1、 IEC 62137-1-4 Edition 1.0 2009-01 INTERNATIONAL STANDARD NORME INTERNATIONALE Surface mounting technology Environmental and endurance test methods for surface mount solder joint Part 1-4: Cyclic bending test Technologie de montage en surface Mthodes dessais denvironnement et dendurance des joints b
2、rass monts en surface Partie 1-4: Essai de flexion cyclique IEC 62137-1-4:2009 THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2009 IEC, Geneva, Switzerland All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form or by any means, elect
3、ronic or mechanical, including photocopying and microfilm, without permission in writing from either IEC or IECs member National Committee in the country of the requester. If you have any questions about IEC copyright or have an enquiry about obtaining additional rights to this publication, please c
4、ontact the address below or your local IEC member National Committee for further information. Droits de reproduction rservs. Sauf indication contraire, aucune partie de cette publication ne peut tre reproduite ni utilise sous quelque forme que ce soit et par aucun procd, lectronique ou mcanique, y c
5、ompris la photocopie et les microfilms, sans laccord crit de la CEI ou du Comit national de la CEI du pays du demandeur. Si vous avez des questions sur le copyright de la CEI ou si vous dsirez obtenir des droits supplmentaires sur cette publication, utilisez les coordonnes ci-aprs ou contactez le Co
6、mit national de la CEI de votre pays de rsidence. IEC Central Office 3, rue de Varemb CH-1211 Geneva 20 Switzerland Email: inmailiec.ch Web: www.iec.ch About the IEC The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes International Stand
7、ards for all electrical, electronic and related technologies. About IEC publications The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the latest edition, a corrigenda or an amendment might have been published. Catalogue of IEC publica
8、tions: www.iec.ch/searchpub The IEC on-line Catalogue enables you to search by a variety of criteria (reference number, text, technical committee,). It also gives information on projects, withdrawn and replaced publications. IEC Just Published: www.iec.ch/online_news/justpub Stay up to date on all n
9、ew IEC publications. Just Published details twice a month all new publications released. Available on-line and also by email. Electropedia: www.electropedia.org The worlds leading online dictionary of electronic and electrical terms containing more than 20 000 terms and definitions in English and Fr
10、ench, with equivalent terms in additional languages. Also known as the International Electrotechnical Vocabulary online. Customer Service Centre: www.iec.ch/webstore/custserv If you wish to give us your feedback on this publication or need further assistance, please visit the Customer Service Centre
11、 FAQ or contact us: Email: csciec.ch Tel.: +41 22 919 02 11 Fax: +41 22 919 03 00 A propos de la CEI La Commission Electrotechnique Internationale (CEI) est la premire organisation mondiale qui labore et publie des normes internationales pour tout ce qui a trait llectricit, llectronique et aux techn
12、ologies apparentes. A propos des publications CEI Le contenu technique des publications de la CEI est constamment revu. Veuillez vous assurer que vous possdez ldition la plus rcente, un corrigendum ou amendement peut avoir t publi. Catalogue des publications de la CEI: www.iec.ch/searchpub/cur_fut-f
13、.htm Le Catalogue en-ligne de la CEI vous permet deffectuer des recherches en utilisant diffrents critres (numro de rfrence, texte, comit dtudes,). Il donne aussi des informations sur les projets et les publications retires ou remplaces. Just Published CEI: www.iec.ch/online_news/justpub Restez info
14、rm sur les nouvelles publications de la CEI. Just Published dtaille deux fois par mois les nouvelles publications parues. Disponible en-ligne et aussi par email. Electropedia: www.electropedia.org Le premier dictionnaire en ligne au monde de termes lectroniques et lectriques. Il contient plus de 20
15、000 termes et dfinitions en anglais et en franais, ainsi que les termes quivalents dans les langues additionnelles. Egalement appel Vocabulaire Electrotechnique International en ligne. Service Clients: www.iec.ch/webstore/custserv/custserv_entry-f.htm Si vous dsirez nous donner des commentaires sur
16、cette publication ou si vous avez des questions, visitez le FAQ du Service clients ou contactez-nous: Email: csciec.ch Tl.: +41 22 919 02 11 Fax: +41 22 919 03 00 IEC 62137-1-4 Edition 1.0 2009-01 INTERNATIONAL STANDARD NORME INTERNATIONALE Surface mounting technology Environmental and endurance tes
17、t methods for surface mount solder joint Part 1-4: Cyclic bending test Technologie de montage en surface Mthodes dessais denvironnement et dendurance des joints brass monts en surface Partie 1-4: Essai de flexion cyclique INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNAT
18、IONALE M ICS 31.190 PRICE CODE CODE PRIX ISBN 2-8318-1021-5 Registered trademark of the International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internationale 2 62137-1-4 IEC:2009 CONTENTS FOREWORD.3 1 Scope.5 2 Normative references .6 3 Terms and definitions .6 4 Te
19、st equipment and material 6 4.1 Test equipment for cyclic bending .6 4.2 Test substrate .7 4.3 Solder alloy .7 4.4 Solder paste7 4.5 Reflow soldering equipment 7 4.6 Surface mount component for testing 7 5 Mounting method7 6 Test conditions .8 6.1 Pre-treatment 8 6.2 Test procedures 8 6.3 Judging cr
20、iteria9 7 Items to be included in the test report.9 8 Items to be prescribed in the product specifications9 Annex A (normative) Cyclic bending test equipment.11 Figure 1 Image drawing on evaluation area of joint strength.5 Figure 2 Typical reflow soldering profile.8 Figure A.1 Sample structure of su
21、bstrate bending jig .12 Figure A.2 Sample structure of cyclic bending strength test .13 62137-1-4 IEC:2009 3 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ SURFACE MOUNTING TECHNOLOGY ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT Part 1-4: Cyclic bending test FOREWORD 1) The I
