniques et autres documents de lIEC. Disponible pour PC, Mac OS, tablettes Android et iPad. Recherche de publications IEC - www.iec.ch
16、/searchpub La recherche avance permet de trouver des publications IEC en utilisant diffrents critres (numro de rfrence, texte, comit dtudes,). Elle donne aussi des informations sur les projets et les publications remplaces ou retires. IEC Just Published - webstore.iec.ch/justpublished Restez inform
17、sur les nouvelles publications IEC. Just Published dtaille les nouvelles publications parues. Disponible en ligne et aussi une fois par mois par email. Electropedia - www.electropedia.org Le premier dictionnaire en ligne de termes lectroniques et lectriques. Il contient plus de 30 000 termes et dfin
18、itions en anglais et en franais, ainsi que les termes quivalents dans 15 langues additionnelles. Egalement appel Vocabulaire Electrotechnique International (IEV) en ligne. Glossaire IEC - std.iec.ch/glossary Plus de 60 000 entres terminologiques lectrotechniques, en anglais et en franais, extraites
19、des articles Termes et Dfinitions des publications IEC parues depuis 2002. Plus certaines entres antrieures extraites des publications des CE 37, 77, 86 et CISPR de lIEC. Service Clients - webstore.iec.ch/csc Si vous dsirez nous donner des commentaires sur cette publication ou si vous avez des quest
20、ions contactez-nous: csciec.ch. IEC 60068-2-58 Edition 4.0 2015-03 INTERNATIONAL STANDARD NORME INTERNATIONALE Environmental testing Part 2-58: Tests Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) Essais den
21、vironnement Partie 2-58: Essais Essai Td: Mthodes dessai de la soudabilit, rsistance de la mtallisation la dissolution et rsistance la chaleur de brasage des composants pour montage en surface (CMS) INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE ICS 19.040; 31.1
22、90 ISBN 978-2-8322-2436-6 Registered trademark of the International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internationale Warning! Make sure that you obtained this publication from an authorized distributor. Attention! Veuillez vous assurer que vous avez obtenu ce
23、tte publication via un distributeur agr. colourinside 2 IEC 60068-2-58:2015 IEC 2015 CONTENTS FOREWORD . 5 1 Scope 7 2 Normative references. 7 3 Terms and definitions 8 4 Grouping of soldering processes and related test severities 9 5 Test equipment 10 5.1 Solder bath . 10 5.2 Reflow equipment . 10
24、6 Test Td1: Solderability of terminations . 11 6.1 Object and general description of the test 11 6.2 Specimen preparation . 11 6.3 Accelerated ageing . 11 6.4 Initial measurements . 11 6.5 Method 1: Solder bath . 11 Solder bath 11 6.5.1Solder and flux . 11 6.5.2Test procedure and conditions 12 6.5.3
25、6.6 Method 2: Reflow 14 Reflow equipment 14 6.6.1Solder paste 14 6.6.2Test substrates 14 6.6.3Test procedure . 14 6.6.4Reflow temperature profile for Test Td115 6.6.5Test conditions 16 6.6.67 Test Td2: Resistance to soldering heat 16 7.1 Object and general description of the test 16 7.2 Specimen pre
26、paration . 16 7.3 Preconditioning . 16 7.4 Initial measurements . 16 7.5 Method 1: Solder bath . 17 Solder bath 17 7.5.1Solder and flux . 17 7.5.2Test procedure and conditions 17 7.5.37.6 Method 2: Reflow 19 Reflow equipment 19 7.6.1Solder paste 19 7.6.2Test substrates 19 7.6.3Test procedure and con
27、ditions 19 7.6.48 Test Td3: Dewetting and resistance to dissolution of metallization 21 8.1 Object and general description of the test 21 8.2 Specimen preparation . 21 8.3 Initial measurements . 22 8.4 Method 1: Solder bath . 22 Solder bath 22 8.4.1Solder and flux . 22 8.4.2IEC 60068-2-58:2015 IEC 2
28、015 3 Test procedure and conditions 22 8.4.38.5 Method 2: Reflow 22 Reflow equipment 22 8.5.1Specimen. 22 8.5.2Solder paste 22 8.5.3Flux . 22 8.5.4Reflow profile . 22 8.5.5Placement of the specimen 23 8.5.6Application of the reflow profile. 23 8.5.7Evaluation 23 8.5.89 Final measurements 23 9.1 Flux
