EN 61967-1-2002 en Integrated Circuits - Measurement of Electromagnetic Emissions 150 kHZ to 1 GHz Part 1 General Conditions and Definitions《集成电路 150 kHz至1 GHz电磁辐射的测量 第1部分 一般条件和定义 .pdf

1、BRITISH STANDARD Integrated circuits Measurement of electromagnetic emissions, 150 kHz to 1 GHi Part 1 : General conditions and de fin it ions The European Standard EN 61967-1:2002 has the status of a British Standard ICs 3 1.200 BS EN 61 967-1 1 2002 IEC 61 967-1 1 2002 present to the responsible E

2、uropean committee any enquiries on the interpretation, or proposals for change, and keep the UK interests informed; monitor related international and European developments and promulgate them in the UK. - A list of organizations represented on this committee can be obtained on request to its secreta

3、ry. From 1 January 1997, all IEC publications have the number 60000 added to the old number. For instance, IEC 27-1 has been renumbered as IEC 60027-1. For a period of time during the change over fi-om one numbering system to the other, publications may contain identifiers from both systems. Cros s-

4、r e fer en ces The British Standards which implement international or European publications referred to in this document may be found in the BSI Catalogue under the section entitled “International Standards Correspondence Index”, or by using the “Search”faci1ity of the BSI Electronic Catalogue or of

5、 British Standards Online. This publication does not purport to include all the necessary provisions of a contract. Users are responsible for its correct application. Compliance with a British Standard does not of itself confer immunity from legal obligations. Summary of pages This document comprise

6、s a front cover, an inside front cover, the EN title page, pages 2 to 24, an inside back cover and a back cover. The BSI copyright date displayed in this document indicates when the document was last issued. O BSI 2 July 2002 ISBN O 580 39890 O EUROPEAN STANDARD EN 61967-1 NORME EUROPENNE EUROPISCHE

7、 NORM June 2002 ICs 31.200 English version Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz Part 1 : General conditions and definitions (IEC 61 967-1 12002) Circuits intgrs - Mesure des missions lectromagntiques, 150 kHz 1 GHz Partie 1 : Conditions gnrales et dfinitio

8、ns (CE1 61967-1 12002) Integrierte Schaltungen - Mess u n g von el e ktro mag n et isc h e n Aussendungen im Frequenzbereich von 150 kHz bis 1 GHz Teil 1 : Allgemeine Bedingungen und Definitionen (IEC 61967-1 12002) This European Standard was approved by CENELEC on 2002-05-01. CENELEC members are bo

9、und to comply with the CENKENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the C

10、entral Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same

11、 status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic, Denmark, Finland, France, Germany, Greece, Iceland, Ireland, Italy, Luxembourg, Malta, Netherlands, Norway, Portugal, Spain, Sweden, Switzerland and United Kingdom. CEN

12、ELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: rue de Stassart 35, B - 1050 Brussels O 2002 CENELEC - All rights of exploitation in any form and by any means reserved w

13、orldwide for CENELEC members. Ref. No. EN 61 967-1 :2002 E Page 2 EN 61967-12002 Foreword The text of document 47A/632/FDIS, future edition 1 of IEC 61967-1, prepared by SC 47A, Integrated circuits, of IEC TC 47, Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved

14、by CENELEC as EN 61 967-1 on 2002-05-01. The following dates were fixed: - latest date by which the EN has to be implemented at national level by publication of an identical national standard or by endorsement - latest date by which the national standards conflicting with the EN have to be withdrawn

15、 (dop) 2003-02-01 (dow) 2005-05-01 Annexes designated “normative“ are part of the body of the standard. Annexes designated “informative“ are given for information only. In this standard, annex ZA is normative and annexes A, B and C are informative. Annex ZA has been added by CENELEC. Endorsement not

16、ice The text of the International Standard IEC 61967:2002 was approved by CENELEC as a European Standard without any modification. In the official version, for Bibliography, the following notes have to be added for the standards indicated : IEC 61000-4-3 NOTE Harmonized as EN 61000-4-3:1996 (modifie

17、d). IEC 61000-4-6 NOTE Harmonized as EN 61000-4-6:1996 (not modified) IEC 61967-4 NOTE Harmonized as EN 61967-4:2002 (not modified). O BSI 2 July 2002 Page 3 EN 61967-12002 CONTENTS 1 Scope . 5 2 Normative references . 5 3 Definitions . . 6 4 Test conditions . 9 9 4.2 Ambient conditions . O 4.2.1 Am

