1、REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED REV SHEET REV SHEET 15 16 17 18 REV REV STATUS OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Thanh V. Nguyen CHECKED BY Thanh V. Nguyen DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216 http:/www.dscc.dla.mil APPROVED BY Th
2、omas M. Hess DRAWING APPROVAL DATE 04-03-16 MICROCIRCUIT, DIGITAL, ADVANCED CMOS, 16-BIT D-TYPE FLIP-FLOP WITH THREE-STATE OUTPUTS, MONOLITHIC SILICON SIZE A CAGE CODE 67268 5962-04213 STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT O
3、F DEFENSE AMSC N/A REVISION LEVEL SHEET 1 OF 18 DSCC FORM 2233 APR 97 5962-E161-04 DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SIZE A 5962-04213 STANDARD MICROCIRCUI
4、T DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of ca
5、se outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 F 04213 01 V X A Federal RHA Device Devic
6、e Case Lead stock class designator type class outline finish designator (see 1.2.1) (see 1.2.2) designator (see 1.2.4) (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the approp
7、riate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Ge
8、neric number Circuit function 01 54AC16374 16-bit D-type flip-flop with three-state outputs 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to
9、the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive
10、 designator Terminals Package style X See figure 1 48 Flat pack 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IH
11、S-,-,-SIZE A 5962-04213 STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ 2/ 3/ Supply voltage range (VCC) -0.5 V dc to +7.0 V dc DC input voltage range (VIN) -0.5 V dc to VCC + 0.5 V d
12、c DC output voltage range (VOUT). -0.5 V dc to VCC + 0.5 V dc DC input clamp diode current (IIK) 20 mA DC output clamp diode current (IOK) . 20 mA DC output current (IOUT). 50 mA DC VCC or GND current (per output pin) . 400 mA Maximum power dissipation (PD) 500 mW Storage temperature range (TSTG) .
13、-65C to +150C Lead temperature (soldering, 10 seconds) +260C Thermal resistance, junction-to-case (JC). 22C/W Junction temperature (TJ) 175C 4/ 1.4 Recommended operating conditions. 2/ 3/ 5/ Supply voltage range (VCC) +2.0 V dc to +6.0 V dc Input voltage range (VIN) 0.0 V dc to VCC Output voltage ra
14、nge (VOUT) 0.0 V dc to VCC Input rise or fall time rate (VIN from 30% to 70% of VCC) (t/v): VCC = 3.0 V, 45 V, and 5.5 V 0 to 8 ns/V Case operating temperature range (TC) -55C to +125C 1.5 Radiation features. Total dose (dose rate = 50 300 rads (Si)/s) 300 krads (Si) Single Event Latchup (SEL) or Si
15、ngle Event Upset (SEU) 93 MeV-cm2/mg 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Unless otherwise noted, all voltages are referenced to GND. 3/ The limits for the p
16、arameters specified herein shall apply over the full specified VCC range and case temperature range of -55C to +125C. 4/ Maximum junction temperature shall not be exceeded except for allowable short duration burn-in screening conditions in accordance with method 5004 of MIL-STD-883. 5/ Operation fro
17、m 2.0 V dc to 3.0 V dc is provided for compatibility with data retention and battery back-up systems. Data retention implies no input transition and no stored data loss with the following conditions: VIH 70% of VCC, VIL 30% of VCC, VOH 70% of VCC at -20 A, VOL 30% of VCC at 20 A. Provided by IHSNot
18、for ResaleNo reproduction or networking permitted without license from IHS-,-,-SIZE A 5962-04213 STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL SHEET 4 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and ha
19、ndbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplemen
20、t thereto, cited in the solicitation. SPECIFICATION DEPARTMENT OF DEFENSE MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. STANDARDS DEPARTMENT OF DEFENSE MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outli
21、nes. HANDBOOKS DEPARTMENT OF DEFENSE MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization Document Order Desk, 700 Robbins Avenue
22、, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Non-Government publications. The following document(s) form a part of this document to the extent specified herein. Unless otherwise specified, the issues of the documents which are DOD adopted are those listed in the issue of the DODISS cited in the
23、solicitation. Unless otherwise specified, the issues of documents not listed in the DODISS are the issues of the documents cited in the solicitation. ELECTRONIC INDUSTRIES ALLIANCE (EIA) JEDEC Standard No. 20 - Standard for Description of 54/74ACXXXX and 54/74ACTXXXX Advanced High-Speed CMOS Devices
