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本文(IEC 60352-8-2011 Solderless connections - Part 8 Compression mount connections - General requirements test methods and practical guidance《无焊连接 第8部分 压缩座底连接 一般要求 .pdf)为本站会员(孙刚)主动上传,麦多课文库仅提供信息存储空间,仅对用户上传内容的表现方式做保护处理,对上载内容本身不做任何修改或编辑。 若此文所含内容侵犯了您的版权或隐私,请立即通知麦多课文库(发送邮件至master@mydoc123.com或直接QQ联系客服),我们立即给予删除!

IEC 60352-8-2011 Solderless connections - Part 8 Compression mount connections - General requirements test methods and practical guidance《无焊连接 第8部分 压缩座底连接 一般要求 .pdf

1、 IEC 60352-8 Edition 1.0 2011-02 INTERNATIONAL STANDARD NORME INTERNATIONALE Solderless connections Part 8: Compression mount connections General requirements, test methods and practical guidance Connexions sans soudure Partie 8: Connexions par compression Exigences gnrales, mthodes dessai et guide

2、pratique IEC 60352-8:2011 colour inside THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2011 IEC, Geneva, Switzerland All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form or by any means, electronic or mechanical, including photocop

3、ying and microfilm, without permission in writing from either IEC or IECs member National Committee in the country of the requester. If you have any questions about IEC copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or your local

4、IEC member National Committee for further information. Droits de reproduction rservs. Sauf indication contraire, aucune partie de cette publication ne peut tre reproduite ni utilise sous quelque forme que ce soit et par aucun procd, lectronique ou mcanique, y compris la photocopie et les microfilms,

5、 sans laccord crit de la CEI ou du Comit national de la CEI du pays du demandeur. Si vous avez des questions sur le copyright de la CEI ou si vous dsirez obtenir des droits supplmentaires sur cette publication, utilisez les coordonnes ci-aprs ou contactez le Comit national de la CEI de votre pays de

6、 rsidence. IEC Central Office 3, rue de Varemb CH-1211 Geneva 20 Switzerland Email: inmailiec.ch Web: www.iec.ch About the IEC The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes International Standards for all electrical, electronic and

7、 related technologies. About IEC publications The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the latest edition, a corrigenda or an amendment might have been published. Catalogue of IEC publications: www.iec.ch/searchpub The IEC on-

8、line Catalogue enables you to search by a variety of criteria (reference number, text, technical committee,). It also gives information on projects, withdrawn and replaced publications. IEC Just Published: www.iec.ch/online_news/justpub Stay up to date on all new IEC publications. Just Published det

9、ails twice a month all new publications released. Available on-line and also by email. Electropedia: www.electropedia.org The worlds leading online dictionary of electronic and electrical terms containing more than 20 000 terms and definitions in English and French, with equivalent terms in addition

10、al languages. Also known as the International Electrotechnical Vocabulary online. Customer Service Centre: www.iec.ch/webstore/custserv If you wish to give us your feedback on this publication or need further assistance, please visit the Customer Service Centre FAQ or contact us: Email: csciec.ch Te

11、l.: +41 22 919 02 11 Fax: +41 22 919 03 00 A propos de la CEI La Commission Electrotechnique Internationale (CEI) est la premire organisation mondiale qui labore et publie des normes internationales pour tout ce qui a trait llectricit, llectronique et aux technologies apparentes. A propos des public

12、ations CEI Le contenu technique des publications de la CEI est constamment revu. Veuillez vous assurer que vous possdez ldition la plus rcente, un corrigendum ou amendement peut avoir t publi. Catalogue des publications de la CEI: www.iec.ch/searchpub/cur_fut-f.htm Le Catalogue en-ligne de la CEI vo

13、us permet deffectuer des recherches en utilisant diffrents critres (numro de rfrence, texte, comit dtudes,). Il donne aussi des informations sur les projets et les publications retires ou remplaces. Just Published CEI: www.iec.ch/online_news/justpub Restez inform sur les nouvelles publications de la

14、 CEI. Just Published dtaille deux fois par mois les nouvelles publications parues. Disponible en-ligne et aussi par email. Electropedia: www.electropedia.org Le premier dictionnaire en ligne au monde de termes lectroniques et lectriques. Il contient plus de 20 000 termes et dfinitions en anglais et

15、en franais, ainsi que les termes quivalents dans les langues additionnelles. Egalement appel Vocabulaire Electrotechnique International en ligne. Service Clients: www.iec.ch/webstore/custserv/custserv_entry-f.htm Si vous dsirez nous donner des commentaires sur cette publication ou si vous avez des q

16、uestions, visitez le FAQ du Service clients ou contactez-nous: Email: csciec.ch Tl.: +41 22 919 02 11 Fax: +41 22 919 03 00 IEC 60352-8 Edition 1.0 2011-02 INTERNATIONAL STANDARD NORME INTERNATIONALE Solderless connections Part 8: Compression mount connections General requirements, test methods and

17、practical guidance Connexions sans soudure Partie 8: Connexions par compression Exigences gnrales, mthodes dessai et guide pratique INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE S ICS 13.220.10 PRICE CODE CODE PRIX ISBN 978-2-88912-363-6 Registered trademark of

18、 the International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internationale colour inside 2 60352-8 IEC:2011 CONTENTS FOREWORD . 4 INTRODUCTION . 6 1 Scope and object 7 2 Normative references . 7 3 Terms and definitions . 7 4 Requirements . 8 4.1 General . 8 4.2 Moun