18、bient temperature . 10 4.2.2 Ambient RF field strength 1 O 4.2.3 Other ambient conditions . 1 O 4.2.4 IC stability over time IO 5 Test equipment . 10 5.1 General . 10 5.2 Shielding . 10 5.3 RF measuring instrument . 5.3.1 Measuring receiver . 5.3.2 Spectrum analyser 5.3.3 Other RBW for narrowband di

19、sturbances 11 5.3.4 Disturbance type, detector type and sweep speed . 11 5.3.5 Video bandwidth 12 5.3.6 Verification of calibration for the RF measuring instrument 12 5.4 Frequency range . 12 5.5 Pre-amplifier or attenuator . 12 5.6 System gain . . 12 5.7 Other components 12 6 Test set-up . 12 6.1 G

20、eneral . 12 6.2 Test circuit . 13 6.3 IC pin loading 13 6.4 Power supply requirements - Test board power supply . 13 6.5 IC specific considerations . . 14 6.5.1 IC supply voltage . 14 6.5.2 IC decoupling . . 14 6.5.3 Activity of IC . 14 6.5.4 Guidelines regarding IC operation 14 7 Test procedure . 1

21、4 7.1 Ambient check . 14 7.2 Operational check . 14 7.3 Specific procedures . 15 O BSI 2 July 2002 Page 4 EN 61967-1:2002 15 15 8 Test report 8.1 General . 8.2 Ambient . 8.3 Description of device . 8.4 Description of set-up . 8.5 Description of software 8.6 Data presentation 8.6.1 Graphical presenta

22、tion 15 8.6.2 Software for data capture 15 8.6.3 Data pro 15 8.8 Interpretation of 16 Comparison between different test methods 15 8.7 RF emission limits 8.8.1 Compari 8.8.2 8.8.3 Correlati 9 General basic test board specification 9.1 Board description - mechanical . 16 9.2 9.3 Ground planes . 9.4 P

23、ins . 9.4.1 DIL pac 9.4.3 PGA, BGA packages 16 17 17 17 Board description - electrical characteristics . 9.4.2 SOP, PLCC, 9.5 Via type . 9.6 Via distance 9.7 Additional components 18 9.7.1 Supply decoupling . 18 9.7.2 I/O load 18 . Annex A (informative) Annex B (informative) Annex ZA (normative) Nor

24、mative references to international publications with their Test method comparison 20 Flow chart of an example counter test code . 21 Annex C (informative) Prescription of a worst-case application software description . 22 corresponding European publications .24 Bibliography . .23 Figure 1 - General

25、basic test board 19 Figure B.l - Test code flow chart 21 Table 1 - Measuring receiver bands and RBW (resolution bandwidth) default settings 11 Table 3 - IC pin loading recommendations . Table 4 - Position of vias over the board Table A.l - Test method comparison Table 2 - Spectrum analyser bands and

26、 RBW default settings 20 O BSI 2 July 2002 Page 5 EN 61967-12002 INTEGRATED CIRCUITS - MEASUREMENT OF ELECTROMAGNETIC EMISSIONS, 150 kHz to 1 GHz - Part 1: General conditions and definitions 1 Scope This part of IEC 61967 provides general information and definitions on measurement of conducted and r

27、adiated electromagnetic disturbances from integrated circuits. It also provides a description of measurement conditions, test equipment and set-up as well as the test procedures and content of the test reports. A test method comparison table is included as annex A to assist in selecting the appropri

28、ate measurement method(s). The object of this standard is to describe general conditions in order to establish a uniform testing environment and obtain a quantitative measure of RF disturbances from integrated circuits (IC). Critical parameters that are expected to influence the test results are des

29、cribed. Deviations from this standard are noted explicitly in the individual test report. The measure- ment results can be used for comparison or other purposes. Measurement of the voltage and current of conducted RF emissions or radiated RF disturbances, coming from an integrated circuit under cont

30、rolled conditions, yields information about the potential for RF disturbances in an application of the integrated circuit. 2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undat

31、ed references, the latest edition of the referenced document (including any amendments) applies. IEC 60050( 161), Infernafional Elecfrofechnical Vocabulary (IEV) - Chapfer 161: Elecfro- magne fic comp a fibilify CISPR 16-1 :I 999, Specificafion for radio disfurbance and immunify measuring apparafus

32、and mefhods - Parf 1: Radio disfurbance and immunify measuring apparafus CISPR 25:1995, Limifs and mefhods of measuremenf of radio disfurbance characferisfics for fhe profecfion of receivers used on board vehicles ANSI C63.2:1996, American Sfandard for Elecfromagnefic Noise and Field Sfrengfh Insfru

33、menfafion, 10 Hz fo 40 GHz - Specificafions O BSI 2 July 2002 Page 6 EN 61967-12002 3 Definitions For the purpose of this part of IEC 61967, the following definitions, taken mostly from IEC 60050(161), apply. 3.1 artificial network AN agreed reference load impedance (simulated), presented to the EUT