29、 removal . 23 9.2 Recovery conditions 23 9.3 Evaluation . 23 Wetting 23 9.3.1Dewetting 24 9.3.2Resistance to soldering heat 24 9.3.3Resistance to dissolution of metallization 24 9.3.410 Information to be given in the relevant specification 25 10.1 General . 25 10.2 Solderability 25 10.3 Resistance t
30、o soldering heat, dewetting and resistance to dissolution of metallization 25 Annex A (normative) Criteria for visual examination 27 A.1 Wetting . 27 A.2 Evaluation of wetting . 27 A.3 Evaluation of method 2 (Td1) . 28 A.4 Evaluation of method 2 (Td3) . 29 Annex B (informative) Guidance . 30 B.1 Gen
31、eral . 30 B.2 Limitations 30 B.3 Choice of severity . 30 B.3.1 Test Td1: Solderability by solder bath method . 30 B.3.2 Test Td2: Resistance to soldering heat Solder bath method . 31 B.3.3 Test Td2: Resistance to soldering heat Reflow method . 31 B.3.4 Immersion attitude . 32 B.3.5 Test Td3: Dewetti
32、ng and resistance to dissolution of metallization for 30 s at 260 C 32 Annex C (normative) Application of the test methods to through hole reflow soldering components (THR) 33 C.1 Solderability 33 C.2 Resistance to soldering heat . 33 C.3 Dewetting 33 C.4 Criteria for evaluation 33 Annex X (informat
33、ive) Cross reference for references to the prior revision of this specification . 34 Bibliography . 36 4 IEC 60068-2-58:2015 IEC 2015 Figure 1 Examples of immersion attitudes 13 Figure 2 Reflow temperature profile for solderability . 15 Figure 3 Examples of immersion attitude 18 Figure 4 Reflow temp
34、erature profile for resistance to soldering heat 20 Figure 5 Example for placement of a specimen to a test substrate 23 Figure 6 Identification of areas on metallic termination 24 Figure A.1 Evaluation of wetting . 28 Table 1 Grouping of soldering processes and typical test severities Overview 10 Ta
35、ble 2 Solder alloy and flux for test Td112 Table 3 Solderability Test conditions and severity, solder bath method . 14 Table 4 Solder paste specification 14 Table 5 Solderability Test conditions Method 2: Reflow . 16 Table 6 Resistance to soldering heat Test conditions and severity, solder bath meth
36、od . 19 Table 7 Resistance to soldering heat Test conditions and severity, reflow method 21 Table 8 Dewetting and resistance to dissolution of metallization Test conditions and severity, solder bath method . 22 Table B.1 Test conditions . 31 Table C.1 Test conditions for solderability test 33 IEC 60
37、068-2-58:2015 IEC 2015 5 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ ENVIRONMENTAL TESTING Part 2-58: Tests Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) FOREWORD 1) The International Electrotechnical Commi
38、ssion (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and i
39、n addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee i
40、nterested in the subject dealt with may participate in this preparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordanc
41、e with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interes
42、ted IEC National Committees. 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsibl
43、e for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. Any divergence bet
44、ween any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity assessment services and, in some areas, access to IEC marks of c
45、onformity. IEC is not responsible for any services carried out by independent certification bodies. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and m
46、embers of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publicatio
47、n or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publicatio
48、n may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 60068-2-58 has been prepared by IEC technical committee 91: Electronics assembly technology. This fourth edition cancels and replaces the third edition,
49、published in 2004 and constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition: the addition of Sn-Bi low temperature solder alloy; the addition of several reflow test conditions in Table 7 Resistance to soldering heat Test conditions and severity, reflow method; introduction of reflow test m
