ImageVerifierCode 换一换
格式:PDF , 页数:14 ,大小:384.69KB ,
资源ID:704495      下载积分:10000 积分
快捷下载
登录下载
邮箱/手机:
温馨提示:
如需开发票,请勿充值!快捷下载时,用户名和密码都是您填写的邮箱或者手机号,方便查询和重复下载(系统自动生成)。
如填写123,账号就是123,密码也是123。
特别说明:
请自助下载,系统不会自动发送文件的哦; 如果您已付费,想二次下载,请登录后访问:我的下载记录
支付方式: 支付宝扫码支付 微信扫码支付   
注意:如需开发票,请勿充值!
验证码:   换一换

加入VIP,免费下载
 

温馨提示:由于个人手机设置不同,如果发现不能下载,请复制以下地址【http://www.mydoc123.com/d-704495.html】到电脑端继续下载(重复下载不扣费)。

已注册用户请登录:
账号:
密码:
验证码:   换一换
  忘记密码?
三方登录: 微信登录  

下载须知

1: 本站所有资源如无特殊说明,都需要本地电脑安装OFFICE2007和PDF阅读器。
2: 试题试卷类文档,如果标题没有明确说明有答案则都视为没有答案,请知晓。
3: 文件的所有权益归上传用户所有。
4. 未经权益所有人同意不得将文件中的内容挪作商业或盈利用途。
5. 本站仅提供交流平台,并不能对任何下载内容负责。
6. 下载文件中如有侵权或不适当内容,请与我们联系,我们立即纠正。
7. 本站不保证下载资源的准确性、安全性和完整性, 同时也不承担用户因使用这些下载资源对自己和他人造成任何形式的伤害或损失。

版权提示 | 免责声明

本文(ECA EIA-886-A-2014 Thick Film Resistor Array Specification.pdf)为本站会员(孙刚)主动上传,麦多课文库仅提供信息存储空间,仅对用户上传内容的表现方式做保护处理,对上载内容本身不做任何修改或编辑。 若此文所含内容侵犯了您的版权或隐私,请立即通知麦多课文库(发送邮件至master@mydoc123.com或直接QQ联系客服),我们立即给予删除!

ECA EIA-886-A-2014 Thick Film Resistor Array Specification.pdf

1、 EIA STANDARD Thick Film Resistor Array Specification EIA-886-A (Revision of EIA-886) May 2014 ANSI/EIA-886-A-2014 Approved: May 29, 2014 EIA-886-A NOTICE EIA Engineering Standards and Publications are designed to serve the public interest through eliminating misunderstandings between manufacturers

2、and purchasers, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for his particular need. Existence of such Standards and Publications shall not in any respect preclude any member or nonmember of

3、 ECIA from manufacturing or selling products not conforming to such Standards and Publications, nor shall the existence of such Standards and Publications preclude their voluntary use by those other than ECIA members, whether the standard is to be used either domestically or internationally. Standar

4、ds and Publications are adopted by ECIA in accordance with the American National Standards Institute (ANSI) patent policy. By such action, ECIA does not assume any liability to any patent owner, nor does it assume any obligation whatever to parties adopting the Standard or Publication. This EIA Stan

5、dard is considered to have International Standardization implication, but the International Electrotechnical Commission activity has not progressed to the point where a valid comparison between the EIA Standard and the IEC document can be made. This Standard does not purport to address all safety pr

6、oblems associated with its use or all applicable regulatory requirements. It is the responsibility of the user of this Standard to establish appropriate safety and health practices and to determine the applicability of regulatory limitations before its use. (From Standards Proposal No. 5306, formula

7、ted under the cognizance of the P-1 Committee on EIA National Resistive Devices Standards). Published by Electronic Components Industry Association 2014 Engineering Department 2214 Rock Hill Road, Suite 265 Herndon, VA 20170 PLEASE! DONT VIOLATE THE LAW! This document is copyrighted by the ECIA and

8、may not be reproduced without permission. Organizations may obtain permission to reproduce a limited number of copies through entering into a license agreement. For information, contact: IHS 15 Inverness Way East Englewood, CO 80112-5704 or call USA and Canada (1-877-413-5184), International (303-39

9、7-7956) i CONTENTS Page Foreword iii Clause 1 Introduction 1 2 Applicable documents latest version) 1 3 Requirements 1 3.1 Physical 1 3.1.1 Dimensions 1 3.1.2 Termination style 1 3.1.3 Material 1 3.1.4 Solderability 1 3.1.5 Solder pad dimensions 1 3.1.6 Marking 1 3.2 Electrical 1 3.2.1 Resistor rati

10、ngs 1 3.3 Environmental and mechanical tests 2 3.3.1 Resistance to soldering heat 2 3.3.2 Terminal strength 2 3.3.3 Terminal adhesion 2 3.3.4 Thermal shock 2 3.3.5 Low temperature operation 3 3.3.6 High temperature exposure 3 3.3.7 Short time overload 3 3.3.8 Moisture resistance 3 3.3.9 Life 3 3.3.1