19、ting tools . 8 4.3 Compression mount contact 8 4.3.1 Materials . 8 4.3.2 Design features . 8 4.3.3 Surface finishes . 8 4.4 Connector body . 9 4.4.1 Materials . 9 4.4.2 Design features . 9 4.5 Printed wiring board 9 4.5.1 Materials . 9 4.5.2 Design features . 9 4.5.3 Surface finishes . 9 4.6 Stiffen

20、er 9 5 Tests 9 5.1 General . 9 5.1.1 Standard conditions for testing 9 5.1.2 Mounting of the specimen 10 5.2 Test and measuring methods 10 5.2.1 General examination 10 5.2.2 Mechanical tests 10 5.2.3 Electrical tests . 11 5.2.4 Climatic tests . 12 5.3 Test schedule 13 5.3.1 General . 13 5.3.2 Basic

21、test schedule . 14 5.3.3 Full test schedule 14 6 Practical guidance 17 6.1 Advantages for compression mount connection . 17 6.2 Current-carrying capacity 18 6.3 Compression mount contact 18 6.4 Connector housing and printed wiring board 18 6.4.1 General . 18 6.4.2 Connector housing 18 6.4.3 Printed

22、wiring board 18 Bibliography 20 Figure 1 Wiring arrangement for contact resistance test . 12 Figure 2 An example of compression mount connection within a connector 17 60352-8 IEC:2011 3 Table 1 Vibration, preferred test severities . 11 Table 2 Group P basic test 14 Table 3 Group A corrosion test . 1

23、5 Table 4 Group B mechanical test 15 Table 5 Group C climatic test 16 Table 6 Group D current carrying capacity test . 16 4 60352-8 IEC:2011 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ SOLDERLESS CONNECTIONS Part 8: Compression mount connections General requirements, test methods and practical guida

24、nce FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in

25、 the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrust

26、ed to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the Internati

27、onal Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each

28、 technical committee has representation from all interested IEC National Committees. 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC

29、 Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in thei

30、r national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity assessme

31、nt services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any services carried out by independent certification bodies. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employee

32、s, servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the pu

33、blication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the poss

34、ibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 60352-8 has been prepared by subcommittee 48B: Connectors, of IEC technical committee 48: Electro

35、mechanical components and mechanical structures for electronic equipment. The text of this standard is based on the following documents: FDIS Report on voting 48B/2223/FDIS 48B/2229/RVD Full information on the voting for the approval of this standard can be found in the report on voting indicated in

36、 the above table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. A list of all parts of the IEC 60352 series, published under the general title Solderless connections, can be found on the IEC website. 60352-8 IEC:2011 5 The committee has decided that the content

37、s of this publication will remain unchanged until the stability date indicated on the IEC web site under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication will be reconfirmed; withdrawn; replaced by a revised edition, or amended. IMPORTANT The col

38、our inside logo on the cover page of this publication indicates that it contains colours which are considered to be useful for the correct understanding of its contents. Users should therefore print this document using a colour printer. 6 60352-8 IEC:2011 INTRODUCTION This part of IEC 60352 includes

39、 requirements, tests and practical guidance information. Two test schedules are provided: A basic test schedule applies to compression mount connections which conform to all of the requirements given in Clause 4. A full test schedule applies to compression mount connections which are part of a new c

40、omponent and have already passed the basic test schedule or to connections of the same kind which do not fully comply with the requirements of Clause 4. Requirements given in Clause 4 are derived from experience with successful applications of such compression mount connections. IEC Guide 109 advoca

41、tes the need to minimize the impact of a product on the natural environment throughout the product life cycle. It is understood that some of the materials permitted in this standard may have a negative environmental impact. As technological advances lead to acceptable alternatives for these material

42、s, they will be eliminated from the standard. 60352-8 IEC:2011 7 SOLDERLESS CONNECTIONS Part 8: Compression mount connections General requirements, test methods and practical guidance 1 Scope and object This part of IEC 60352 is applicable to compression mount connections with metallic spring contac

43、ts for use in telecommunication equipments and in other electronic devices employing similar techniques. Information on materials and data from industrial experience are included in addition to the test procedures to provide electrically stable connections under prescribed environmental conditions.

44、The object of this part of IEC 60352 is to determine the suitability of compression mount connections under specified electrical, mechanical and atmospheric conditions and to provide a means of comparing test results when the tools used to make the connectors are of different designs or manufacture.

45、 2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60050(581):2008, Inte

46、rnational Electrotechnical Vocabulary (IEV) Part 581: Electromechanical components for electronic equipment IEC 60068-1:1988, Environmental testing Part 1: General and guidance Amendment 1 (1992) IEC 60512 (all parts), Connectors for electric equipment Tests and measurements IEC 60512-1, Connectors

47、for electronic equipment Tests and measurements Part 1: General IEC 60512-1-100, Connectors for electric equipment Tests and measurements Part 1-100: General Applicable publications IEC 61249-2-7:2002, Materials for printed boards and other interconnecting structures Part 2-7: Reinforced base materi

48、als clad and unclad Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad 3 Terms and definitions For the purposes of this document, the terms and definitions given in IEC 60050(581) and IEC 60512-1 as well as the following (additional) terms and definiti

49、ons apply. 3.1 compression mount connection solderless connection between a compression mount contact and a contact pad which is established by a continuous compression force 8 60352-8 IEC:2011 3.2 compression mount contact conductive element in a compression mount connector which makes contact with its corresponding contact pad on a printed wiring board to provi

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