1、 EIA STANDARD Thick Film Resistor Array Specification EIA-886-A (Revision of EIA-886) May 2014 ANSI/EIA-886-A-2014 Approved: May 29, 2014 EIA-886-A NOTICE EIA Engineering Standards and Publications are designed to serve the public interest through eliminating misunderstandings between manufacturers
2、and purchasers, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for his particular need. Existence of such Standards and Publications shall not in any respect preclude any member or nonmember of
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4、ds and Publications are adopted by ECIA in accordance with the American National Standards Institute (ANSI) patent policy. By such action, ECIA does not assume any liability to any patent owner, nor does it assume any obligation whatever to parties adopting the Standard or Publication. This EIA Stan
5、dard is considered to have International Standardization implication, but the International Electrotechnical Commission activity has not progressed to the point where a valid comparison between the EIA Standard and the IEC document can be made. This Standard does not purport to address all safety pr
6、oblems associated with its use or all applicable regulatory requirements. It is the responsibility of the user of this Standard to establish appropriate safety and health practices and to determine the applicability of regulatory limitations before its use. (From Standards Proposal No. 5306, formula
7、ted under the cognizance of the P-1 Committee on EIA National Resistive Devices Standards). Published by Electronic Components Industry Association 2014 Engineering Department 2214 Rock Hill Road, Suite 265 Herndon, VA 20170 PLEASE! DONT VIOLATE THE LAW! This document is copyrighted by the ECIA and
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9、7-7956) i CONTENTS Page Foreword iii Clause 1 Introduction 1 2 Applicable documents latest version) 1 3 Requirements 1 3.1 Physical 1 3.1.1 Dimensions 1 3.1.2 Termination style 1 3.1.3 Material 1 3.1.4 Solderability 1 3.1.5 Solder pad dimensions 1 3.1.6 Marking 1 3.2 Electrical 1 3.2.1 Resistor rati
10、ngs 1 3.3 Environmental and mechanical tests 2 3.3.1 Resistance to soldering heat 2 3.3.2 Terminal strength 2 3.3.3 Terminal adhesion 2 3.3.4 Thermal shock 2 3.3.5 Low temperature operation 3 3.3.6 High temperature exposure 3 3.3.7 Short time overload 3 3.3.8 Moisture resistance 3 3.3.9 Life 3 3.3.1
11、0 Temperature cycling 3 3.3.11 Post environmental and mechanical conditioning 3 3.3.12 Acceptance criteria for environmental and mechanical tests 3 4 Quality assurance provisions 3 5 Packaging 3 Tables 1 Resistor wattage and voltage 2 2 Dimensions (Isolated) 4 3 Dimensions (Bussed) 5 4 Solder pad di
12、mension 6 Figures 1 Termination configurations 6 2 Termination style 6 3 Available circuits 7 ii Foreword This specification was prepared by the P-1 Committee on Resistive Components of the Electronic Industries Alliances sector Electronic Components, Assemblies, Equipment it specifies 1 hour at -65
13、 C followed by 45 minutes of rated continuous voltage applied while maintaining the same temperature. 3.3.6 High temperature exposure High temperature exposure shall be tested in accordance with 4.8.7 of MIL-PRF-55342; it specifies 100 hours at +150 C. 3.3.7 Short time overload Short time overload s
14、hall be tested in accordance with 4.8.6 of MIL-PRF-55342; it specifies 2.5 times rated continuous working voltage shall be applied for 5 seconds but not exceeding twice the maximum voltage. 3.3.8 Moisture resistance Moisture resistance shall be tested in accordance with MIL-STD-202 method 106 which
15、specifies 10 cycles for 240 hours. No loading voltage shall be applied during testing. 3.3.9 Life Life shall be tested in accordance with MIL-STD-202 method 108 which specifies 70 C for 250 hours. 3.3.10 Temperature cycling Temperature cycling shall be tested - 30 minutes at -55 C; 15 minutes at +25
16、 C; 30 minutes at +125 C; 15 minutes at +25 C for 5 cycles. 3.3.11 Post environmental & mechanical conditioning The devices that require electrical testing after environmental and mechanical stress may be allowed to remain at room temperature for a period up to 24 hours prior to electrical testing.