11、0 Temperature cycling 3 3.3.11 Post environmental and mechanical conditioning 3 3.3.12 Acceptance criteria for environmental and mechanical tests 3 4 Quality assurance provisions 3 5 Packaging 3 Tables 1 Resistor wattage and voltage 2 2 Dimensions (Isolated) 4 3 Dimensions (Bussed) 5 4 Solder pad di

12、mension 6 Figures 1 Termination configurations 6 2 Termination style 6 3 Available circuits 7 ii Foreword This specification was prepared by the P-1 Committee on Resistive Components of the Electronic Industries Alliances sector Electronic Components, Assemblies, Equipment it specifies 1 hour at -65

13、 C followed by 45 minutes of rated continuous voltage applied while maintaining the same temperature. 3.3.6 High temperature exposure High temperature exposure shall be tested in accordance with 4.8.7 of MIL-PRF-55342; it specifies 100 hours at +150 C. 3.3.7 Short time overload Short time overload s

14、hall be tested in accordance with 4.8.6 of MIL-PRF-55342; it specifies 2.5 times rated continuous working voltage shall be applied for 5 seconds but not exceeding twice the maximum voltage. 3.3.8 Moisture resistance Moisture resistance shall be tested in accordance with MIL-STD-202 method 106 which

15、specifies 10 cycles for 240 hours. No loading voltage shall be applied during testing. 3.3.9 Life Life shall be tested in accordance with MIL-STD-202 method 108 which specifies 70 C for 250 hours. 3.3.10 Temperature cycling Temperature cycling shall be tested - 30 minutes at -55 C; 15 minutes at +25

16、 C; 30 minutes at +125 C; 15 minutes at +25 C for 5 cycles. 3.3.11 Post environmental & mechanical conditioning The devices that require electrical testing after environmental and mechanical stress may be allowed to remain at room temperature for a period up to 24 hours prior to electrical testing.

17、3.3.12 Acceptance criteria for environmental & mechanical tests The devices shall meet all specifications herein and there shall be no evidence of mechanical damage or corrosion 4 Quality Assurance Provisions Parts shall be inspected to assure compliance to the requirements of this specification. 5

18、Packaging The devices should be packaged in tape and reel. The tape and reel shall meet the latest version of EIA standard (EIA-481). The size of the reel shall be 178 mm, 254 mm, or 330 mm (7 in, 10 in, or 13 in). The tape and reel EIA-866-A Page 4 should be placed in a pizza-style box or sleeve an

19、d its material should comply with the EIA Packaging Material Standards for ESD Sensitive Items (EIA-541). The outside of the pizza-style box or sleeve should be bar-coded in accordance with the latest version of EIA standard (EIA-556). Size Code Inch (mm) L w c d t a (ref.) b (ref.) p (ref.) 0402x2

20、0.039 +/- 0.004 (1.0 +/- 0.1) 0.039 +/- 0.004(1.0 +/- 0.1) 0.006 +/- 0.004 (0.15 +/- 0.1) 0.012 (0.31) max 0.014 +/- 0.004 (0.356 +/- 0.1) 0.013 (0.33) 0.017 (0.432)0.026 (0.66) 0402x4 0.079 +/-0.004 (2.0 +/- 0.1) 0.020 (0.51) 0603x2 0.062 +/- 0.008 (1.6 +/- 0.2) 0.063 +/- 0.008(1.6 +/- 0.2) 0.012 +

21、/- 0.008 (0.3 +/- 0.2) 0.016 +/- 0.006 (0.4 +/- 0.15) 0.024 +/- 0.004 (0.6 +/- 0.1) 0.020 (0.50) 0.006 (0.15) 0.031 (0.79) 0603x4 0.126 +/- 0.008 (3.2 +/- 0.2) 0603x8 0.252 +/- 0.008 (6.4 +/- 0.2) 0603x8a 0.149 +/- 0.004 (3.79 +/- 0.1) 0.012 +/- 0.004 (0.3 +/- 0.1) 0.018 +/- 0.004 (0.45 +I- 0.1) 0.0

22、12 (0.31) 0.020 (0.50) 0805x2 0.1 +/- 0.006 (2.54 +/- 0.2) 0.079 +/-,0.008 (2.0 +/- 0.2) 0.016 +/- 0.012 (0.4 +/- 0.3) 0.022 +/- 0.006 (0.55 +/- 0.15) 0.024 +/- 0.004 (0.6 +/- 0.1) 0.031 (0.79) 0.050 (1.27) 0805x4 0.2 +/- 0.008 (5.08 +/- 0.2) 0805x8 0.4 +/- 0.008 (10.16 +/- 0.2) 1206x2 0.1 +/- 0.008

23、 (2.54 +/- 0.2) 0.126 +/- 0.008 (3.2 +/- 0.2) 0.020 +/- 0.012 (0.5 +/- 0.3) 1206x4 0.2 +/- 0.008 (5.08 +/- 0.2) 1206x8 0.4 +1- 0.008 (10.16 +I- 0.2) Table 2-Dimensions (Isolated arrays only) EIA-866-A Page 5 Size Code Inch (mm) L t w t p1 d a (ref.) b (ref.) p (ref.) c (ref) 0603 X 10 (circuit 1 & 2

