1、 IEC 62047-6 Edition 1.0 2009-04 INTERNATIONAL STANDARD NORME INTERNATIONALE Semiconductor devices Micro-electromechanical devices Part 6: Axial fatigue testing methods of thin film materials Dispositifs semiconducteurs Dispositifs microlectromcaniques Partie 6: Mthodes dessais de fatigue axiale des
2、 matriaux en couche mince IEC 62047-6:2009 THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2009 IEC, Geneva, Switzerland All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form or by any means, electronic or mechanical, including photo
3、copying and microfilm, without permission in writing from either IEC or IECs member National Committee in the country of the requester. If you have any questions about IEC copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or your loc
4、al IEC member National Committee for further information. Droits de reproduction rservs. Sauf indication contraire, aucune partie de cette publication ne peut tre reproduite ni utilise sous quelque forme que ce soit et par aucun procd, lectronique ou mcanique, y compris la photocopie et les microfil
5、ms, sans laccord crit de la CEI ou du Comit national de la CEI du pays du demandeur. Si vous avez des questions sur le copyright de la CEI ou si vous dsirez obtenir des droits supplmentaires sur cette publication, utilisez les coordonnes ci-aprs ou contactez le Comit national de la CEI de votre pays
6、 de rsidence. IEC Central Office 3, rue de Varemb CH-1211 Geneva 20 Switzerland Email: inmailiec.ch Web: www.iec.ch About the IEC The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes International Standards for all electrical, electronic
7、and related technologies. About IEC publications The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the latest edition, a corrigenda or an amendment might have been published. Catalogue of IEC publications: www.iec.ch/searchpub The IEC
8、on-line Catalogue enables you to search by a variety of criteria (reference number, text, technical committee,). It also gives information on projects, withdrawn and replaced publications. IEC Just Published: www.iec.ch/online_news/justpub Stay up to date on all new IEC publications. Just Published
9、details twice a month all new publications released. Available on-line and also by email. Electropedia: www.electropedia.org The worlds leading online dictionary of electronic and electrical terms containing more than 20 000 terms and definitions in English and French, with equivalent terms in addit
10、ional languages. Also known as the International Electrotechnical Vocabulary online. Customer Service Centre: www.iec.ch/webstore/custserv If you wish to give us your feedback on this publication or need further assistance, please visit the Customer Service Centre FAQ or contact us: Email: csciec.ch
11、 Tel.: +41 22 919 02 11 Fax: +41 22 919 03 00 A propos de la CEI La Commission Electrotechnique Internationale (CEI) est la premire organisation mondiale qui labore et publie des normes internationales pour tout ce qui a trait llectricit, llectronique et aux technologies apparentes. A propos des pub
12、lications CEI Le contenu technique des publications de la CEI est constamment revu. Veuillez vous assurer que vous possdez ldition la plus rcente, un corrigendum ou amendement peut avoir t publi. Catalogue des publications de la CEI: www.iec.ch/searchpub/cur_fut-f.htm Le Catalogue en-ligne de la CEI
13、 vous permet deffectuer des recherches en utilisant diffrents critres (numro de rfrence, texte, comit dtudes,). Il donne aussi des informations sur les projets et les publications retires ou remplaces. Just Published CEI: www.iec.ch/online_news/justpub Restez inform sur les nouvelles publications de
14、 la CEI. Just Published dtaille deux fois par mois les nouvelles publications parues. Disponible en-ligne et aussi par email. Electropedia: www.electropedia.org Le premier dictionnaire en ligne au monde de termes lectroniques et lectriques. Il contient plus de 20 000 termes et dfinitions en anglais
15、et en franais, ainsi que les termes quivalents dans les langues additionnelles. Egalement appel Vocabulaire Electrotechnique International en ligne. Service Clients: www.iec.ch/webstore/custserv/custserv_entry-f.htm Si vous dsirez nous donner des commentaires sur cette publication ou si vous avez de
16、s questions, visitez le FAQ du Service clients ou contactez-nous: Email: csciec.ch Tl.: +41 22 919 02 11 Fax: +41 22 919 03 00 IEC 62047-6 Edition 1.0 2009-04 INTERNATIONAL STANDARD NORME INTERNATIONALE Semiconductor devices Micro-electromechanical devices Part 6: Axial fatigue testing methods of th
17、in film materials Dispositifs semiconducteurs Dispositifs microlectromcaniques Partie 6: Mthodes dessais de fatigue axiale des matriaux en couche mince INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE P ICS 31.080.99 PRICE CODE CODE PRIX ISBN 2-8318-1035-8 Registe
18、red trademark of the International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internationale 2 62047-6 IEC:2009 CONTENTS FOREWORD.3 1 Scope.5 2 Normative references .5 3 Terms and definitions .5 4 Test piece 7 4.1 Design of test piece.7 4.2 Preparation of test piece .
