1、 IEC 62137-1-4 Edition 1.0 2009-01 INTERNATIONAL STANDARD NORME INTERNATIONALE Surface mounting technology Environmental and endurance test methods for surface mount solder joint Part 1-4: Cyclic bending test Technologie de montage en surface Mthodes dessais denvironnement et dendurance des joints b
2、rass monts en surface Partie 1-4: Essai de flexion cyclique IEC 62137-1-4:2009 THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2009 IEC, Geneva, Switzerland All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form or by any means, elect
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16、cette publication ou si vous avez des questions, visitez le FAQ du Service clients ou contactez-nous: Email: csciec.ch Tl.: +41 22 919 02 11 Fax: +41 22 919 03 00 IEC 62137-1-4 Edition 1.0 2009-01 INTERNATIONAL STANDARD NORME INTERNATIONALE Surface mounting technology Environmental and endurance tes
17、t methods for surface mount solder joint Part 1-4: Cyclic bending test Technologie de montage en surface Mthodes dessais denvironnement et dendurance des joints brass monts en surface Partie 1-4: Essai de flexion cyclique INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNAT
18、IONALE M ICS 31.190 PRICE CODE CODE PRIX ISBN 2-8318-1021-5 Registered trademark of the International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internationale 2 62137-1-4 IEC:2009 CONTENTS FOREWORD.3 1 Scope.5 2 Normative references .6 3 Terms and definitions .6 4 Te
19、st equipment and material 6 4.1 Test equipment for cyclic bending .6 4.2 Test substrate .7 4.3 Solder alloy .7 4.4 Solder paste7 4.5 Reflow soldering equipment 7 4.6 Surface mount component for testing 7 5 Mounting method7 6 Test conditions .8 6.1 Pre-treatment 8 6.2 Test procedures 8 6.3 Judging cr
20、iteria9 7 Items to be included in the test report.9 8 Items to be prescribed in the product specifications9 Annex A (normative) Cyclic bending test equipment.11 Figure 1 Image drawing on evaluation area of joint strength.5 Figure 2 Typical reflow soldering profile.8 Figure A.1 Sample structure of su
21、bstrate bending jig .12 Figure A.2 Sample structure of cyclic bending strength test .13 62137-1-4 IEC:2009 3 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ SURFACE MOUNTING TECHNOLOGY ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT Part 1-4: Cyclic bending test FOREWORD 1) The I
22、nternational Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and e
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31、eferences cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible
32、for identifying any or all such patent rights. International Standard IEC 62137-1-4 has been prepared by IEC technical committee 91: Electronics assembly technology. The text of this standard is based on the following documents: FDIS Report on voting 91/815/FDIS 91/835/RVD Full information on the vo
33、ting for the approval of this standard can be found in the report on voting indicated in the above table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. 4 62137-1-4 IEC:2009 A list of all parts of the IEC 62137 series, under the general title Surface mounting te
34、chnology Environmental and endurance test methods for surface mount solder joint, can be found on the IEC website. The committee has decided that the contents of this publication will remain unchanged until the maintenance result date indicated on the IEC web site under “http:/webstore.iec.ch“ in th
35、e data related to the specific publication. At this date, the publication will be reconfirmed, withdrawn, replaced by a revised edition, or amended. 62137-1-4 IEC:2009 5 SURFACE MOUNTING TECHNOLOGY ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT Part 1-4: Cyclic bending test
36、1 Scope The test method described in this part of IEC 62137 applies to surface mount components with a thin and wide basal plane, such as QFP and BGA. This test method evaluates the endurance of the solder joints between component leads and lands on a substrate by cyclic bending of substrate. This t
37、est also evaluates the effects of repeated mechanical stress, such as key pushing in cell phones, the strength of the solder joint between component terminals and lands on a substrate. In this test method, the evaluation requires first to mount the surface mount component on the substrate by reflow
38、soldering, then cyclically bend the substrate to a certain degree of depth until fracture of the solder joints occurs. The properties of the solder joints (e.g, solder alloy, substrate, mounted device or design, etc.) are evaluated to assist in improving the strength of the solder joints. Component
39、lead Substrate Enlarge Evaluation area Plated layers Substrate land Intermetallic compound layers Solder Substrate Component lead IEC 1174/07 Figure 1 Image drawing on evaluation area of joint strength 6 62137-1-4 IEC:2009 2 Normative references The following referenced documents are indispensable f
40、or the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60068-1, Environmental testing Part 1: General and guidance IEC 60194, Printed board design, manufa
41、cture and assembly Terms and definitions IEC 61188-5 (all parts 5), Printed boards and printed board assemblies Design and use Part 5: Attachment (land-joint) considerations IEC 61190-1-2, Attachment materials for electronic assembly Part 1-2: Requirements for soldering pastes for high-quality inter
42、connects in electronics assembly IEC 61190-1-3, Attachment materials for electronic assembly Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications IEC 61249-2-7, Materials for printed boards and other interconnecting s
43、tructures Part 2-7: Reinforced base materials clad and unclad Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad IEC 61760-1, Surface mounting technology Part 1: Standard method for the specification of surface mounting components (SMDs) 3 Terms and de
44、finitions For the purposes of this document, the terms and definitions given in IEC 60194, IEC 60068-1 and IEC 61249-2-7 as well as the following apply. 3.1 cyclic bending strength intensity of the strength, which is expressed in the number of cycles to attain the joint fracture between surface moun
45、t component terminals mounted on the printed board and the copper land of the substrate after bending the substrate cyclically to a certain degree to allow the surface of the component side of the board to become a convex shape 3.2 displacement rate moving velocities of the indenter when cyclically
46、bending the substrate 3.3 displacement range distance from the initial test position at the centre of the substrate to the maximum indentation caused by pushing the indenter down and by pulling it back 4 Test equipment and materials 4.1 Test equipment for cyclic bending The equipment for cyclic bend
47、ing tests consists of a tension compression testing machine, substrate bending jigs, a resistance measuring instrument and a recorder. The specifications shall comply with those of the cyclic bending test equipment described in Annex A. 62137-1-4 IEC:2009 7 4.2 Test substrate Unless otherwise prescr
48、ibed by the relevant product specifications, the test substrate shall meet the following conditions: a) Material: Epoxide woven, glass fabric, copper-clad laminated sheet, general purpose grade (see IEC 612492-7), with foil bonded to one side and a nominal thickness of the sheet, including the metal
49、 foil, of 1,6 mm with a tolerance of 0,20 mm. The copper foil should have a thickness of 0,035 mm 0,010 mm. b) Size: The size of the substrate depends on the size and shape of a surface mount device soldered on the substrate. The substrate shall be able to be fastened to the pull test equipment. c) Land geometry: The shape and size of a land shall comply with the IEC 61188-5 ser
