1、 IEC 61189-3 Edition 2.0 2007-10 INTERNATIONAL STANDARD NORME INTERNATIONALE Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 3: Test methods for interconnection structures (printed boards) Mthodes dessai pour les matriaux lectriques, les
2、 cartes imprimes et autres structures dinterconnexion et ensembles Partie 3: Mthodes dessai des structures dinterconnexion (cartes imprimes) IEC 61189-3:2007 THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2007 IEC, Geneva, Switzerland All rights reserved. Unless otherwise specified, no part of th
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16、onner des commentaires sur cette publication ou si vous avez des questions contactez-nous: csciec.ch. IEC 61189-3 Edition 2.0 2007-10 INTERNATIONAL STANDARD NORME INTERNATIONALE Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 3: Test met
17、hods for interconnection structures (printed boards) Mthodes dessai pour les matriaux lectriques, les cartes imprimes et autres structures dinterconnexion et ensembles Partie 3: Mthodes dessai des structures dinterconnexion (cartes imprimes) INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECT
18、ROTECHNIQUE INTERNATIONALE XE ICS 31.180 PRICE CODE CODE PRIX ISBN 978-2-83220-349-1 Registered trademark of the International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internationale Warning! Make sure that you obtained this publication from an authorized distributo
19、r. Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agr. 2 61189-3 IEC:2007 CONTENTS FOREWORD . 4 INTRODUCTION . 6 1 Scope and object 7 2 Normative references 7 3 Accuracy, precision and resolution 8 4 Catalogue of approved test methods . 11 5 P: Preparatio
20、n/conditioning test methods 11 6 V: Visual test methods 11 7 D: Dimensional test methods 14 8 C: Chemical test methods . 17 9 M: Mechanical test methods 30 10 E: Electrical test methods . 48 11 N: Environmental test methods . 75 12 X: Miscellaneous test methods 93 Annex A (informative) Worked exampl
21、es . 117 Figure 1 Glow wire . 19 Figure 2 Test apparatus . 20 Figure 3a Horizontal specimen Flame applied to surface 24 Figure 3b Horizontal specimen Flame applied to edge . 24 Figure 3c Vertical specimen Lower edge horizontal Flame applied to edge 25 Figure 3d Vertical specimen Lower edge horizonta
22、l Flame applied to surface 25 Figure 3e Needle burner test Side views of test board and burner 26 Figure 3 Needle burner test 26 Figure 4 Flux type classification by copper mirror test . 30 Figure 5a Hold down clamping system 32 Figure 5b Single load mode 32 Figure 5c Multiple load mode 32 Figure 5d
23、 Keyhole hold down fixture . 33 Figure 5 Copper foil for peel test 33 Figure 6 Bow 36 Figure 7 Twist 36 Figure 8 Test set-up for bow measurement . 37 Figure 9 Specimen set-up for twist measurement 37 Figure 10a Specimen set-up for referee test for twist, raised parallel surfaces 38 Figure 10b Specim
24、en set-up for referee test for twist, supporting jacks or blocks 39 Figure 10c Specimen set-up for referee test for twist measurements . 39 Figure 10 Specimen set-up for referee test . 39 Figure 11 Bow measurement 39 Figure 12 Twist measurement 40 61189-3 IEC:2007 3 Figure 13 Measuring equipment for
25、 peel strength of flexible printed boards . 43 Figure 14 Pencil holder. 46 Figure 15a Location of test specimens 54 Figure 15b Location of test specimens 55 Figure 15 Composite test pattern 55 Figure 16 Test specimen artwork 61 Figure 17 Fluidized sand bath . 64 Figure 18 Possible equipment configur
26、ation 68 Figure 19 Schematic showing undisturbed interval 68 Figure 20 Test wave form example . 70 Figure 21 Incident wave voltage showing (2 X) air line delay . 70 Figure 22 Details of test specimen 72 Figure 23 Circuit diagram for measurement of contact resistance . 73 Figure 24 Keypad contact pat
27、terns . 75 Figure 25 Plier fixture for thermal shock test, dip soldering . 82 Figure 26 Temperature cycles for moisture and insulation resistance test graph 92 Figure 27 Insulation resistance coupon (m) . 92 Figure 28 Typical comb pattern . 93 Figure 29 Suggested test specimen for surface mount feat
28、ures 104 Figure 30 Suggested test specimen for plated through holes . 104 Figure 31 Rotary dip solderability test equipment 107 Figure 32 Effectiveness of solder wetting of plated through holes 110 Figure 33 Test specimen 116 Table 1 Students “t“ distribution . 10 Table 2 Preferred land, hole and wi
29、re dimensions . 44 Table 3 Resistance values 61 Table 4 Chamber temperatures for one cycle 86 Table 5 Accelerated ageing and test requirements 105 Table 6 Maximum limits of solder bath contaminants 106 4 61189-3 IEC:2007 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ TEST METHODS FOR ELECTRICAL MATERIA
30、LS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES Part 3: Test methods for interconnection structures (printed boards) FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committ
31、ees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical R
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39、penses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) At
40、tention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 61189-3 has been prepared by IEC technical committee 91: Electronics
41、assembly technology. This second edition cancels and replaces the first edition, published in 1997, its amendment 1 (1999) and constitutes a technical revision. The document 91/698/FDIS, circulated to the National Committees as Amendment 2, led to the publication of the new edition. The major techni
42、cal changes with regard to the previous edition concern the addition of 25 new tests, as follows: 6 V: Visual test methods: 3V01, 3V02 and 3V03; 7 D: Dimensional test methods: 3D03; 61189-3 IEC:2007 5 8 C: Chemical test methods: 3C02, 3C13 and 3C14; 9 M: Mechanical test methods: 3M01, 3M03, 3M04, 3M
43、07 and 3M09; 10 E: Electrical test methods: 3E03, 3E04, 3E05, 3E11, 3E12, 3E13, 3E16, 3E17 and 3E18; 11 N: Environmental test methods: 3N03, 3N07 and 3N12; 12 X: Miscellaneous test methods: 3X01. This edition also includes the deletion of Annex B: Conversion table, as the referred documents were dis
44、banded in 2005 and do not officially exist. Should any one wish to consult such information, they should refer to the first edition of IEC 61189-3 (1997). This bilingual version (2012-09) corresponds to the monolingual English version, published in 2007-10. The text of this standard is based on the
45、first edition, its Amendment 1 and the following documents: FDIS Report on voting 91/698/FDIS 91/727/RVD Full information on the voting for the approval of this amendment can be found in the report on voting indicated in the above table. The French version of this standard has not been voted upon. T
46、his publication has been drafted in accordance with the ISO/IEC Directives, Part 2. A list of all the parts in the IEC 61189 series, under the general title Test methods for electrical materials, printed boards and other interconnection structures and assemblies, can be found on the IEC website. NOT
47、E Future standards in this series will carry the new general title as cited above. Titles of existing standards in this series will be updated at the time of the next edition. This standard should be used in conjunction with the following parts: Part 1: General test methods and methodology Part 2: T
48、est methods for materials for interconnection structures Part 4: Test methods for electronic components assembling characteristics Part 5: Test methods for printed board assemblies and also the following standard Part 6: Test methods for materials used in manufacturing electronic assemblies IEC 6006
49、8 (all parts), Environmental testing The committee has decided that the contents of the base publication and its amendments will remain unchanged until the maintenance result date indicated on the IEC web site under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publicati