19、7 4.3 Test piece thickness7 4.4 Storage prior to testing7 5 Testing method and test apparatus.7 5.1 General .7 5.2 Method of gripping (mounting of test piece).8 5.3 Static loading test8 5.4 Method of loading8 5.5 Speed of testing 8 5.6 Environment control 8 6 Endurances (test termination).9 7 Test r
20、eport9 Annex A (informative) Technical background of this standard 10 Annex B (informative) Test piece .11 Annex C (informative) Displacement measurement 12 Annex D (informative) Testing environment13 Annex E (informative) Number of test pieces .14 Bibliography15 62047-6 IEC:2009 3 INTERNATIONAL ELE
21、CTROTECHNICAL COMMISSION _ SEMICONDUCTOR DEVICES MICRO-ELECTROMECHANICAL DEVICES Part 6: Axial fatigue testing methods of thin film materials FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical commi
22、ttees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical
23、 Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental
24、and non- governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agree
25、ments of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC National Committees. 3) IEC Publications have the form of recommendations for international use a
26、nd are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote
27、 international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicate
28、d in the latter. 5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any equipment declared to be in conformity with an IEC Publication. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to
29、IEC or its directors, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
30、expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9)
31、Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 62047-6 has been prepared by subcommittee 47F: Micro- electromechan
32、ical systems, of IEC technical committee 47: Semiconductor devices. The text of this standard is based on the following documents: FDIS Report on voting 47F/15/FDIS 47F/17/RVD Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above
33、 table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. A list of all the parts in the IEC 62047 series, under the general title Semiconductor devices Micro-electromechanical devices, can be found on the IEC website. 4 62047-6 IEC:2009 The committee has decided t
34、hat the contents of this publication will remain unchanged until the maintenance result date indicated on the IEC web site under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication will be reconfirmed, withdrawn, replaced by a revised edition, or am
35、ended. 62047-6 IEC:2009 5 SEMICONDUCTOR DEVICES MICRO-ELECTROMECHANICAL DEVICES Part 6: Axial fatigue testing methods of thin film materials 1 Scope This International Standard specifies the method for axial tensiletensile force fatigue testing of thin film materials with a length and width under 1
36、mm and a thickness in the range between 0,1 m and 10 m under constant force range or constant displacement range. Thin films are used as main structural materials for MEMS and micromachines. The main structural materials for MEMS, micromachines, etc., have special features, such as typical dimension
37、s of a few microns, material fabrication by deposition, and test piece fabrication by means of non-mechanical machining, including photolithography. This International Standard specifies the axial force fatigue testing methods for micro-sized smooth specimens, which enables a guarantee of accuracy c
38、orresponding to the special features. The tests are carried out at room temperatures, in air, with loading applied to the test piece along the longitudinal axis. 2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, on
39、ly the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 62047-2:2006, Semiconductor devices Micro-electromechanical devices Part 2: Tensile testing method of thin film materials 3 Terms and definitions For the purpos
40、es of this document, the following terms and definitions apply. 3.1 maximum force P maxhighest algebraic value of applied force in a cycle NOTE Adapted from ASTM E 1823-05a 1 1 . 3.2 minimum force P minlowest algebraic value of applied force in a cycle NOTE Adapted from ASTM E 1823-05a 1. 3.3 mean f
41、orce P meanalgebraic average of the maximum and minimum forces in constant amplitude loading, or of individual cycles NOTE Adapted from ASTM E 1823-05a 1. 1The figures between brackets refer to the Bibliography. 6 62047-6 IEC:2009 3.4 force range P algebraic difference between the maximum and minimu
42、m forces in constant amplitude loading 3.5 maximum stress maxhighest algebraic value of applied stress in a cycle 3.6 minimum stress minlowest algebraic value of applied force in a cycle 3.7 mean stress meanalgebraic average of the maximum and minimum stress in constant amplitude loading, or of indi
43、vidual cycles 3.8 stress range algebraic difference between the maximum and minimum stresses in constant amplitude loading 3.9 maximum displacement maxhighest algebraic value of applied displacement in a cycle 3.10 minimum displacement minlowest algebraic value of applied displacement in a cycle 3.1
44、1 mean displacement meanalgebraic average of the maximum and minimum displacement in constant amplitude loading, or of individual cycles 3.12 displacement range algebraic difference between the maximum and minimum displacements in constant amplitude loading 3.13 force ratio stress ratio R algebraic
45、ratio of the minimum force (or the minimum stress) to the maximum force (or the maximum stress) 62047-6 IEC:2009 7 4 Test piece 4.1 Design of test piece In order to minimize the influence of size, the test piece should have dimensions of the same order as that of the objective device component. The
46、shape and dimensions of the specimen should be based on Annex C of IEC 62047-2. The dimensions of the plane shape of the specimen shall be within an accuracy range of 1 % as specified in IEC 62047-2. The length of the parallel part of the test piece shall be more than 2,5 times the width. See C.1 in
47、 IEC 62047-2. The curved part between the gripped ends and the parallel part should have a radius of curvature sufficient to not cause a fracture at the curved part due to stress concentration. See C.2 in IEC 62047-2. The gauge marks specified in IEC 62047-2 are not necessary if the marks may concen
48、trate stress or initiate fatigue fractures. 4.2 Preparation of test piece The test piece should be fabricated using a process as similar as possible to that of the device to which the thin film is to be applied. The test piece also should be fabricated following the procedures specified in IEC 62047
49、-2. The substrate removal process should be carefully chosen to prevent damaging the test piece. See C.3 in IEC 62047-2. The number of test pieces should be determined adequately according to the thin films tested. See Annex E. 4.3 Test piece thickness The thickness of each test piece shall be measured, as the film thickness is not usually uniform over a wafer.