24、. (Applications for copies should be addressed to the Electronic Industries Alliance, 2500 Wilson Boulevard, Arlington VA 22201-3834.) (Non-Government standards and other publications are normally available from the organizations that prepare or distribute the documents. These documents may also be
25、available in or through libraries or other informational services.) 2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regul
26、ations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modi
27、fication in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Provided by IHSNot for ResaleNo reproduction o
28、r networking permitted without license from IHS-,-,-SIZE A 5962-04213 STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL SHEET 5 DSCC FORM 2234 APR 97 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensio
29、ns shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outline. The case outline shall be in accordance with 1.2.4 and figure 1 herein. 3.2.2 Terminal connections. The terminal connections shall be as spe
30、cified on figure 2. 3.2.3 Truth table. The truth table shall be as specified on figure 3. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 4. 3.2.5 Switching waveforms and test circuit. The switching waveforms and test circuit shall be as specified on figure 5. 3.2.6 Radiation
31、exposure circuit. The radiation exposure circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless othe
32、rwise specified herein, the electrical performance characteristics and post irradiation parameter limits are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in
33、table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked as listed in MIL-HDBK-103. For packages where marking of the entire SMD PIN number is not feasible d
34、ue to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accorda
35、nce with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of complian
36、ce. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as
37、 an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and
38、herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcirc
39、uits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change as defined in MIL-PRF-38535, appendix A. 3.9 Verification and review
40、for device class M. For device class M, DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment
41、 for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 38 (see MIL-PRF-38535, appendix A). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SIZE A 5962-04213 STANDARD MICROCIRCUIT DRAWING DEFENSE SUPP
42、LY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Limits 4/ Test and MIL-STD-883 test method 1/ Symbol Test conditions 2/ 3/ -55C TC +125C +3.0 V VCC +5.5 V unless otherwise specified Device type and device clas
43、s VCC Group A subgroups Min Max Unit 3.0 V 2.1 4.5 V 3.15 High level input voltage VIH 5/ All All 5.5 V 1, 2, 3 3.85 V 3.0 V 0.9 4.5 V 1.35 Low level input voltage VIL 5/ All All 5.5 V 1, 2, 3 1.65 V 3.0 V 1, 2, 3 2.9 4.5 V 1, 2, 3 4.4 IOH = -50 A 5.5 V 1, 2, 3 5.4 1 2.56 IOH = -12 mA 3.0 V 2, 3 2.4
44、6 1 3.86 4.5 V 2, 3 3.76 1 4.86 IOH = -24 mA 5.5 V 2, 3 4.76 High level output voltage 3006 VOH For all inputs affecting output under test VIN = VIH or VIL For all other inputs VIN = VCC or GND IOH = -50 mA 6/ All All 5.5 V 1, 2, 3 3.85 V 3.0 V 1, 2, 3 0.1 4.5 V 1, 2, 3 0.1 IOL = 50 A 5.5 V 1, 2, 3
45、0.1 1 0.36 IOL = 12 mA 3.0 V 2, 3 0.44 1 0.36 4.5 V 2, 3 0.44 1 0.36 IOL = 24 mA 5.5 V 2, 3 0.44 Low level output voltage 3007 VOL For all inputs affecting output under test VIN = VIH or VIL For all other inputs VIN = VCC or GND IOL = 50 mA 6/ All All 5.5 V 1, 2, 3 1.65 V Positive input clamp voltag
46、e 3022 VIC+ For input under test, IIN = 1.0 mA All Q, V 0.0 V 1 0.4 1.5 V Negative input clamp voltage 3022 VIC- For input under test, IIN = -1.0 mA All Q, V Open 1 -0.4 -1.5 V See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IH
47、S-,-,-SIZE A 5962-04213 STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Limits 4/ Test and MIL-STD-883 test method 1/ Symbol Test conditions 2/ 3/ -55C TC
48、+125C +3.0 V VCC +5.5 V unless otherwise specified Device type and device class VCC Group A subgroups Min Max Unit 1 0.1 Input leakage current high 3010 IIH For input under test, VIN = VCC For all other inputs VIN = VCC or GND All All 5.5 V 2, 3 1.0 A 1 -0.1 Input leakage current low 3009 IIL For input under test, VIN = GND For all other inputs VIN = VCC or GND All All 5.5 V 2, 3 -1.0 A 1 0.5 VIN = VIH or VIL VOUT = VCC All All 2, 3 5.0 Three-state output leakage current high 3021 IOZH M, D, P, L, R, F 01 Q, V 5.5 V 1 10 A 1 -0.5 VIN = VIH or VIL VOUT = GND Al
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