IEC 61190-1-2-2014 Attachment materials for electronic assembly - Part 1-2 Requirements for soldering paste for high-quality interconnects in electronics assemb.pdf

1、 IEC 61190-1-2 Edition 3.0 2014-02 INTERNATIONAL STANDARD NORME INTERNATIONALE Attachment materials for electronic assembly Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly Matriaux de fixation pour les assemblages lectroniques Partie 1-2: Exigences

2、relatives aux ptes braser pour les interconnexions de haute qualit dans les assemblages de composants lectroniques IEC 61190-1-2:2014-02(en-fr) colour inside THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2014 IEC, Geneva, Switzerland All rights reserved. Unless otherwise specified, no part of th

3、is publication may be reproduced or utilized in any form or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from either IEC or IECs member National Committee in the country of the requester. If you have any questions about IEC copyright or

4、have an enquiry about obtaining additional rights to this publication, please contact the address below or your local IEC member National Committee for further information. Droits de reproduction rservs. Sauf indication contraire, aucune partie de cette publication ne peut tre reproduite ni utilise

5、sous quelque forme que ce soit et par aucun procd, lectronique ou mcanique, y compris la photocopie et les microfilms, sans laccord crit de lIEC ou du Comit national de lIEC du pays du demandeur. Si vous avez des questions sur le copyright de lIEC ou si vous dsirez obtenir des droits supplmentaires

6、sur cette publication, utilisez les coordonnes ci-aprs ou contactez le Comit national de lIEC de votre pays de rsidence. IEC Central Office Tel.: +41 22 919 02 11 3, rue de Varemb Fax: +41 22 919 03 00 CH-1211 Geneva 20 infoiec.ch Switzerland www.iec.ch About the IEC The International Electrotechnic

7、al Commission (IEC) is the leading global organization that prepares and publishes International Standards for all electrical, electronic and related technologies. About IEC publications The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you hav

8、e the latest edition, a corrigenda or an amendment might have been published. IEC Catalogue - webstore.iec.ch/catalogue The stand-alone application for consulting the entire bibliographical information on IEC International Standards, Technical Specifications, Technical Reports and other documents. A

9、vailable for PC, Mac OS, Android Tablets and iPad. IEC publications search - www.iec.ch/searchpub The advanced search enables to find IEC publications by a variety of criteria (reference number, text, technical committee,). It also gives information on projects, replaced and withdrawn publications.

10、IEC Just Published - webstore.iec.ch/justpublished Stay up to date on all new IEC publications. Just Published details all new publications released. Available online and also once a month by email. Electropedia - www.electropedia.org The worlds leading online dictionary of electronic and electrical

11、 terms containing more than 30 000 terms and definitions in English and French, with equivalent terms in 14 additional languages. Also known as the International Electrotechnical Vocabulary (IEV) online. IEC Glossary - std.iec.ch/glossary More than 55 000 electrotechnical terminology entries in Engl

12、ish and French extracted from the Terms and Definitions clause of IEC publications issued since 2002. Some entries have been collected from earlier publications of IEC TC 37, 77, 86 and CISPR. IEC Customer Service Centre - webstore.iec.ch/csc If you wish to give us your feedback on this publication

13、or need further assistance, please contact the Customer Service Centre: csciec.ch. A propos de lIEC La Commission Electrotechnique Internationale (IEC) est la premire organisation mondiale qui labore et publie des Normes internationales pour tout ce qui a trait llectricit, llectronique et aux techno

14、logies apparentes. A propos des publications IEC Le contenu technique des publications IEC est constamment revu. Veuillez vous assurer que vous possdez ldition la plus rcente, un corrigendum ou amendement peut avoir t publi. Catalogue IEC - webstore.iec.ch/catalogue Application autonome pour consult

15、er tous les renseignements bibliographiques sur les Normes internationales, Spcifications techniques, Rapports techniques et autres documents de lIEC. Disponible pour PC, Mac OS, tablettes Android et iPad. Recherche de publications IEC - www.iec.ch/searchpub La recherche avance permet de trouver des

16、 publications IEC en utilisant diffrents critres (numro de rfrence, texte, comit dtudes,). Elle donne aussi des informations sur les projets et les publications remplaces ou retires. IEC Just Published - webstore.iec.ch/justpublished Restez inform sur les nouvelles publications IEC. Just Published d

17、taille les nouvelles publications parues. Disponible en ligne et aussi une fois par mois par email. Electropedia - www.electropedia.org Le premier dictionnaire en ligne de termes lectroniques et lectriques. Il contient plus de 30 000 termes et dfinitions en anglais et en franais, ainsi que les terme

18、s quivalents dans 14 langues additionnelles. Egalement appel Vocabulaire Electrotechnique International (IEV) en ligne. Glossaire IEC - std.iec.ch/glossary Plus de 55 000 entres terminologiques lectrotechniques, en anglais et en franais, extraites des articles Termes et Dfinitions des publications I

19、EC parues depuis 2002. Plus certaines entres antrieures extraites des publications des CE 37, 77, 86 et CISPR de lIEC. Service Clients - webstore.iec.ch/csc Si vous dsirez nous donner des commentaires sur cette publication ou si vous avez des questions contactez-nous: csciec.ch. IEC 61190-1-2 Editio

20、n 3.0 2014-02 INTERNATIONAL STANDARD NORME INTERNATIONALE Attachment materials for electronic assembly Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly Matriaux de fixation pour les assemblages lectroniques Partie 1-2: Exigences relatives aux ptes br

