1、 IEC 60352-8 Edition 1.0 2011-02 INTERNATIONAL STANDARD NORME INTERNATIONALE Solderless connections Part 8: Compression mount connections General requirements, test methods and practical guidance Connexions sans soudure Partie 8: Connexions par compression Exigences gnrales, mthodes dessai et guide
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16、uestions, visitez le FAQ du Service clients ou contactez-nous: Email: csciec.ch Tl.: +41 22 919 02 11 Fax: +41 22 919 03 00 IEC 60352-8 Edition 1.0 2011-02 INTERNATIONAL STANDARD NORME INTERNATIONALE Solderless connections Part 8: Compression mount connections General requirements, test methods and
17、practical guidance Connexions sans soudure Partie 8: Connexions par compression Exigences gnrales, mthodes dessai et guide pratique INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE S ICS 13.220.10 PRICE CODE CODE PRIX ISBN 978-2-88912-363-6 Registered trademark of
18、 the International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internationale colour inside 2 60352-8 IEC:2011 CONTENTS FOREWORD . 4 INTRODUCTION . 6 1 Scope and object 7 2 Normative references . 7 3 Terms and definitions . 7 4 Requirements . 8 4.1 General . 8 4.2 Moun
19、ting tools . 8 4.3 Compression mount contact 8 4.3.1 Materials . 8 4.3.2 Design features . 8 4.3.3 Surface finishes . 8 4.4 Connector body . 9 4.4.1 Materials . 9 4.4.2 Design features . 9 4.5 Printed wiring board 9 4.5.1 Materials . 9 4.5.2 Design features . 9 4.5.3 Surface finishes . 9 4.6 Stiffen
20、er 9 5 Tests 9 5.1 General . 9 5.1.1 Standard conditions for testing 9 5.1.2 Mounting of the specimen 10 5.2 Test and measuring methods 10 5.2.1 General examination 10 5.2.2 Mechanical tests 10 5.2.3 Electrical tests . 11 5.2.4 Climatic tests . 12 5.3 Test schedule 13 5.3.1 General . 13 5.3.2 Basic
21、test schedule . 14 5.3.3 Full test schedule 14 6 Practical guidance 17 6.1 Advantages for compression mount connection . 17 6.2 Current-carrying capacity 18 6.3 Compression mount contact 18 6.4 Connector housing and printed wiring board 18 6.4.1 General . 18 6.4.2 Connector housing 18 6.4.3 Printed
22、wiring board 18 Bibliography 20 Figure 1 Wiring arrangement for contact resistance test . 12 Figure 2 An example of compression mount connection within a connector 17 60352-8 IEC:2011 3 Table 1 Vibration, preferred test severities . 11 Table 2 Group P basic test 14 Table 3 Group A corrosion test . 1
23、5 Table 4 Group B mechanical test 15 Table 5 Group C climatic test 16 Table 6 Group D current carrying capacity test . 16 4 60352-8 IEC:2011 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ SOLDERLESS CONNECTIONS Part 8: Compression mount connections General requirements, test methods and practical guida
24、nce FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in
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33、blication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the poss
34、ibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 60352-8 has been prepared by subcommittee 48B: Connectors, of IEC technical committee 48: Electro
35、mechanical components and mechanical structures for electronic equipment. The text of this standard is based on the following documents: FDIS Report on voting 48B/2223/FDIS 48B/2229/RVD Full information on the voting for the approval of this standard can be found in the report on voting indicated in
36、 the above table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. A list of all parts of the IEC 60352 series, published under the general title Solderless connections, can be found on the IEC website. 60352-8 IEC:2011 5 The committee has decided that the content
37、s of this publication will remain unchanged until the stability date indicated on the IEC web site under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication will be reconfirmed; withdrawn; replaced by a revised edition, or amended. IMPORTANT The col
38、our inside logo on the cover page of this publication indicates that it contains colours which are considered to be useful for the correct understanding of its contents. Users should therefore print this document using a colour printer. 6 60352-8 IEC:2011 INTRODUCTION This part of IEC 60352 includes
39、 requirements, tests and practical guidance information. Two test schedules are provided: A basic test schedule applies to compression mount connections which conform to all of the requirements given in Clause 4. A full test schedule applies to compression mount connections which are part of a new c
40、omponent and have already passed the basic test schedule or to connections of the same kind which do not fully comply with the requirements of Clause 4. Requirements given in Clause 4 are derived from experience with successful applications of such compression mount connections. IEC Guide 109 advoca
41、tes the need to minimize the impact of a product on the natural environment throughout the product life cycle. It is understood that some of the materials permitted in this standard may have a negative environmental impact. As technological advances lead to acceptable alternatives for these material
42、s, they will be eliminated from the standard. 60352-8 IEC:2011 7 SOLDERLESS CONNECTIONS Part 8: Compression mount connections General requirements, test methods and practical guidance 1 Scope and object This part of IEC 60352 is applicable to compression mount connections with metallic spring contac
43、ts for use in telecommunication equipments and in other electronic devices employing similar techniques. Information on materials and data from industrial experience are included in addition to the test procedures to provide electrically stable connections under prescribed environmental conditions.
44、The object of this part of IEC 60352 is to determine the suitability of compression mount connections under specified electrical, mechanical and atmospheric conditions and to provide a means of comparing test results when the tools used to make the connectors are of different designs or manufacture.
45、 2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60050(581):2008, Inte
46、rnational Electrotechnical Vocabulary (IEV) Part 581: Electromechanical components for electronic equipment IEC 60068-1:1988, Environmental testing Part 1: General and guidance Amendment 1 (1992) IEC 60512 (all parts), Connectors for electric equipment Tests and measurements IEC 60512-1, Connectors
47、for electronic equipment Tests and measurements Part 1: General IEC 60512-1-100, Connectors for electric equipment Tests and measurements Part 1-100: General Applicable publications IEC 61249-2-7:2002, Materials for printed boards and other interconnecting structures Part 2-7: Reinforced base materi
48、als clad and unclad Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad 3 Terms and definitions For the purposes of this document, the terms and definitions given in IEC 60050(581) and IEC 60512-1 as well as the following (additional) terms and definiti
49、ons apply. 3.1 compression mount connection solderless connection between a compression mount contact and a contact pad which is established by a continuous compression force 8 60352-8 IEC:2011 3.2 compression mount contact conductive element in a compression mount connector which makes contact with its corresponding contact pad on a printed wiring board to provi
