IEC 61189-3-2007 Test methods for electrical materials printed boards and other interconnection structures and assemblies - Part 3 Test methods for interconnect.pdf

1、 IEC 61189-3 Edition 2.0 2007-10 INTERNATIONAL STANDARD NORME INTERNATIONALE Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 3: Test methods for interconnection structures (printed boards) Mthodes dessai pour les matriaux lectriques, les

2、 cartes imprimes et autres structures dinterconnexion et ensembles Partie 3: Mthodes dessai des structures dinterconnexion (cartes imprimes) IEC 61189-3:2007 THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2007 IEC, Geneva, Switzerland All rights reserved. Unless otherwise specified, no part of th

3、is publication may be reproduced or utilized in any form or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from either IEC or IECs member National Committee in the country of the requester. If you have any questions about IEC copyright or

4、have an enquiry about obtaining additional rights to this publication, please contact the address below or your local IEC member National Committee for further information. Droits de reproduction rservs. Sauf indication contraire, aucune partie de cette publication ne peut tre reproduite ni utilise

5、sous quelque forme que ce soit et par aucun procd, lectronique ou mcanique, y compris la photocopie et les microfilms, sans laccord crit de la CEI ou du Comit national de la CEI du pays du demandeur. Si vous avez des questions sur le copyright de la CEI ou si vous dsirez obtenir des droits supplment

6、aires sur cette publication, utilisez les coordonnes ci-aprs ou contactez le Comit national de la CEI de votre pays de rsidence. IEC Central Office Tel.: +41 22 919 02 11 3, rue de Varemb Fax: +41 22 919 03 00 CH-1211 Geneva 20 infoiec.ch Switzerland www.iec.ch About the IEC The International Electr

7、otechnical Commission (IEC) is the leading global organization that prepares and publishes International Standards for all electrical, electronic and related technologies. About IEC publications The technical content of IEC publications is kept under constant review by the IEC. Please make sure that

8、 you have the latest edition, a corrigenda or an amendment might have been published. Useful links: IEC publications search - www.iec.ch/searchpub The advanced search enables you to find IEC publications by a variety of criteria (reference number, text, technical committee,). It also gives informati

9、on on projects, replaced and withdrawn publications. IEC Just Published - webstore.iec.ch/justpublished Stay up to date on all new IEC publications. Just Published details all new publications released. Available on-line and also once a month by email. Electropedia - www.electropedia.org The worlds

10、leading online dictionary of electronic and electrical terms containing more than 30 000 terms and definitions in English and French, with equivalent terms in additional languages. Also known as the International Electrotechnical Vocabulary (IEV) on-line. Customer Service Centre - webstore.iec.ch/cs

11、c If you wish to give us your feedback on this publication or need further assistance, please contact the Customer Service Centre: csciec.ch. A propos de la CEI La Commission Electrotechnique Internationale (CEI) est la premire organisation mondiale qui labore et publie des Normes internationales po

12、ur tout ce qui a trait llectricit, llectronique et aux technologies apparentes. A propos des publications CEI Le contenu technique des publications de la CEI est constamment revu. Veuillez vous assurer que vous possdez ldition la plus rcente, un corrigendum ou amendement peut avoir t publi. Liens ut

13、iles: Recherche de publications CEI - www.iec.ch/searchpub La recherche avance vous permet de trouver des publications CEI en utilisant diffrents critres (numro de rfrence, texte, comit dtudes,). Elle donne aussi des informations sur les projets et les publications remplaces ou retires. Just Publish

14、ed CEI - webstore.iec.ch/justpublished Restez inform sur les nouvelles publications de la CEI. Just Published dtaille les nouvelles publications parues. Disponible en ligne et aussi une fois par mois par email. Electropedia - www.electropedia.org Le premier dictionnaire en ligne au monde de termes l

15、ectroniques et lectriques. Il contient plus de 30 000 termes et dfinitions en anglais et en franais, ainsi que les termes quivalents dans les langues additionnelles. Egalement appel Vocabulaire Electrotechnique International (VEI) en ligne. Service Clients - webstore.iec.ch/csc Si vous dsirez nous d

16、onner des commentaires sur cette publication ou si vous avez des questions contactez-nous: csciec.ch. IEC 61189-3 Edition 2.0 2007-10 INTERNATIONAL STANDARD NORME INTERNATIONALE Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 3: Test met

17、hods for interconnection structures (printed boards) Mthodes dessai pour les matriaux lectriques, les cartes imprimes et autres structures dinterconnexion et ensembles Partie 3: Mthodes dessai des structures dinterconnexion (cartes imprimes) INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECT

18、ROTECHNIQUE INTERNATIONALE XE ICS 31.180 PRICE CODE CODE PRIX ISBN 978-2-83220-349-1 Registered trademark of the International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internationale Warning! Make sure that you obtained this publication from an authorized distributo

19、r. Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agr. 2 61189-3 IEC:2007 CONTENTS FOREWORD . 4 INTRODUCTION . 6 1 Scope and object 7 2 Normative references 7 3 Accuracy, precision and resolution 8 4 Catalogue of approved test methods . 11 5 P: Preparatio

20、n/conditioning test methods 11 6 V: Visual test methods 11 7 D: Dimensional test methods 14 8 C: Chemical test methods . 17 9 M: Mechanical test methods 30 10 E: Electrical test methods . 48 11 N: Environmental test methods . 75 12 X: Miscellaneous test methods 93 Annex A (informative) Worked exampl

21、es . 117 Figure 1 Glow wire . 19 Figure 2 Test apparatus . 20 Figure 3a Horizontal specimen Flame applied to surface 24 Figure 3b Horizontal specimen Flame applied to edge . 24 Figure 3c Vertical specimen Lower edge horizontal Flame applied to edge 25 Figure 3d Vertical specimen Lower edge horizonta

