BS EN 62258-6-2006 Semiconductor die products - Requirements for information concerning thermal simulation《半导体压模制品 关于热模拟的信息要求》.pdf
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1、 g49g50g3g38g50g51g60g44g49g42g3g58g44g55g43g50g56g55g3g37g54g44g3g51g40g53g48g44g54g54g44g50g49g3g40g59g38g40g51g55g3g36g54g3g51g40g53g48g44g55g55g40g39g3g37g60g3g38g50g51g60g53g44g42g43g55g3g47g36g58concerning thermal simulationThe European Standard EN 62258-6:2006 has the status of a British Stan
2、dardICS 31.080.99Semiconductor die products Part 6: Requirements for information BRITISH STANDARDBS EN 62258-6:2006BS EN 62258-6:2006This British Standard was published under the authority of the Standards Policy and Strategy Committee on 30 November 2006 BSI 2006ISBN 0 580 49609 0Amendments issued
3、since publicationAmd. No. Date CommentsThis publication does not purport to include all the necessary provisions of a contract. Users are responsible for its correct application.Compliance with a British Standard cannot confer immunity from legal obligations.National forewordThis British Standard wa
4、s published by BSI. It is the UK implementation of EN 62258-6:2006. It is identical with IEC 62258-6:2006. It supersedes PD ES 59008-4-3:2000, which will be withdrawn on 1 September 2009. The UK participation in its preparation was entrusted to Technical Committee EPL/47, Semiconductors.A list of or
5、ganizations represented on EPL/47 can be obtained on request to its secretary.EUROPEAN STANDARD EN 62258-6 NORME EUROPENNE EUROPISCHE NORM September 2006 CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotech
6、nische Normung Central Secretariat: rue de Stassart 35, B - 1050 Brussels 2006 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 62258-6:2006 E ICS 31.080.99 Supersedes ES 59008-4-3:1999English version Semiconductor die products Par
7、t 6: Requirements for information concerning thermal simulation (IEC 62258-6:2006) Produits de matrice de semi-conducteur Partie 6: Exigences pour linformation concernant la simulation thermique (CEI 62258-6:2006) Halbleiter-Chip-Erzeugnisse Teil 6: Anforderungen fr Angaben hinsichtlich der thermisc
8、hen Simulation (IEC 62258-6:2006) This European Standard was approved by CENELEC on 2006-09-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-
9、to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
10、under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Cyprus, the Czech Republic, Denmark, Estonia, Finland, France, Ge
11、rmany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland and the United Kingdom. Foreword The text of document 47/1870/FDIS, future edition 1 of IEC 62258-6, prepared by I
12、EC TC 47, Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 62258-6 on 2006-09-01. This standard is to be used in conjunction with EN 62258-1 and EN 62258-2. The following dates were fixed: latest date by which the EN has to be implemented at nat
13、ional level by publication of an identical national standard or by endorsement (dop) 2007-06-01 latest date by which the national standards conflicting with the EN have to be withdrawn (dow) 2009-09-01 Annex ZA has been added by CENELEC. _ Endorsement notice The text of the International Standard IE
14、C 62258-6:2006 was approved by CENELEC as a European Standard without any modification. _ EN 62258-6:2006INTERNATIONAL STANDARD IEC62258-6First edition2006-08Semiconductor die products Part 6: Requirements for information concerning thermal simulation IEC 2006 Copyright - all rights reserved No part
15、 of this publication may be reproduced or utilized in any form or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from the publisher. International Electrotechnical Commission, 3, rue de Varemb, PO Box 131, CH-1211 Geneva 20, SwitzerlandTel
16、ephone: +41 22 919 02 11 Telefax: +41 22 919 03 00 E-mail: inmailiec.ch Web: www.iec.ch J For price, see current cataloguePRICE CODE Commission Electrotechnique InternationaleInternational Electrotechnical Commission EN 62258-6:2006 2 CONTENTS INTRODUCTION.3 1 Scope.4 2 Normative references .4 3 Ter
17、ms and definitions.4 4 General 4 5 Requirements for information for thermal simulation .5 5.1 Requirements for bare die with or without added connection structures.5 5.2 Requirements for minimally-packaged die .5 5.3 Information on thermal simulation model .6 Bibliography .8 Annex ZA (normative) Nor
18、mative references to international publications with their corresponding European publications.7 EN 62258-6:2006 3 INTRODUCTION This standard is based on the work carried out in the ESPRIT 4thFramework project GOODDIE which resulted in the publication of the ES 59008 series of European specification
19、s. Organisations that helped prepare this part to IEC 62258 included the ESPRIT ENCAST project, the Die Products Consortium, JEITA, JEDEC and ZVEI. EN 62258-6:2006 4 SEMICONDUCTOR DIE PRODUCTS Part 6: Requirements for information concerning thermal simulation 1 Scope This part of IEC 62258 has been
20、developed to facilitate the production, supply and use of semiconductor die products, including: wafers; singulated bare die; die and wafers with attached connection structures; minimally or partially encapsulated die and wafers. This part of IEC 62258 determines the information required to facilita
21、te the use of thermal data and models for simulation of the thermal behaviour and verification of the correct functionality of electronic systems that include bare semiconductor die, with or without connection structures, and/or minimally packaged semiconductor die. It is intended to assist all thos
22、e involved in the supply chain for die devices to comply with the requirements of IEC 62258-1 and IEC 62258-2. 2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated reference
23、s, the latest edition of the referenced document (including any amendments) applies. IEC 62258-1: Semiconductor die products Part 1: Requirements for procurement and use IEC 62258-2: Semiconductor die products Part 2: Exchange data formats 3 Terms and definitions For the purposes of this document, t
24、he terms, definitions and acronyms as given in IEC 62258-1 apply. 4 General To comply with IEC 62258-1, suppliers of die devices shall furnish information, which is necessary and sufficient for users of the devices at all stages of design, procurement, manufacture and test of products containing the
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