17、3.3.12 Acceptance criteria for environmental & mechanical tests The devices shall meet all specifications herein and there shall be no evidence of mechanical damage or corrosion 4 Quality Assurance Provisions Parts shall be inspected to assure compliance to the requirements of this specification. 5
18、Packaging The devices should be packaged in tape and reel. The tape and reel shall meet the latest version of EIA standard (EIA-481). The size of the reel shall be 178 mm, 254 mm, or 330 mm (7 in, 10 in, or 13 in). The tape and reel EIA-866-A Page 4 should be placed in a pizza-style box or sleeve an
19、d its material should comply with the EIA Packaging Material Standards for ESD Sensitive Items (EIA-541). The outside of the pizza-style box or sleeve should be bar-coded in accordance with the latest version of EIA standard (EIA-556). Size Code Inch (mm) L w c d t a (ref.) b (ref.) p (ref.) 0402x2
20、0.039 +/- 0.004 (1.0 +/- 0.1) 0.039 +/- 0.004(1.0 +/- 0.1) 0.006 +/- 0.004 (0.15 +/- 0.1) 0.012 (0.31) max 0.014 +/- 0.004 (0.356 +/- 0.1) 0.013 (0.33) 0.017 (0.432)0.026 (0.66) 0402x4 0.079 +/-0.004 (2.0 +/- 0.1) 0.020 (0.51) 0603x2 0.062 +/- 0.008 (1.6 +/- 0.2) 0.063 +/- 0.008(1.6 +/- 0.2) 0.012 +
21、/- 0.008 (0.3 +/- 0.2) 0.016 +/- 0.006 (0.4 +/- 0.15) 0.024 +/- 0.004 (0.6 +/- 0.1) 0.020 (0.50) 0.006 (0.15) 0.031 (0.79) 0603x4 0.126 +/- 0.008 (3.2 +/- 0.2) 0603x8 0.252 +/- 0.008 (6.4 +/- 0.2) 0603x8a 0.149 +/- 0.004 (3.79 +/- 0.1) 0.012 +/- 0.004 (0.3 +/- 0.1) 0.018 +/- 0.004 (0.45 +I- 0.1) 0.0
22、12 (0.31) 0.020 (0.50) 0805x2 0.1 +/- 0.006 (2.54 +/- 0.2) 0.079 +/-,0.008 (2.0 +/- 0.2) 0.016 +/- 0.012 (0.4 +/- 0.3) 0.022 +/- 0.006 (0.55 +/- 0.15) 0.024 +/- 0.004 (0.6 +/- 0.1) 0.031 (0.79) 0.050 (1.27) 0805x4 0.2 +/- 0.008 (5.08 +/- 0.2) 0805x8 0.4 +/- 0.008 (10.16 +/- 0.2) 1206x2 0.1 +/- 0.008
23、 (2.54 +/- 0.2) 0.126 +/- 0.008 (3.2 +/- 0.2) 0.020 +/- 0.012 (0.5 +/- 0.3) 1206x4 0.2 +/- 0.008 (5.08 +/- 0.2) 1206x8 0.4 +1- 0.008 (10.16 +I- 0.2) Table 2-Dimensions (Isolated arrays only) EIA-866-A Page 5 Size Code Inch (mm) L t w t p1 d a (ref.) b (ref.) p (ref.) c (ref) 0603 X 10 (circuit 1 & 2
