FORD WSB-M11A41-A-2012 SOLDER 81 Sn 16 8 Cu 2 5 Zn TO BE USED WITH FORD WSS-M99P1111-A .pdf

1、 ENGINEERING MATERIAL SPECIFICATION Date Action Revisions 2012 07 25 N-Status No replacement A. Wedepohl, NA 2005 02 07 Revised Inserted 3.0; Deleted 3.1, 3.4, 4 1989 09 15 Released NB00E00371818002 R.D.Moore, J.A.F. NAAO. J.P.C.Lines EAO Controlled document at www.MATS Copyright 2012, Ford Global T

2、echnologies, LLC Page 1 of 3 SOLDER, 81 Sn/16.8 Cu/2.5 Zn NOT FOR NEW DESIGN WSB-M11A41-A 1. SCOPE The material defined by this specification is a tin based alloy, developed to comply with the revised OSHA lead standards, virtually eliminating both the lead and arsenic content of previous body solde

3、rs. The tin base solder has a shiny, bright appearance. It is stiffer and more lightweight than previous solders. 2. APPLICATION This specification was originally released for material used as either a sheet steel body fill or as a repair solder. 3. REQUIREMENTS 3.0 STANDARD REQUIREMENTS FOR PRODUCT

4、ION MATERIALS Material suppliers and part producers must conform to the Companys Standard Requirements For Production Materials (WSS-M99P1111-A). 3.2 SOLDER COMPOSITION (weight percent) Copper 16.3 -17.3 Zinc 2.0 - 3.0 Iron 1.0 max Arsenic 0.02 max Lead 0.1 max Other 0.1 max Tin Remainder Test Metho

5、d: Energy dispersive x-ray fluorescence spectroscopy. 3.3 QUALITY The solder furnished under this specification shall be homogeneous in composition and structure and shall be free from impurities harmful to the working characteristics of the material. 4. GENERAL INFORMATION The information given bel

6、ow is provided for clarification and assistance in meeting the requirements of this specification. 4.1 NEW SOURCE APPROVAL The vendor must do the following: Contact the Body Resident Engineer at the production plant, to determine if there is a need for new suppliers. ENGINEERING MATERIAL SPECIFICATI

7、ON WSB-M11A41-A Copyright 2012, Ford Global Technologies, LLC Page 2 of 3 If there is interest, a plant tryout coordinated by Body and Assembly Engineering is required to determine functional acceptance. If the tryout was satisfactory, the Body Resident Engineer is to notify the Body Materials and C

8、orrosion Engineering Department, in writing, of the successful tryout, and the need for approval of a new supplier. The Body Materials and Corrosion Engineering Department, B&CE will then finalize the approval. 4.2 PHYSICAL PROPERTIES Pasty Range 245 - 316 C Liquidus, min 399C Working Range 218 - 31

9、6 C 4.3 SOLDER APPLICATION PROCEDURE After tinning and wiping the steel surface, apply the solder. It is essential to apply the solder to the body as quickly as possible to maintain the fine grain consistency of the solder. Do not overwork the solder as this can cause the tin to oxidize leaving mino

10、r pinholes and splits in the solder fill. Proper application technique can help prevent complications during the solder finishing operations. Consult the process sheet for tin based solders. 4.4 PADDLES AND PADDLE LUBRICANTS Use a paddle to apply and shape the solder. Different types of paddles are

11、available for forming solder to the various contours of the body. The condition of the paddle used affects the quality of the body fill or repair. The surface of the paddle should be smooth and consistent for best results. Do not use paddles with deeply scored surface patterns. Always keep paddles l

12、ubricated (water soluble paddle lubricant desired for ease of cleanup). 4.5 SOLDER APPLICATION Preheat the tinned surface with a torch to 150 - 200 C. Apply heat by moving the flame over the joint area in a fanning motion. Then firmly pat the solder into place with the paddle. Note: Do not try to sm

13、ooth the solder. This type of solder tends to separate if it is pulled. A flat mushing technique is best. 4.6 SALVAGE Do not mix lead-free solder offal with lead type solder offal. This results in a product mix that cannot be used. 4.7 PROBLEM AREAS If there are pits in the solder fill area, the pro

14、blem may be related to one or more of the following factors: Even heat was not maintained throughout the solder application procedure. The solder was worked too cold. The solder application procedure was completed too slowly, causing coarse-grain solder. Excessive paddle lubricant was used, causing

15、pits and porosity in the solder. The paddle was dragged across the solder instead of patting it into place after the solder had cooled. ENGINEERING MATERIAL SPECIFICATION WSB-M11A41-A Copyright 2012, Ford Global Technologies, LLC Page 3 of 3 The preliminary operations were not performed correctly, c

16、ausing foreign material contamination or poor solder bonding. