EN 61967-2-2005 en Integrated circuits - Measurement of electromagnetic emissions 150 kHz to 1 GHz Part 2 Measurement of radiated emissions - TEM cell and wideband TEM cell method《.pdf

1、BRITISH STANDARDBS EN 61967-2:2005Integrated circuits Measurement of electromagnetic emissions, 150 kHz to 1 GHz Part 2: Measurement of radiated emissions TEM cell and wideband TEM cell methodThe European Standard EN 61967-2:2005 has the status of a British StandardICS 31.080.99g49g50g3g38g50g51g60g

2、44g49g42g3g58g44g55g43g50g56g55g3g37g54g44g3g51g40g53g48g44g54g54g44g50g49g3g40g59g38g40g51g55g3g36g54g3g51g40g53g48g44g55g55g40g39g3g37g60g3g38g50g51g60g53g44g42g43g55g3g47g36g58BS EN 61967-2:2005This British Standard was published under the authority of the Standards Policy and Strategy Committee

3、on 23 January 2006 BSI 23 January 2006ISBN 0 580 47476 3National forewordThis British Standard is the official English language version of EN 61967-2:2005. It is identical with IEC 61967-2:2005. The UK participation in its preparation was entrusted to Technical Committee EPL/47, Semiconductors, whic

4、h has the responsibility to: A list of organizations represented on this committee can be obtained on request to its secretary.Cross-referencesThe British Standards which implement international or European publications referred to in this document may be found in the BSI Catalogue under the section

5、 entitled “International Standards Correspondence Index”, or by using the “Search” facility of the BSI Electronic Catalogue or of British Standards Online.This publication does not purport to include all the necessary provisions of a contract. Users are responsible for its correct application. Compl

6、iance with a British Standard does not of itself confer immunity from legal obligations. aid enquirers to understand the text; present to the responsible international/European committee any enquiries on the interpretation, or proposals for change, and keep UK interests informed; monitor related int

7、ernational and European developments and promulgate them in the UK.Summary of pagesThis document comprises a front cover, an inside front cover, the EN title page, pages 2 to 22, an inside back cover and a back cover.The BSI copyright notice displayed in this document indicates when the document was

8、 last issued.Amendments issued since publicationAmd. No. Date CommentsEUROPEAN STANDARD EN 61967-2 NORME EUROPENNE EUROPISCHE NORM October 2005 CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Nor

9、mung Central Secretariat: rue de Stassart 35, B - 1050 Brussels 2005 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 61967-2:2005 E ICS 31.080.99 English version Integrated circuits - Measurement of electromagnetic emissions, 150

10、kHz to 1 GHz Part 2: Measurement of radiated emissions - TEM cell and wideband TEM cell method (IEC 61967-2:2005) Circuits intgrs - Mesure des missions lectromagntiques, 150 kHz 1 GHz Partie 2: Mesure des missions rayonnes - Mthode de cellule TEM et cellule TEM large bande (CEI 61967-2:2005) Integri

11、erte Schaltungen - Messung von elektromagnetischen Aussendungen im Frequenzbereich von 150 kHz bis 1 GHz Teil 2: Messung der abgestrahlten Aussendungen - TEM-Zellen- und Breitband-TEM-Zellenverfahren (IEC 61967-2:2005) This European Standard was approved by CENELEC on 2005-09-01. CENELEC members are

12、 bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to t

13、he Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the

14、same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Cyprus, Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Por

15、tugal, Slovakia, Slovenia, Spain, Sweden, Switzerland and United Kingdom. - 2 - Foreword The text of document 47A/722/FDIS, future edition 1 of IEC 61967-2, prepared by SC 47A, Integrated circuits, of IEC TC 47, Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved b

16、y CENELEC as EN 61967-2 on 2005-09-01. This part of EN 61967 is to be read in conjunction with EN 61967-1. The following dates were fixed: latest date by which the EN has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2006-07-01 latest da

17、te by which the national standards conflicting with the EN have to be withdrawn (dow) 2008-09-01 Annex ZA has been added by CENELEC. _ Endorsement notice The text of the International Standard IEC 61967-2:2005 was approved by CENELEC as a European Standard without any modification. In the official v

18、ersion, for Bibliography, the following notes have to be added for the standards indicated: IEC 61000-4-3 NOTE Harmonized as EN 61000-4-3:1996 (modified). IEC 61000-4-20 NOTE Harmonized as EN 61000-4-20:2003 (not modified). CISPR 16-1-1 NOTE Harmonized as EN 55016-1-1:2004 (not modified). CISPR 16-1

