IEC 62047-6-2009 Semiconductor devices - Micro-electromechanical devices - Part 6 Axial fatigue testing methods of thin film materials《半导体装置 微电机装置 第6部分 薄膜材料的轴向疲.pdf

1、 IEC 62047-6 Edition 1.0 2009-04 INTERNATIONAL STANDARD NORME INTERNATIONALE Semiconductor devices Micro-electromechanical devices Part 6: Axial fatigue testing methods of thin film materials Dispositifs semiconducteurs Dispositifs microlectromcaniques Partie 6: Mthodes dessais de fatigue axiale des

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16、s questions, visitez le FAQ du Service clients ou contactez-nous: Email: csciec.ch Tl.: +41 22 919 02 11 Fax: +41 22 919 03 00 IEC 62047-6 Edition 1.0 2009-04 INTERNATIONAL STANDARD NORME INTERNATIONALE Semiconductor devices Micro-electromechanical devices Part 6: Axial fatigue testing methods of th

17、in film materials Dispositifs semiconducteurs Dispositifs microlectromcaniques Partie 6: Mthodes dessais de fatigue axiale des matriaux en couche mince INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE P ICS 31.080.99 PRICE CODE CODE PRIX ISBN 2-8318-1035-8 Registe

18、red trademark of the International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internationale 2 62047-6 IEC:2009 CONTENTS FOREWORD.3 1 Scope.5 2 Normative references .5 3 Terms and definitions .5 4 Test piece 7 4.1 Design of test piece.7 4.2 Preparation of test piece .

19、7 4.3 Test piece thickness7 4.4 Storage prior to testing7 5 Testing method and test apparatus.7 5.1 General .7 5.2 Method of gripping (mounting of test piece).8 5.3 Static loading test8 5.4 Method of loading8 5.5 Speed of testing 8 5.6 Environment control 8 6 Endurances (test termination).9 7 Test r

20、eport9 Annex A (informative) Technical background of this standard 10 Annex B (informative) Test piece .11 Annex C (informative) Displacement measurement 12 Annex D (informative) Testing environment13 Annex E (informative) Number of test pieces .14 Bibliography15 62047-6 IEC:2009 3 INTERNATIONAL ELE

21、CTROTECHNICAL COMMISSION _ SEMICONDUCTOR DEVICES MICRO-ELECTROMECHANICAL DEVICES Part 6: Axial fatigue testing methods of thin film materials FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical commi

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31、Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 62047-6 has been prepared by subcommittee 47F: Micro- electromechan

32、ical systems, of IEC technical committee 47: Semiconductor devices. The text of this standard is based on the following documents: FDIS Report on voting 47F/15/FDIS 47F/17/RVD Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above

33、 table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. A list of all the parts in the IEC 62047 series, under the general title Semiconductor devices Micro-electromechanical devices, can be found on the IEC website. 4 62047-6 IEC:2009 The committee has decided t

34、hat the contents of this publication will remain unchanged until the maintenance result date indicated on the IEC web site under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication will be reconfirmed, withdrawn, replaced by a revised edition, or am

35、ended. 62047-6 IEC:2009 5 SEMICONDUCTOR DEVICES MICRO-ELECTROMECHANICAL DEVICES Part 6: Axial fatigue testing methods of thin film materials 1 Scope This International Standard specifies the method for axial tensiletensile force fatigue testing of thin film materials with a length and width under 1

36、mm and a thickness in the range between 0,1 m and 10 m under constant force range or constant displacement range. Thin films are used as main structural materials for MEMS and micromachines. The main structural materials for MEMS, micromachines, etc., have special features, such as typical dimension

37、s of a few microns, material fabrication by deposition, and test piece fabrication by means of non-mechanical machining, including photolithography. This International Standard specifies the axial force fatigue testing methods for micro-sized smooth specimens, which enables a guarantee of accuracy c

38、orresponding to the special features. The tests are carried out at room temperatures, in air, with loading applied to the test piece along the longitudinal axis. 2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, on

39、ly the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 62047-2:2006, Semiconductor devices Micro-electromechanical devices Part 2: Tensile testing method of thin film materials 3 Terms and definitions For the purpos

40、es of this document, the following terms and definitions apply. 3.1 maximum force P maxhighest algebraic value of applied force in a cycle NOTE Adapted from ASTM E 1823-05a 1 1 . 3.2 minimum force P minlowest algebraic value of applied force in a cycle NOTE Adapted from ASTM E 1823-05a 1. 3.3 mean f

41、orce P meanalgebraic average of the maximum and minimum forces in constant amplitude loading, or of individual cycles NOTE Adapted from ASTM E 1823-05a 1. 1The figures between brackets refer to the Bibliography. 6 62047-6 IEC:2009 3.4 force range P algebraic difference between the maximum and minimu

42、m forces in constant amplitude loading 3.5 maximum stress maxhighest algebraic value of applied stress in a cycle 3.6 minimum stress minlowest algebraic value of applied force in a cycle 3.7 mean stress meanalgebraic average of the maximum and minimum stress in constant amplitude loading, or of indi

43、vidual cycles 3.8 stress range algebraic difference between the maximum and minimum stresses in constant amplitude loading 3.9 maximum displacement maxhighest algebraic value of applied displacement in a cycle 3.10 minimum displacement minlowest algebraic value of applied displacement in a cycle 3.1

44、1 mean displacement meanalgebraic average of the maximum and minimum displacement in constant amplitude loading, or of individual cycles 3.12 displacement range algebraic difference between the maximum and minimum displacements in constant amplitude loading 3.13 force ratio stress ratio R algebraic

45、ratio of the minimum force (or the minimum stress) to the maximum force (or the maximum stress) 62047-6 IEC:2009 7 4 Test piece 4.1 Design of test piece In order to minimize the influence of size, the test piece should have dimensions of the same order as that of the objective device component. The

46、shape and dimensions of the specimen should be based on Annex C of IEC 62047-2. The dimensions of the plane shape of the specimen shall be within an accuracy range of 1 % as specified in IEC 62047-2. The length of the parallel part of the test piece shall be more than 2,5 times the width. See C.1 in

47、 IEC 62047-2. The curved part between the gripped ends and the parallel part should have a radius of curvature sufficient to not cause a fracture at the curved part due to stress concentration. See C.2 in IEC 62047-2. The gauge marks specified in IEC 62047-2 are not necessary if the marks may concen

48、trate stress or initiate fatigue fractures. 4.2 Preparation of test piece The test piece should be fabricated using a process as similar as possible to that of the device to which the thin film is to be applied. The test piece also should be fabricated following the procedures specified in IEC 62047

49、2. The substrate removal process should be carefully chosen to prevent damaging the test piece. See C.3 in IEC 62047-2. The number of test pieces should be determined adequately according to the thin films tested. See Annex E. 4.3 Test piece thickness The thickness of each test piece shall be measured, as the film thickness is not usually uniform over a wafer.