BS EN 62258-6-2006 Semiconductor die products - Requirements for information concerning thermal simulation《半导体压模制品 关于热模拟的信息要求》.pdf

1、 g49g50g3g38g50g51g60g44g49g42g3g58g44g55g43g50g56g55g3g37g54g44g3g51g40g53g48g44g54g54g44g50g49g3g40g59g38g40g51g55g3g36g54g3g51g40g53g48g44g55g55g40g39g3g37g60g3g38g50g51g60g53g44g42g43g55g3g47g36g58concerning thermal simulationThe European Standard EN 62258-6:2006 has the status of a British Stan

2、dardICS 31.080.99Semiconductor die products Part 6: Requirements for information BRITISH STANDARDBS EN 62258-6:2006BS EN 62258-6:2006This British Standard was published under the authority of the Standards Policy and Strategy Committee on 30 November 2006 BSI 2006ISBN 0 580 49609 0Amendments issued

3、since publicationAmd. No. Date CommentsThis publication does not purport to include all the necessary provisions of a contract. Users are responsible for its correct application.Compliance with a British Standard cannot confer immunity from legal obligations.National forewordThis British Standard wa

4、s published by BSI. It is the UK implementation of EN 62258-6:2006. It is identical with IEC 62258-6:2006. It supersedes PD ES 59008-4-3:2000, which will be withdrawn on 1 September 2009. The UK participation in its preparation was entrusted to Technical Committee EPL/47, Semiconductors.A list of or

5、ganizations represented on EPL/47 can be obtained on request to its secretary.EUROPEAN STANDARD EN 62258-6 NORME EUROPENNE EUROPISCHE NORM September 2006 CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotech

6、nische Normung Central Secretariat: rue de Stassart 35, B - 1050 Brussels 2006 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 62258-6:2006 E ICS 31.080.99 Supersedes ES 59008-4-3:1999English version Semiconductor die products Par

7、t 6: Requirements for information concerning thermal simulation (IEC 62258-6:2006) Produits de matrice de semi-conducteur Partie 6: Exigences pour linformation concernant la simulation thermique (CEI 62258-6:2006) Halbleiter-Chip-Erzeugnisse Teil 6: Anforderungen fr Angaben hinsichtlich der thermisc

8、hen Simulation (IEC 62258-6:2006) This European Standard was approved by CENELEC on 2006-09-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-

9、to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation

10、under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Cyprus, the Czech Republic, Denmark, Estonia, Finland, France, Ge

11、rmany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland and the United Kingdom. Foreword The text of document 47/1870/FDIS, future edition 1 of IEC 62258-6, prepared by I

12、EC TC 47, Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 62258-6 on 2006-09-01. This standard is to be used in conjunction with EN 62258-1 and EN 62258-2. The following dates were fixed: latest date by which the EN has to be implemented at nat

13、ional level by publication of an identical national standard or by endorsement (dop) 2007-06-01 latest date by which the national standards conflicting with the EN have to be withdrawn (dow) 2009-09-01 Annex ZA has been added by CENELEC. _ Endorsement notice The text of the International Standard IE

14、C 62258-6:2006 was approved by CENELEC as a European Standard without any modification. _ EN 62258-6:2006INTERNATIONAL STANDARD IEC62258-6First edition2006-08Semiconductor die products Part 6: Requirements for information concerning thermal simulation IEC 2006 Copyright - all rights reserved No part

15、 of this publication may be reproduced or utilized in any form or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from the publisher. International Electrotechnical Commission, 3, rue de Varemb, PO Box 131, CH-1211 Geneva 20, SwitzerlandTel

16、ephone: +41 22 919 02 11 Telefax: +41 22 919 03 00 E-mail: inmailiec.ch Web: www.iec.ch J For price, see current cataloguePRICE CODE Commission Electrotechnique InternationaleInternational Electrotechnical Commission EN 62258-6:2006 2 CONTENTS INTRODUCTION.3 1 Scope.4 2 Normative references .4 3 Ter

17、ms and definitions.4 4 General 4 5 Requirements for information for thermal simulation .5 5.1 Requirements for bare die with or without added connection structures.5 5.2 Requirements for minimally-packaged die .5 5.3 Information on thermal simulation model .6 Bibliography .8 Annex ZA (normative) Nor

18、mative references to international publications with their corresponding European publications.7 EN 62258-6:2006 3 INTRODUCTION This standard is based on the work carried out in the ESPRIT 4thFramework project GOODDIE which resulted in the publication of the ES 59008 series of European specification

19、s. Organisations that helped prepare this part to IEC 62258 included the ESPRIT ENCAST project, the Die Products Consortium, JEITA, JEDEC and ZVEI. EN 62258-6:2006 4 SEMICONDUCTOR DIE PRODUCTS Part 6: Requirements for information concerning thermal simulation 1 Scope This part of IEC 62258 has been

20、developed to facilitate the production, supply and use of semiconductor die products, including: wafers; singulated bare die; die and wafers with attached connection structures; minimally or partially encapsulated die and wafers. This part of IEC 62258 determines the information required to facilita

21、te the use of thermal data and models for simulation of the thermal behaviour and verification of the correct functionality of electronic systems that include bare semiconductor die, with or without connection structures, and/or minimally packaged semiconductor die. It is intended to assist all thos

22、e involved in the supply chain for die devices to comply with the requirements of IEC 62258-1 and IEC 62258-2. 2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated reference