21、aser pour les interconnexions de haute qualit dans les assemblages de composants lectroniques INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE T ICS 31.190 PRICE CODE CODE PRIX ISBN 978-2-83221-423-7 Registered trademark of the International Electrotechnical Commi

22、ssion Marque dpose de la Commission Electrotechnique Internationale Warning! Make sure that you obtained this publication from an authorized distributor. Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agr. colour inside 2 61190-1-2 IEC:2014 CONTENTS FOREW

23、ORD . 4 INTRODUCTION . 6 1 Scope 7 2 Normative references 7 3 Terms and definitions 7 4 Standardized description for products 8 5 Test methods . 8 6 Requirements 9 6.1 General 9 6.2 Conflict 9 6.3 Alloy composition . 9 6.4 Flux characterization and inspection 9 General 9 6.4.1Shelf life . 10 6.4.2 6

24、.5 Solder powder particle size 10 Powder size determination 10 6.5.1Powder size 10 6.5.2Solder powder particle shape 11 6.5.3 6.6 Metal per cent 11 6.7 Viscosity 11 General 11 6.7.1Methods of determining viscosity 11 6.7.2 6.8 Slump and smear test 12 General 12 6.8.1Test with 0,2 mm thick stencil .

25、12 6.8.2Test with 0,1 mm thick stencil . 12 6.8.3 6.9 Solder ball test . 13 General 13 6.9.1Type 1-4 powder . 13 6.9.2Type 5-7 powder . 13 6.9.3 6.10 Tack test 14 6.11 Wetting 14 6.12 Labelling 14 7 Quality assurance provisions . 15 7.1 Responsibility for inspection 15 General 15 7.1.1Responsibility

26、 for compliance . 16 7.1.2Test equipment and inspection facilities 16 7.1.3Inspection conditions 16 7.1.4 7.2 Classification for inspections 16 7.3 Inspection report form 16 7.4 Qualification inspection 16 General 16 7.4.1Sample size 17 7.4.2Inspection routine . 17 7.4.3 7.5 Quality conformance 17 6

27、1190-1-2 IEC:2014 3 General 17 7.5.1Sampling plan . 17 7.5.2Rejected lots 17 7.5.3 8 Preparation for delivery . 17 9 Additional information Performance and shelf life extension inspections . 18 Annex A (normative) Test report on solder paste . 19 Annex B (informative) Reflow condition and profile 20

28、 Annex C (informative) Typical comparison of particle size distributions between laser diffraction method and screen method . 21 Bibliography 22 Figure 1 Slump test stencil thickness, 0,20 mm 12 Figure 2 Slump test stencil thickness, 0,10 mm 13 Figure 3 Solder ball test standards . 15 Figure C.1 Typ

29、ical comparison between laser diffraction and sieving . 21 Table 1 Standardized solder paste description . 8 Table 2 Standard solder powders . 10 Table 3 Test methods for particle size distribution . 11 Table 4 Solder paste qualification inspection . 17 Table 5 User inspection for solder paste prior

30、 to use . 18 Table A.1 Solder paste inspection report form 19 4 61190-1-2 IEC:2014 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly FOREWORD 1) The International

31、 Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fi

32、elds. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any I

33、EC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non- governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardiz

34、ation (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has represe

35、ntation from all interested IEC National Committees. 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC c

36、annot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publicat

37、ions. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity assessment services and, in some areas,

38、access to IEC marks of conformity. IEC is not responsible for any services carried out by independent certification bodies. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including

39、individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance u

40、pon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the element

41、s of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 61190-1-2 has been prepared by IEC technical committee 91: Electronics assembly technology. This third edition cancels and replac

42、es the second edition published in 2007. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition: a) modification of the solder powder size in Table 2; b) addition of the information of “Reflow condition an

43、d profile” in Annex B; c) addition of a new Annex C. 61190-1-2 IEC:2014 5 The text of this standard is based on the following documents: CDV Report on voting 91/1154A/FDIS 91/1166/RVD Full information on the voting for the approval of this standard can be found in the report on voting indicated in t

44、he above table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. A list of all parts in the IEC 61190 series, published under the general title Attachment materials for electronic assembly, can be found on the IEC website. The committee has decided that the conten

45、ts of this publication will remain unchanged until the stability date indicated on the IEC web site under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication will be reconfirmed, withdrawn, replaced by a revised edition, or amended. IMPORTANT The co

46、lour inside logo on the cover page of this publication indicates that it contains colours which are considered to be useful for the correct understanding of its contents. Users should therefore print this document using a colour printer. 6 61190-1-2 IEC:2014 INTRODUCTION This part of IEC 61190 defin

47、es the characteristics of solder paste through the definitions of properties and specification of test methods and inspection criteria. Materials include solder powder and solder paste flux blended to produce solder paste. Solder powders are classified according to both shape and size distribution o

48、f the particles. It is not the intention of this standard to exclude those particle sizes or distributions not specifically listed. For flux properties of solder paste, including classification and testing, see IEC 61190-1-1. The requirements for solder paste are defined in general terms. In practic

49、e, where more stringent requirements are necessary, additional requirements may be defined by mutual agreement between the user and supplier. Users are cautioned to perform tests (beyond the scope of this specification) to determine the acceptability of the solder paste for specific processes. This standard is intended to be applicable to all types of solder paste used for soldering in general, as well as