22、l Flame applied to surface 25 Figure 3e Needle burner test Side views of test board and burner 26 Figure 3 Needle burner test 26 Figure 4 Flux type classification by copper mirror test . 30 Figure 5a Hold down clamping system 32 Figure 5b Single load mode 32 Figure 5c Multiple load mode 32 Figure 5d

23、 Keyhole hold down fixture . 33 Figure 5 Copper foil for peel test 33 Figure 6 Bow 36 Figure 7 Twist 36 Figure 8 Test set-up for bow measurement . 37 Figure 9 Specimen set-up for twist measurement 37 Figure 10a Specimen set-up for referee test for twist, raised parallel surfaces 38 Figure 10b Specim

24、en set-up for referee test for twist, supporting jacks or blocks 39 Figure 10c Specimen set-up for referee test for twist measurements . 39 Figure 10 Specimen set-up for referee test . 39 Figure 11 Bow measurement 39 Figure 12 Twist measurement 40 61189-3 IEC:2007 3 Figure 13 Measuring equipment for

25、 peel strength of flexible printed boards . 43 Figure 14 Pencil holder. 46 Figure 15a Location of test specimens 54 Figure 15b Location of test specimens 55 Figure 15 Composite test pattern 55 Figure 16 Test specimen artwork 61 Figure 17 Fluidized sand bath . 64 Figure 18 Possible equipment configur

26、ation 68 Figure 19 Schematic showing undisturbed interval 68 Figure 20 Test wave form example . 70 Figure 21 Incident wave voltage showing (2 X) air line delay . 70 Figure 22 Details of test specimen 72 Figure 23 Circuit diagram for measurement of contact resistance . 73 Figure 24 Keypad contact pat

27、terns . 75 Figure 25 Plier fixture for thermal shock test, dip soldering . 82 Figure 26 Temperature cycles for moisture and insulation resistance test graph 92 Figure 27 Insulation resistance coupon (m) . 92 Figure 28 Typical comb pattern . 93 Figure 29 Suggested test specimen for surface mount feat

28、ures 104 Figure 30 Suggested test specimen for plated through holes . 104 Figure 31 Rotary dip solderability test equipment 107 Figure 32 Effectiveness of solder wetting of plated through holes 110 Figure 33 Test specimen 116 Table 1 Students “t“ distribution . 10 Table 2 Preferred land, hole and wi

29、re dimensions . 44 Table 3 Resistance values 61 Table 4 Chamber temperatures for one cycle 86 Table 5 Accelerated ageing and test requirements 105 Table 6 Maximum limits of solder bath contaminants 106 4 61189-3 IEC:2007 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ TEST METHODS FOR ELECTRICAL MATERIA

30、LS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES Part 3: Test methods for interconnection structures (printed boards) FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committ

31、ees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical R

32、eports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental an

33、d non- governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreeme

34、nts of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC National Committees. 3) IEC Publications have the form of recommendations for international use and

35、 are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote i

36、nternational uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated

37、in the latter. 5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any equipment declared to be in conformity with an IEC Publication. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IE

38、C or its directors, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and ex

39、penses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) At

40、tention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 61189-3 has been prepared by IEC technical committee 91: Electronics

41、assembly technology. This second edition cancels and replaces the first edition, published in 1997, its amendment 1 (1999) and constitutes a technical revision. The document 91/698/FDIS, circulated to the National Committees as Amendment 2, led to the publication of the new edition. The major techni

42、cal changes with regard to the previous edition concern the addition of 25 new tests, as follows: 6 V: Visual test methods: 3V01, 3V02 and 3V03; 7 D: Dimensional test methods: 3D03; 61189-3 IEC:2007 5 8 C: Chemical test methods: 3C02, 3C13 and 3C14; 9 M: Mechanical test methods: 3M01, 3M03, 3M04, 3M

43、07 and 3M09; 10 E: Electrical test methods: 3E03, 3E04, 3E05, 3E11, 3E12, 3E13, 3E16, 3E17 and 3E18; 11 N: Environmental test methods: 3N03, 3N07 and 3N12; 12 X: Miscellaneous test methods: 3X01. This edition also includes the deletion of Annex B: Conversion table, as the referred documents were dis

44、banded in 2005 and do not officially exist. Should any one wish to consult such information, they should refer to the first edition of IEC 61189-3 (1997). This bilingual version (2012-09) corresponds to the monolingual English version, published in 2007-10. The text of this standard is based on the

45、first edition, its Amendment 1 and the following documents: FDIS Report on voting 91/698/FDIS 91/727/RVD Full information on the voting for the approval of this amendment can be found in the report on voting indicated in the above table. The French version of this standard has not been voted upon. T

46、his publication has been drafted in accordance with the ISO/IEC Directives, Part 2. A list of all the parts in the IEC 61189 series, under the general title Test methods for electrical materials, printed boards and other interconnection structures and assemblies, can be found on the IEC website. NOT

47、E Future standards in this series will carry the new general title as cited above. Titles of existing standards in this series will be updated at the time of the next edition. This standard should be used in conjunction with the following parts: Part 1: General test methods and methodology Part 2: T

48、est methods for materials for interconnection structures Part 4: Test methods for electronic components assembling characteristics Part 5: Test methods for printed board assemblies and also the following standard Part 6: Test methods for materials used in manufacturing electronic assemblies IEC 6006

49、8 (all parts), Environmental testing The committee has decided that the contents of the base publication and its amendments will remain unchanged until the maintenance result date indicated on the IEC web site under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publicati