24、) 0.126 +/- 0.004 (3.2 +/- 0.1) 0.063 +/- 0.004 (1.6 +/- 0.1) 0.020 +/- 0.004 (0.5 +/- 0.1) - - 0.010 +/- 0.004 (0.25 +/- 0.1) 0.016 (0.4) 0.012 (0.3) 0.025 (0.64) 0.012 (0.3) 0603x 10a (circuit 3) 0.126 +/- 0.004 (3.2 +/- 0.1) 0.063 +/- 0.004 (1.6+/-0.1) 0.022 +/- 0.004 (0.55 +/- 0.1) 0.032 +/- 0.0

25、04(0.8 +/0 0.1) 0.014 +/- 0.004 (0.35 +/- 0.1) 0.013 (0.33) 0.008 (0.2) 0.025 (0.64) 0.012 (0.3) 1008 X 5 (circuit 5) 0.126 +/0 .008 (3.2 +/- 0.2) 0.098 +I- 0.008 (2.5 +/- 0.2) 0.024 +/- 0.004 (0.6 +/- 0.1) 0.02 +/- 0.004 (0.5 +I- 0.1) 0.02 +/- 0.006 (0.5 +/- 0.15) 0.026 (0.65) 0.006 (0.15) 0.025 (0

26、.64) 0.012 (0.3) 0805 x 10 (circuit 3) 0.157 +/- 0.008 (4.0 +/- 0.2) 0.083 +/- 0.008 (2.1 +/- 0.2) 0.024 +/- 0.004 (0.6 +/- 0.1) 0.043 +/- 0.004(1.1 +/- 0.1) 0.016 +/- 0.008 (0.4 +/- 0.2) 0.02 (0.5) 0.01 (0.25) 0.031 (0.8) 0.01 (0.25) 1206 X 10 (circuit 1& 2) 0.252 +/- 0.008 (6.4 +I0.2 0.122 +/- 0.0

27、08 (3.1 +/-0.2) 0.024 +/- 0.004 (0.6 +/- 0.004) - - 0.016 +/- 0.008 (0.4 +/- 0.2) 0.024 (0.6) 0.006 (0.15) 0.05 (1.27) 0.014 (0.35) 1206 X 9 (circuit4) 0.252 +/- 0.008 (6.4 +/- 0.2 0.126 +/- 0.008 (3.2 +/- 0.2) 0.024 +/- 0.004 (0.6 +/- 0.004) 0.026 +/- 0.004(0.65 +/- 0.1) 0.024 +/- 0.006 (0.6 +/- 0.

28、15) 0.033 (0.85) 0.006 (0.15) 0.05 (1.27) 0.018 (0.45) Table 3-Dimension (Bussed arrays only) EIA-866-A Page 6 Figure 1 Termination configurations Figure 2 termination styles Dimensions (mm) Type Style A B c 0 E F G Isolated 0402 X 2 0.5 1.5 0.4 0.25 0.67 - - 0402 X 4 0.5 1.5 0.4 0.25 0.5 - - 0603 X

29、 (2-8) 1.0 2.6 0.6 0.5 0.8 - - 0603 x 8a 1.0 2.6 0.3 0.5 0.5 - - 0805 x n 1.0 3 0.65 0.5 1.27 - - 1206 x n 2.2 4.2 0.65 0.5 1.27 - - Bussed 0603 X 10 0.9 2.6 0.4 0.5 0.64 - - 0603 x 10a 0.9 2.3 0.3 0.7 0.635 2.45 0.4 1008 X 5 1.7 3.9 0.5 1.1 1.0 0.5 - 0805 X 10 1.0 3.0 0.4 1.0 0.8 3.4 0.4 1206 X 10

30、2.1 4.1 0.6 0.5 1.27 - - 1206 X 9 2.4 4.6 0.5 1.1 1.3 0.65 - Table 4 Solder Pad Figure Dimensions EIA-866-A Page 7 Figure 3 Available circuits ECIA Document Improvement Proposal If in the review or use of this document, a potential change is made evident for safety, health or technical reasons, plea

31、se fill in the appropriate information below and mail or FAX to: Electronic Components Industry Association EIA Standards & Technology Department 2214 Rock Hill Rd., Suite 265 Herndon, VA 20170 FAX: (571-323-0245) Document No.: Document Title: Submitters Name: Telephone No.: FAX No.: e-mail: Address

32、: Urgency of Change: Immediate: At next revision: Problem Area: a. Clause Number and /or Drawing: b. Recommended Changes: c. Reason/Rationale for Recommendation: Additional Remarks: Signature: Date: FOR ECIA USE ONLY Responsible Committee: Chairman: Date comments forwarded to Committee Chairman: Electronic Components Industry Association 2214 Rock Hill Road, Suite 265 * Herndon, VA 20170 * tel 571-323-0294 * fax 571-323-0245 www.eciaonline.org

copyright@ 2008-2019 麦多课文库(www.mydoc123.com)网站版权所有
备案/许可证编号:苏ICP备17064731号-1