DLA SMD-5962-04213-2004 MICROCIRCUIT DIGITAL ADVANCED CMOS 16-BIT D-TYPE FLIP-FLOP WITH THREE-STATE OUTPUTS MONOLITHIC SILICON《硅单片三态输出D型双稳态触发电路16比特氧化物半导体的数字微型电路》.pdf
《DLA SMD-5962-04213-2004 MICROCIRCUIT DIGITAL ADVANCED CMOS 16-BIT D-TYPE FLIP-FLOP WITH THREE-STATE OUTPUTS MONOLITHIC SILICON《硅单片三态输出D型双稳态触发电路16比特氧化物半导体的数字微型电路》.pdf》由会员分享,可在线阅读,更多相关《DLA SMD-5962-04213-2004 MICROCIRCUIT DIGITAL ADVANCED CMOS 16-BIT D-TYPE FLIP-FLOP WITH THREE-STATE OUTPUTS MONOLITHIC SILICON《硅单片三态输出D型双稳态触发电路16比特氧化物半导体的数字微型电路》.pdf(19页珍藏版)》请在麦多课文档分享上搜索。
1、REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED REV SHEET REV SHEET 15 16 17 18 REV REV STATUS OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Thanh V. Nguyen CHECKED BY Thanh V. Nguyen DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216 http:/www.dscc.dla.mil APPROVED BY Th
2、omas M. Hess DRAWING APPROVAL DATE 04-03-16 MICROCIRCUIT, DIGITAL, ADVANCED CMOS, 16-BIT D-TYPE FLIP-FLOP WITH THREE-STATE OUTPUTS, MONOLITHIC SILICON SIZE A CAGE CODE 67268 5962-04213 STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT O
3、F DEFENSE AMSC N/A REVISION LEVEL SHEET 1 OF 18 DSCC FORM 2233 APR 97 5962-E161-04 DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SIZE A 5962-04213 STANDARD MICROCIRCUI
4、T DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of ca
5、se outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 F 04213 01 V X A Federal RHA Device Devic
6、e Case Lead stock class designator type class outline finish designator (see 1.2.1) (see 1.2.2) designator (see 1.2.4) (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the approp
7、riate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Ge
8、neric number Circuit function 01 54AC16374 16-bit D-type flip-flop with three-state outputs 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to
9、the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive
10、 designator Terminals Package style X See figure 1 48 Flat pack 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IH
11、S-,-,-SIZE A 5962-04213 STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ 2/ 3/ Supply voltage range (VCC) -0.5 V dc to +7.0 V dc DC input voltage range (VIN) -0.5 V dc to VCC + 0.5 V d
12、c DC output voltage range (VOUT). -0.5 V dc to VCC + 0.5 V dc DC input clamp diode current (IIK) 20 mA DC output clamp diode current (IOK) . 20 mA DC output current (IOUT). 50 mA DC VCC or GND current (per output pin) . 400 mA Maximum power dissipation (PD) 500 mW Storage temperature range (TSTG) .
13、-65C to +150C Lead temperature (soldering, 10 seconds) +260C Thermal resistance, junction-to-case (JC). 22C/W Junction temperature (TJ) 175C 4/ 1.4 Recommended operating conditions. 2/ 3/ 5/ Supply voltage range (VCC) +2.0 V dc to +6.0 V dc Input voltage range (VIN) 0.0 V dc to VCC Output voltage ra
14、nge (VOUT) 0.0 V dc to VCC Input rise or fall time rate (VIN from 30% to 70% of VCC) (t/v): VCC = 3.0 V, 45 V, and 5.5 V 0 to 8 ns/V Case operating temperature range (TC) -55C to +125C 1.5 Radiation features. Total dose (dose rate = 50 300 rads (Si)/s) 300 krads (Si) Single Event Latchup (SEL) or Si
15、ngle Event Upset (SEU) 93 MeV-cm2/mg 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Unless otherwise noted, all voltages are referenced to GND. 3/ The limits for the p
16、arameters specified herein shall apply over the full specified VCC range and case temperature range of -55C to +125C. 4/ Maximum junction temperature shall not be exceeded except for allowable short duration burn-in screening conditions in accordance with method 5004 of MIL-STD-883. 5/ Operation fro
17、m 2.0 V dc to 3.0 V dc is provided for compatibility with data retention and battery back-up systems. Data retention implies no input transition and no stored data loss with the following conditions: VIH 70% of VCC, VIL 30% of VCC, VOH 70% of VCC at -20 A, VOL 30% of VCC at 20 A. Provided by IHSNot
18、for ResaleNo reproduction or networking permitted without license from IHS-,-,-SIZE A 5962-04213 STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL SHEET 4 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and ha
19、ndbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplemen
20、t thereto, cited in the solicitation. SPECIFICATION DEPARTMENT OF DEFENSE MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. STANDARDS DEPARTMENT OF DEFENSE MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outli
21、nes. HANDBOOKS DEPARTMENT OF DEFENSE MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization Document Order Desk, 700 Robbins Avenue
22、, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Non-Government publications. The following document(s) form a part of this document to the extent specified herein. Unless otherwise specified, the issues of the documents which are DOD adopted are those listed in the issue of the DODISS cited in the
23、solicitation. Unless otherwise specified, the issues of documents not listed in the DODISS are the issues of the documents cited in the solicitation. ELECTRONIC INDUSTRIES ALLIANCE (EIA) JEDEC Standard No. 20 - Standard for Description of 54/74ACXXXX and 54/74ACTXXXX Advanced High-Speed CMOS Devices
24、. (Applications for copies should be addressed to the Electronic Industries Alliance, 2500 Wilson Boulevard, Arlington VA 22201-3834.) (Non-Government standards and other publications are normally available from the organizations that prepare or distribute the documents. These documents may also be
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