19、-2 NOTE Harmonized as EN 55016-1-2:2004 (not modified). CISPR 16-1-4 NOTE Harmonized as EN 55016-1-4:2004 (not modified). CISPR 16-1-5 NOTE Harmonized as EN 55016-1-5:2004 (not modified). CISPR 16-2-1 NOTE Harmonized as EN 55016-2-1:2004 (not modified). CISPR 16-2-2 NOTE Harmonized as EN 55016-2-2:2

20、004 (not modified). CISPR 16-2-3 NOTE Harmonized as EN 55016-2-3:2004 (not modified). CISPR 16-2-4 NOTE Harmonized as EN 55016-2-4:2004 (not modified). _ EN 61967-2:2005CONTENTS 1 Scope 5 2 Normative references .5 3 Terms and definitions .6 4 General6 5 Test conditions.6 5.1 General.6 5.2 Supply vol

21、tage.6 5.3 Frequency range .6 6 Test equipment.6 6.1 General.6 6.2 Shielding .6 6.3 RF measuring instrument.6 6.4 Preamplifier.7 6.5 TEM cell7 6.6 Wideband TEM/GTEM cell .7 6.7 50-Ohm termination .7 6.8 System gain 7 7 Test set-up.7 7.1 General.7 7.2 Test configuration7 7.3 Test PCB.8 8 Test procedu

22、re .11 8.1 General.11 8.2 Ambient measurement .11 8.3 DUT operational check 11 8.4 DUT emissions measurement 11 9 Test report .12 9.1 General.12 9.2 Measurement conditions 12 10 IC emissions reference levels .12 Annex A (informative) Example calibration however, the measured radio frequency (RF) vol

23、tage will be affected by many factors. The primary factor affecting the measured RF voltage is the septum to IC test board (cell wall) spacing. This procedure was developed using a 1 GHz TEM cell with a septum to floor spacing of 45 mm and a GTEM cell with average septum to floor spacing of 45 mm ov

24、er the port area. Other cells may not produce identical spectral output but may be used for comparative measurements, subject to their frequency and sensitivity limitations. A conversion factor may allow comparisons between data measured on TEM or GTEM cells with different septum to floor spacing. T

25、he IC test board controls the geometry and orientation of the operating IC relative to the cell and eliminates any connecting leads within the cell (these are on the backside of the board, which is outside the cell). For the TEM cell, one of the 50 ports is terminated with a 50 load. The other 50 po

26、rt for a TEM cell, or the single 50 port for a GTEM cell, is connected to the input of a spectrum analyser or receiver that measures the RF emissions emanating from the integrated circuit and impressed onto the septum of the cell. 2 Normative references The following referenced documents are indispe

27、nsable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60050-131:2002, International Electrotechnical Vocabulary (IEV) Part 131: Circuit theory IE

28、C 60050-161:1990, International Electrotechnical Vocabulary (IEV) Chapter 161: Electro-magnetic compatibility IEC 61967-1, Integrated circuits Measurement of electromagnetic emissions, 150 kHz to 1 GHz Part 1: General conditions and definitions EN 61967-2:2005 5 3 Terms and definitions For the purpo

29、ses of this document, the definitions in IEC 61967-1, IEC 60050-131 and IEC 60050-161 apply. 4 General The RF voltage appearing at the input to the spectrum analyser is related to the electromagnetic radiation potential of the IC and of the electronic module of which it would be a part. The intent i

30、s to provide a quantitative measure of the RF emissions from ICs for comparison or other purposes. 5 Test conditions 5.1 General The test conditions shall meet the requirements as described in IEC 61967-1. In addition, the following test conditions shall apply. 5.2 Supply voltage The supply voltage

31、shall be as specified by the IC manufacturer. If the users of this procedure agree to other values, they shall be documented in the test report. 5.3 Frequency range The effective frequency range of this radiated emissions procedure is affected by the test cell used. For a 1 GHz TEM cell, the range i

32、s 150 kHz to 1 GHz. For a wideband TEM cell (GTEM), the range is 150 kHz to 1 GHz, or as limited by the GTEM and test PCB characteristics. 6 Test equipment 6.1 General The test equipment shall meet the requirements as described in IEC 61967-1. In addition, the following test equipment requirements s

33、hall apply. 6.2 Shielding Double shielded or semi-rigid coaxial cable may be required depending on the local ambient conditions. For extreme ambient environments, operation in a shielded room may be required. 6.3 RF measuring instrument A spectrum analyser or EMI receiver shall be used. The spectrum