34、 by networks (for example, extended power or communication lines) across which the RF disturbance voltage is measured and which isolates the apparatus from the power supply or loads in that frequency range IEV 161-04-05, modified 3.2 associated equipment transducers (for example, probes, networks an

35、d antennas) connected to a measuring receiver or test generator; also transducers (for example, probes, networks, and antennas) which are used in the signal or disturbance transmission path between an EUT and measuring equipment or a (test-) signal generator 3.3 auto sweep fastest calibrated sweep w

36、hich a spectrum analyser will automatically select based on start frequency, stop frequency, resolution bandwidth and video bandwidth 3.4 broadband emission emission which has a bandwidth greater than that of a particular measuring apparatus or receiver IEV 161-06-11, modified 3.5 common mode voltag

37、e asymmetrical voltage mean of the phasor voltages appearing between each conductor and a specified reference, usually earth or frame IEV 161-04-09 3.6 common mode current in a cable having more than one conductor, including shields and screens, if any, the magnitude of the sum of the phasors repres

38、enting the currents in each conductor IEV 161-04-391 3.7 conducted emissions transients and/or other disturbances observed on the external terminals of a device during its normal operation 3.8 con t i n uo us disturbance RF disturbance with a duration of more than 200 ms at the IF-output of a measur

39、ing receiver, which causes a deflection on the meter of a measuring receiver in quasi-peak detection mode which does not decrease immediately IEV 161-02-11, modified O BSI 2 July 2002 Page 7 EN 61967-12002 3.9 device under test DUT device, equipment or system being evaluated NOTE As used in this sta

40、ndard, DUT refers to a semiconductor device being tested 3.10 die shrink amount of shrink of the mask used to produce the integrated circuit (IC) expressed as a percentage or dimensions relative to the original artwork layout (drawn size) 3.11 differential mode current in a two-conductor cable, or f

41、or two particular conductors in a multi-conductor cable, half the magnitude of the difference of the phasors representing the currents in each conductor IEV 161-04-381 3.12 differential mode voltage voltage between any two of a specified set of active conductors IEV 161-04-08 3.13 discontinuous dist

42、urbance for counted clicks, disturbance with a duration of less than 200 ms at the IF-output of a measuring receiver, which causes a transient deflection on the meter of a measuring receiver in quasi-peak detection mode IEV 161-02-28, modified 3.14 electrically small PCB printed circuit board, whose

43、 dimension is smaller than h/2, for example, 100 mm to 150 mm at 1 GHz 3.15 electromagnetic com pat i bi I i ty EMC ability of an equipment or system to function satisfactorily in its electromagnetic environment without introducing intolerable electromagnetic disturbances to anything in that environ

44、ment IEV 161-01-07 3.16 electromagnetic emission phenomenon by which electromagnetic energy emanates from a source 3.17 electromagnetic rad ation rad ated emissions 1. phenomena by which energy in the form of electromagnetic waves emanates from a source into space 2. energy transferred through space

45、 in the form of electromagnetic waves IEV 161-01-10 O BSI 2 July 2002 Page 8 EN 61967-12002 3.18 emission limit (from a disturbing source) specified maximum emission level of a source of electromagnetic disturbance IEV 161-03-121 3.19 ground (reference) plane flat conductive surface whose potential

46、is used as a common reference IEV 161-04-361 3.20 lead frame supporting structure for the silicon die that interfaces the external pins to the die 3.21 measuring receiver receiver for the measurement of disturbances with different detectors NOTE The bandwidth of the receiver should be as specified i

47、n CISPR 16-1 3.22 multi-chip module MCM integrated circuit whose elements are formed on or within two or more semiconductor chips that are mounted in a single package 3.23 multi IC sets set of ICs that functions as a unit; in a higher level of integration the set could be a single IC 3.24 narrowband

48、 emission emission which has a bandwidth less than that of a particular measuring apparatus or receiver IEV 161-06-13, modified 3.25 peak detector detector, the output voltage of which is the peak value of the applied signal IEV 161-04-241 3.26 preamp noise floor inherent thermal noise generated by

49、the first stage amplifier that limits the signal resolution of the measurement system 3.27 receiver terminal voltage external voltage measured in dB(pV) at the input of a radio interference measuring instrument conforming to the requirements of CISPR 16-1 or ANSI C63.2 CISPR 25, 3.1 modified O BSI 2 July 2002 Page 9 EN 61967-12002 3.28 reference point specific port or point on the test set-up where the measurement of the sampled parameter is made 3.29 repetition rate number of surges, spikes, or pulses per unit time 3.30 electromagnetic e