24、) 0.126 +/- 0.004 (3.2 +/- 0.1) 0.063 +/- 0.004 (1.6 +/- 0.1) 0.020 +/- 0.004 (0.5 +/- 0.1) - - 0.010 +/- 0.004 (0.25 +/- 0.1) 0.016 (0.4) 0.012 (0.3) 0.025 (0.64) 0.012 (0.3) 0603x 10a (circuit 3) 0.126 +/- 0.004 (3.2 +/- 0.1) 0.063 +/- 0.004 (1.6+/-0.1) 0.022 +/- 0.004 (0.55 +/- 0.1) 0.032 +/- 0.0
25、04(0.8 +/0 0.1) 0.014 +/- 0.004 (0.35 +/- 0.1) 0.013 (0.33) 0.008 (0.2) 0.025 (0.64) 0.012 (0.3) 1008 X 5 (circuit 5) 0.126 +/0 .008 (3.2 +/- 0.2) 0.098 +I- 0.008 (2.5 +/- 0.2) 0.024 +/- 0.004 (0.6 +/- 0.1) 0.02 +/- 0.004 (0.5 +I- 0.1) 0.02 +/- 0.006 (0.5 +/- 0.15) 0.026 (0.65) 0.006 (0.15) 0.025 (0
26、.64) 0.012 (0.3) 0805 x 10 (circuit 3) 0.157 +/- 0.008 (4.0 +/- 0.2) 0.083 +/- 0.008 (2.1 +/- 0.2) 0.024 +/- 0.004 (0.6 +/- 0.1) 0.043 +/- 0.004(1.1 +/- 0.1) 0.016 +/- 0.008 (0.4 +/- 0.2) 0.02 (0.5) 0.01 (0.25) 0.031 (0.8) 0.01 (0.25) 1206 X 10 (circuit 1& 2) 0.252 +/- 0.008 (6.4 +I0.2 0.122 +/- 0.0
27、08 (3.1 +/-0.2) 0.024 +/- 0.004 (0.6 +/- 0.004) - - 0.016 +/- 0.008 (0.4 +/- 0.2) 0.024 (0.6) 0.006 (0.15) 0.05 (1.27) 0.014 (0.35) 1206 X 9 (circuit4) 0.252 +/- 0.008 (6.4 +/- 0.2 0.126 +/- 0.008 (3.2 +/- 0.2) 0.024 +/- 0.004 (0.6 +/- 0.004) 0.026 +/- 0.004(0.65 +/- 0.1) 0.024 +/- 0.006 (0.6 +/- 0.
28、15) 0.033 (0.85) 0.006 (0.15) 0.05 (1.27) 0.018 (0.45) Table 3-Dimension (Bussed arrays only) EIA-866-A Page 6 Figure 1 Termination configurations Figure 2 termination styles Dimensions (mm) Type Style A B c 0 E F G Isolated 0402 X 2 0.5 1.5 0.4 0.25 0.67 - - 0402 X 4 0.5 1.5 0.4 0.25 0.5 - - 0603 X
29、 (2-8) 1.0 2.6 0.6 0.5 0.8 - - 0603 x 8a 1.0 2.6 0.3 0.5 0.5 - - 0805 x n 1.0 3 0.65 0.5 1.27 - - 1206 x n 2.2 4.2 0.65 0.5 1.27 - - Bussed 0603 X 10 0.9 2.6 0.4 0.5 0.64 - - 0603 x 10a 0.9 2.3 0.3 0.7 0.635 2.45 0.4 1008 X 5 1.7 3.9 0.5 1.1 1.0 0.5 - 0805 X 10 1.0 3.0 0.4 1.0 0.8 3.4 0.4 1206 X 10
30、2.1 4.1 0.6 0.5 1.27 - - 1206 X 9 2.4 4.6 0.5 1.1 1.3 0.65 - Table 4 Solder Pad Figure Dimensions EIA-866-A Page 7 Figure 3 Available circuits ECIA Document Improvement Proposal If in the review or use of this document, a potential change is made evident for safety, health or technical reasons, plea
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