34、 analyser or receiver resolution bandwidth shall be 9 kHz or 10 kHz and the video bandwidth shall not be less than three times the resolution bandwidth. Measurements shall be made with a peak detector and presented in units of dBV for 50 system: (dBm readings) + 107 = dBV. For spectrum analysers, th

35、e frequency band of interest shall be swept in calibrated or coupled mode (auto sweep). EN 61967-2:2005 6 6.4 Preamplifier Typically, a 20 dB to 30 dB gain, low noise preamplifier is required to meet the ambient requirements in 8.2. If used, the preamplifier shall be connected directly to the measur

36、ement port of the TEM cell using the appropriate 50 coaxial adapter; no cable shall be used. 6.5 TEM cell The TEM cell used for this test procedure shall be fitted with a wall port sized to mate with the IC test board. The TEM cell shall not exhibit higher order modes over the frequency range being

37、measured. For this procedure, the recommended TEM cell frequency range is 150 kHz to the frequency of the first resonance of the lowest higher order mode (typically 2 GHz). The frequency range being evaluated shall be covered using a single cell. The VSWR over the frequency range being measured shal

38、l be less than 1,5. 6.7 50- termination A 50 termination with a VSWR less than 1,1 over the frequency range of measurement is required for the TEM cell 50 port not connected to the RF measuring instrument. 6.8 System gain The gain (or attenuation) of the measuring equipment, without the TEM or GTEM

39、cell, shall be known with an accuracy 0,5 dB. The gain of the equipment shall remain within a 6 dB envelope for each frequency band. 7 Test set-up 7.1 General The test set-up shall meet the requirements as described in IEC 61967-1. In addition, the following test set-up requirements shall apply. 7.2

40、 Test configuration See Figure 1 and Figure 2 for TEM cell and GTEM cell test configurations, respectively. One of the TEM cell 50 ports is terminated with a 50 load. The remaining TEM cell or GTEM 50 port is connected to the spectrum analyser through the optional preamplifier. EN 61967-2:2005 7 Fig

41、ure 1 TEM cell test set-up Figure 2 GTEM cell test set-up 7.3 Test PCB The IC test PCB shall be designed as described in IEC 61967-1 and in this document. In cases where IEC 61967-1 and this document disagree, the requirements of this document shall govern. The minimum requirements for the IC test P

42、CB are shown in Figure 3. Figure 3 describes a 100 cm2 PCB consisting of four metal layers. In theory, any size or shape of PCB may be used that will mate with the wall port on the test cell used. However, the development of this procedure was with a nominal 100 cm2PCB and a nominal 100 cm2mating wa

43、ll port (refer to Figures 1 and 2). The PCB may also contain additional inner layers as required to accommodate signal and power routing. A description of the test board set-up (photo or artwork, schematic and parts list) shall be included with the test report. The DUT side of the printed circuit bo

44、ard (the side that faces in to the test cell) is dedicated to a ground plane layer that completes the TEM or GTEM cell wall over the port opening. No other conductors are allowed on this surface because they may act as additional radiators. The ground plane should extend under the DUT, where practic

45、al for the IC package type. If the ground plane under the DUT is isolated from the rest of the ground plane layer, utilize an inner PCB ground layer and vias to establish the needed connection. The periphery of this ground plane layer shall be plated (tin, solder, gold) to facilitate contact to the

46、edge of the wall port cut in the top or bottom of the test cell. TEM cell Spectrum analyzer or EMI receiver 50 termination IC test board Preamplifier (optional) Spectrum analyzer or EMI receiver GTEM cell IC test board Preamplifier (optional) IEC 1305/05 IEC 1306/05 EN 61967-2:2005 8 The access wiri

47、ng and other required components (such as crystals) shall be on or connected to the support side of this circuit board (the side that faces out from the TEM or GTEM cell). Power bypass capacitors for the IC are to be chosen according to manufacturers recommendations and located to minimise lead leng

48、th (refer to Table 1). All wiring should be as short as possible and have controlled orientation relative to the PCB. The PCB material shall be compatible with the frequency range being evaluated. Pins that do not fall into any of the listed categories shall be loaded as functionally required and st

49、ated in the test report. These are recommended default values; if other values are more appropriate for a particular IC, they may be substituted for the values in Table 1 and shall be stated in the test report. Table 1 Pin loading recommendations IC Pin Type Pin Loading Analog - Supply As stated by the manufacturer (or as required) a- Input 10 k to ground (Vss) unless the IC is internally terminated - Output Signal 10 k to ground (Vss) unless the IC is internally terminated - Output