23、s, the latest edition of the referenced document (including any amendments) applies. IEC 62258-1: Semiconductor die products Part 1: Requirements for procurement and use IEC 62258-2: Semiconductor die products Part 2: Exchange data formats 3 Terms and definitions For the purposes of this document, t

24、he terms, definitions and acronyms as given in IEC 62258-1 apply. 4 General To comply with IEC 62258-1, suppliers of die devices shall furnish information, which is necessary and sufficient for users of the devices at all stages of design, procurement, manufacture and test of products containing the

25、m It is expected that much of the information supplied will be in the public domain and available from such sources as manufacturers data sheets. However, this standard does not place an obligation on a supplier to make information public. Any information that a supplier considers to be proprietary

26、or commercially sensitive may be supplied under the terms of a non-disclosure agreement. EN 62258-6:2006 5 Requirements and recommendations provided in this standard apply to thermal simulation models used to perform an analysis on how the thermal excursions within the die affect the electrical perf

27、ormance of the die and system. 5 Requirements for information for thermal simulation 5.1 Requirements for bare die with or without added connection structures 5.1.1 General This clause covers the requirements for bare die with or without added connection structures. The following information shall b

28、e given as a minimum together with any information needed to satisfy a specific thermal simulation model. 5.1.2 Operating temperature conditions The range of temperature under which the device operates shall be stated. 5.1.3 Maximum junction temperature The maximum allowable junction temperature sha

29、ll be stated. 5.1.4 Extended junction temperature range Further allowed junction temperatures exceeding the maximum junction temperatures with reduced lifetimes for the conditions in 5.1.2 should be stated where appropriate. 5.1.5 Power dissipation Maximum power dissipation values under specified co

30、nditions shall be stated. Minimum and typical power dissipation values should also be given. 5.1.6 Distribution of heat sources When possible, a plot of the die surface indicating the position and area of heat sources should be given. 5.1.7 Type and power of each heat source The type and power of ea

31、ch heat source when possible, should be described, including whether the heat is generated in the die surface or the bulk substrate. 5.1.8 Thermal conductivity The thermal conductivity of all materials should be given. 5.1.9 Specific thermal capacity If a transient simulation is required, then the s

32、pecific thermal capacity of all materials should be given. 5.2 Requirements for minimally-packaged die 5.2.1 General Information as described in the following subclauses should be supplied in addition to any relevant information as defined in 5.1 Modelling methods for packaged devices may be appropr

33、iate for this type of die device. EN 62258-6:2006 6 5.2.2 Package thermal resistance The junction-to-ambient and/or junction-to-reference thermal resistance values of the package should be given. 5.2.3 Thermal resistance measurement test method and conditions A description of the test method and mea

34、surement test conditions including ambient temperature and airflow, reference temperature and reference location, under which thermal resistance measurements have been carried out, should be supplied. The power applied to the device under test during the thermal resistance measurements should also b

35、e given. 5.2.4 Thermal properties of the encapsulation materials The thermal properties of all materials used for encapsulating the die (e.g. encapsulant, adhesive, substrate dielectric, etc.) used in the package should be stated. 5.3 Information on thermal simulation model 5.3.1 General Where a the

36、rmal simulation model is provided, for example a finite-element model, the information as defined in the following subclauses shall be given. 5.3.2 Model file name The name of the file containing the model shall be given. 5.3.3 Creation date The date on which the model file was created shall be give

37、n. 5.3.4 Model description A description of the model shall be provided in sufficient detail for a user to understand its scope and apply the corresponding simulator correctly. 5.3.5 Model source The source and originator of the model shall be stated. 5.3.6 Simulation program The name(s) of the simu

38、lation program(s) that will accept the model file as valid input shall be given. NOTE Examples of such simulators include ANSYS, FLOTHERM and ICEPAK. 5.3.7 Program version The version(s) of the simulation program(s) that are compatible with the given file shall be given. 5.3.8 Compliance level The l

39、evel(s) of the simulation program(s) with which the model file complies shall be given. 5.3.9 Model scope The scope of the model shall be given, including any limitations in its use. EN 62258-6:2006Annex ZA (normative) Normative references to international publications with their corresponding Europ

40、ean publications The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. NOTE When an international publi

41、cation has been modified by common modifications, indicated by (mod), the relevant EN/HD applies. Publication Year Title EN/HD Year IEC 62258-1 -1)Semiconductor die products Part 1: Requirements for procurement and use EN 62258-1 20052)IEC 62258-2 -1)Semiconductor die products Part 2: Exchange data

42、formats EN 62258-2 20052)1)Undated reference. 2)Valid edition at date of issue. EN 62258-6:2006 7 8 Bibliography EIA/JESD51, Methodology for the Thermal Measurement of Component Packages (Single Semiconductor Device) EIA/JESD51-1, Integrated Circuit Thermal Measurement Method Electrical Test Method

43、(Single Semiconductor Device) EIA/JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions Natural Convection (Still Air) EIA/JESD51-5, Extension of Thermal Test Board Standards for Packages with Direct Thermal Attachment Mechanisms EIA/JESD51-6, Thermal Test Method Environmental C

44、onditions Forced Convection EIA/JESD51-8, Thermal Test Method, Environmental Conditions: Junction to Board Thermal Resistance EIA/JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements _ EN 62258-6:2006blankBS EN BSI389 Chiswick High RoadLondonW4 4AL62258-6:2006BSI British S

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