22、nternational Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and e
23、lectronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical commi
24、ttees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non- governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization fo
25、r Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee
26、 has representation from all interested IEC National Committees. 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is acc
27、urate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regio
28、nal publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any equipment declared to be in conformit
29、y with an IEC Publication. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any pe
30、rsonal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative r
31、eferences cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible
32、for identifying any or all such patent rights. International Standard IEC 62137-1-4 has been prepared by IEC technical committee 91: Electronics assembly technology. The text of this standard is based on the following documents: FDIS Report on voting 91/815/FDIS 91/835/RVD Full information on the vo
33、ting for the approval of this standard can be found in the report on voting indicated in the above table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. 4 62137-1-4 IEC:2009 A list of all parts of the IEC 62137 series, under the general title Surface mounting te
34、chnology Environmental and endurance test methods for surface mount solder joint, can be found on the IEC website. The committee has decided that the contents of this publication will remain unchanged until the maintenance result date indicated on the IEC web site under “http:/webstore.iec.ch“ in th
35、e data related to the specific publication. At this date, the publication will be reconfirmed, withdrawn, replaced by a revised edition, or amended. 62137-1-4 IEC:2009 5 SURFACE MOUNTING TECHNOLOGY ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT Part 1-4: Cyclic bending test
36、1 Scope The test method described in this part of IEC 62137 applies to surface mount components with a thin and wide basal plane, such as QFP and BGA. This test method evaluates the endurance of the solder joints between component leads and lands on a substrate by cyclic bending of substrate. This t
37、est also evaluates the effects of repeated mechanical stress, such as key pushing in cell phones, the strength of the solder joint between component terminals and lands on a substrate. In this test method, the evaluation requires first to mount the surface mount component on the substrate by reflow
38、soldering, then cyclically bend the substrate to a certain degree of depth until fracture of the solder joints occurs. The properties of the solder joints (e.g, solder alloy, substrate, mounted device or design, etc.) are evaluated to assist in improving the strength of the solder joints. Component
39、lead Substrate Enlarge Evaluation area Plated layers Substrate land Intermetallic compound layers Solder Substrate Component lead IEC 1174/07 Figure 1 Image drawing on evaluation area of joint strength 6 62137-1-4 IEC:2009 2 Normative references The following referenced documents are indispensable f
40、or the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60068-1, Environmental testing Part 1: General and guidance IEC 60194, Printed board design, manufa
41、cture and assembly Terms and definitions IEC 61188-5 (all parts 5), Printed boards and printed board assemblies Design and use Part 5: Attachment (land-joint) considerations IEC 61190-1-2, Attachment materials for electronic assembly Part 1-2: Requirements for soldering pastes for high-quality inter
42、connects in electronics assembly IEC 61190-1-3, Attachment materials for electronic assembly Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications IEC 61249-2-7, Materials for printed boards and other interconnecting s
43、tructures Part 2-7: Reinforced base materials clad and unclad Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad IEC 61760-1, Surface mounting technology Part 1: Standard method for the specification of surface mounting components (SMDs) 3 Terms and de
44、finitions For the purposes of this document, the terms and definitions given in IEC 60194, IEC 60068-1 and IEC 61249-2-7 as well as the following apply. 3.1 cyclic bending strength intensity of the strength, which is expressed in the number of cycles to attain the joint fracture between surface moun
45、t component terminals mounted on the printed board and the copper land of the substrate after bending the substrate cyclically to a certain degree to allow the surface of the component side of the board to become a convex shape 3.2 displacement rate moving velocities of the indenter when cyclically
46、bending the substrate 3.3 displacement range distance from the initial test position at the centre of the substrate to the maximum indentation caused by pushing the indenter down and by pulling it back 4 Test equipment and materials 4.1 Test equipment for cyclic bending The equipment for cyclic bend
47、ing tests consists of a tension compression testing machine, substrate bending jigs, a resistance measuring instrument and a recorder. The specifications shall comply with those of the cyclic bending test equipment described in Annex A. 62137-1-4 IEC:2009 7 4.2 Test substrate Unless otherwise prescr
48、ibed by the relevant product specifications, the test substrate shall meet the following conditions: a) Material: Epoxide woven, glass fabric, copper-clad laminated sheet, general purpose grade (see IEC 612492-7), with foil bonded to one side and a nominal thickness of the sheet, including the metal
49、 foil, of 1,6 mm with a tolerance of 0,20 mm. The copper foil should have a thickness of 0,035 mm 0,010 mm. b) Size: The size of the substrate depends on the size and shape of a surface mount device soldered on the substrate. The substrate shall be able to be fastened to the pull test equipment. c) Land geometry: The shape and size of a land shall comply with the IEC 61188-5 ser
copyright@ 2008-2019 麦多课文库(www.mydoc123.com)网站版权所有
备案/许可证编号:苏ICP备17064731号-1