IEC 62047-22-2014 Semiconductor devices - Micro-electromechanical devices - Part 22 Electromechanical tensile test method for conductive thin films on flexible .pdf

1、 IEC 62047-22 Edition 1.0 2014-06 INTERNATIONAL STANDARD NORME INTERNATIONALE Semiconductor devices Micro-electromechanical devices Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates Dispositifs semiconducteurs Dispositifs microlectromcaniques Partie 22:

2、Mthode dessai de traction lectromcanique pour les couches minces conductrices sur des substrats souples IEC 62047-22:2014-06(en-fr) colour inside THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2014 IEC, Geneva, Switzerland All rights reserved. Unless otherwise specified, no part of this publicati

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20、 INTERNATIONAL STANDARD NORME INTERNATIONALE Semiconductor devices Micro-electromechanical devices Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates Dispositifs semiconducteurs Dispositifs microlectromcaniques Partie 22: Mthode dessai de traction lectrom

21、canique pour les couches minces conductrices sur des substrats souples INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE K ICS 31.080.99 PRICE CODE CODE PRIX ISBN 978-2-8322-1649-1 Registered trademark of the International Electrotechnical Commission Marque dpose d

22、e la Commission Electrotechnique Internationale Warning! Make sure that you obtained this publication from an authorized distributor. Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agr. colour inside 2 IEC 62047-22:2014 IEC 2014 CONTENTS FOREWORD . 3 1 Sc

23、ope 5 2 Normative references 5 3 Terms, definitions, symbols and designations 5 3.1 Terms and definitions 5 3.2 Symbols and designations 6 4 Test piece . 6 4.1 General . 6 4.2 Shape of a test piece 6 4.3 Measurement of dimensions . 7 5 Testing method and test apparatus 7 5.1 Test principle 7 5.2 Tes

24、t machine 7 5.3 Test procedure 9 5.4 Test environment 9 6 Test report . 9 Figure 1 Bilayered test piece 6 Figure 2 Schematic of an electromechanical test machine . 8 Figure 3 Electromechanical tensile grip 9 Table 1 Symbols and designations of a test piece 6 IEC 62047-22:2014 IEC 2014 3 INTERNATIONA

25、L ELECTROTECHNICAL COMMISSION _ SEMICONDUCTOR DEVICES MICRO-ELECTROMECHANICAL DEVICES Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization compri

26、sing all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standa

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35、mative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held resp

36、onsible for identifying any or all such patent rights. International Standard IEC 62047-22 has been prepared by subcommittee 47F: Micro- electromechanical systems, of IEC technical committee 47: Semiconductor devices. The text of this standard is based on the following documents: FDIS Report on voti

37、ng 47F/186/FDIS 47F/190/RVD Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. 4 IEC 62047-22:2014 IEC 2014 A list of all parts in the

38、 IEC 62047 series, published under the general title Semiconductor devices Micro-electromechanical devices, can be found in the IEC website. The committee has decided that the contents of this publication will remain unchanged until the stability date indicated on the IEC web site under “http:/webst

39、ore.iec.ch“ in the data related to the specific publication. At this date, the publication will be reconfirmed, withdrawn, replaced by a revised edition, or amended. IMPORTANT The colour inside logo on the cover page of this publication indicates that it contains colours which are considered to be u

40、seful for the correct understanding of its contents. Users should therefore print this document using a colour printer. IEC 62047-22:2014 IEC 2014 5 SEMICONDUCTOR DEVICES MICRO-ELECTROMECHANICAL DEVICES Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates 1

41、 Scope This part of IEC 62047 specifies a tensile test method to measure electromechanical properties of conductive thin micro-electromechanical systems (MEMS) materials bonded on non-conductive flexible substrates. Conductive thin-film structures on flexible substrates are extensively utilized in M

42、EMS, consumer products, and flexible electronics. The electrical behaviours of films on flexible substrates differ from those of freestanding films and substrates due to their interfacial interactions. Different combinations of flexible substrates and thin films often lead to various influences on t

43、he test results depending on the test conditions and the interfacial adhesion. The desired thickness of a thin MEMS material is 50 times thinner than that of the flexible substrate, whereas all other dimensions are similar to each other. 2 Normative references The following documents, in whole or in

44、 part, are normatively referenced in this document and are indispensable for its application. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 62047-2:2006, Semiconductor devices Micro-

45、electromechanical devices Part 2: Tensile testing method of thin film materials IEC 62047-3:2006, Semiconductor devices Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing IEC 62047-8:2011, Semiconductor devices Micro-electromechanical devices Part 8: Strip bend

46、ing test method for tensile property measurement of thin films ISO 527-3:1995, Plastics Determination of tensile properties Part 3: Test conditions for films and sheets 3 Terms, definitions, symbols and designations 3.1 Terms and definitions For the purposes of this document, the following terms and

47、 definitions apply. 3.1.1 gauge factor G Fratio of the change in electrical resistance divided by the original resistance (R o , resistance in the undeformed configuration) to engineering strain (e) Note 1 to entry: Gauge factor is expressed as G F= (R R O )/R O e, where R is the electrical resistan

48、ce in the deformed configuration. 6 IEC 62047-22:2014 IEC 2014 3.1.2 elongation at electrical failure A telicengineering strain value at which the electrical resistance starts to exceed a predefined limit 3.2 Symbols and designations The shape of the test piece and symbols are presented in Figure 1

49、and Table 1, respectively. The overall shape of the test piece is similar to a conventional thin-film or sheet test piece (in accordance with ISO 527-3) for tensile tests, but it has a multilayered structure. Figure 1 Bilayered test piece Table 1 Symbols and designations of a test piece Symbol Unit Designation l 1m Gauge length for strain and resistance change measurements l 2m O