1、 IEC 61190-1-2 Edition 3.0 2014-02 INTERNATIONAL STANDARD NORME INTERNATIONALE Attachment materials for electronic assembly Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly Matriaux de fixation pour les assemblages lectroniques Partie 1-2: Exigences
2、relatives aux ptes braser pour les interconnexions de haute qualit dans les assemblages de composants lectroniques IEC 61190-1-2:2014-02(en-fr) colour inside THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2014 IEC, Geneva, Switzerland All rights reserved. Unless otherwise specified, no part of th
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20、n 3.0 2014-02 INTERNATIONAL STANDARD NORME INTERNATIONALE Attachment materials for electronic assembly Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly Matriaux de fixation pour les assemblages lectroniques Partie 1-2: Exigences relatives aux ptes br
21、aser pour les interconnexions de haute qualit dans les assemblages de composants lectroniques INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE T ICS 31.190 PRICE CODE CODE PRIX ISBN 978-2-83221-423-7 Registered trademark of the International Electrotechnical Commi
22、ssion Marque dpose de la Commission Electrotechnique Internationale Warning! Make sure that you obtained this publication from an authorized distributor. Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agr. colour inside 2 61190-1-2 IEC:2014 CONTENTS FOREW
23、ORD . 4 INTRODUCTION . 6 1 Scope 7 2 Normative references 7 3 Terms and definitions 7 4 Standardized description for products 8 5 Test methods . 8 6 Requirements 9 6.1 General 9 6.2 Conflict 9 6.3 Alloy composition . 9 6.4 Flux characterization and inspection 9 General 9 6.4.1Shelf life . 10 6.4.2 6
24、.5 Solder powder particle size 10 Powder size determination 10 6.5.1Powder size 10 6.5.2Solder powder particle shape 11 6.5.3 6.6 Metal per cent 11 6.7 Viscosity 11 General 11 6.7.1Methods of determining viscosity 11 6.7.2 6.8 Slump and smear test 12 General 12 6.8.1Test with 0,2 mm thick stencil .
25、12 6.8.2Test with 0,1 mm thick stencil . 12 6.8.3 6.9 Solder ball test . 13 General 13 6.9.1Type 1-4 powder . 13 6.9.2Type 5-7 powder . 13 6.9.3 6.10 Tack test 14 6.11 Wetting 14 6.12 Labelling 14 7 Quality assurance provisions . 15 7.1 Responsibility for inspection 15 General 15 7.1.1Responsibility
26、 for compliance . 16 7.1.2Test equipment and inspection facilities 16 7.1.3Inspection conditions 16 7.1.4 7.2 Classification for inspections 16 7.3 Inspection report form 16 7.4 Qualification inspection 16 General 16 7.4.1Sample size 17 7.4.2Inspection routine . 17 7.4.3 7.5 Quality conformance 17 6
27、1190-1-2 IEC:2014 3 General 17 7.5.1Sampling plan . 17 7.5.2Rejected lots 17 7.5.3 8 Preparation for delivery . 17 9 Additional information Performance and shelf life extension inspections . 18 Annex A (normative) Test report on solder paste . 19 Annex B (informative) Reflow condition and profile 20
28、 Annex C (informative) Typical comparison of particle size distributions between laser diffraction method and screen method . 21 Bibliography 22 Figure 1 Slump test stencil thickness, 0,20 mm 12 Figure 2 Slump test stencil thickness, 0,10 mm 13 Figure 3 Solder ball test standards . 15 Figure C.1 Typ
29、ical comparison between laser diffraction and sieving . 21 Table 1 Standardized solder paste description . 8 Table 2 Standard solder powders . 10 Table 3 Test methods for particle size distribution . 11 Table 4 Solder paste qualification inspection . 17 Table 5 User inspection for solder paste prior
30、 to use . 18 Table A.1 Solder paste inspection report form 19 4 61190-1-2 IEC:2014 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly FOREWORD 1) The International
31、 Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fi
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38、access to IEC marks of conformity. IEC is not responsible for any services carried out by independent certification bodies. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including
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40、pon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the element
41、s of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 61190-1-2 has been prepared by IEC technical committee 91: Electronics assembly technology. This third edition cancels and replac
42、es the second edition published in 2007. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition: a) modification of the solder powder size in Table 2; b) addition of the information of “Reflow condition an
43、d profile” in Annex B; c) addition of a new Annex C. 61190-1-2 IEC:2014 5 The text of this standard is based on the following documents: CDV Report on voting 91/1154A/FDIS 91/1166/RVD Full information on the voting for the approval of this standard can be found in the report on voting indicated in t
44、he above table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. A list of all parts in the IEC 61190 series, published under the general title Attachment materials for electronic assembly, can be found on the IEC website. The committee has decided that the conten
45、ts of this publication will remain unchanged until the stability date indicated on the IEC web site under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication will be reconfirmed, withdrawn, replaced by a revised edition, or amended. IMPORTANT The co
46、lour inside logo on the cover page of this publication indicates that it contains colours which are considered to be useful for the correct understanding of its contents. Users should therefore print this document using a colour printer. 6 61190-1-2 IEC:2014 INTRODUCTION This part of IEC 61190 defin
47、es the characteristics of solder paste through the definitions of properties and specification of test methods and inspection criteria. Materials include solder powder and solder paste flux blended to produce solder paste. Solder powders are classified according to both shape and size distribution o
48、f the particles. It is not the intention of this standard to exclude those particle sizes or distributions not specifically listed. For flux properties of solder paste, including classification and testing, see IEC 61190-1-1. The requirements for solder paste are defined in general terms. In practic
49、e, where more stringent requirements are necessary, additional requirements may be defined by mutual agreement between the user and supplier. Users are cautioned to perform tests (beyond the scope of this specification) to determine the acceptability of the solder paste for specific processes. This standard is intended to be applicable to all types of solder paste used for soldering in general, as well as
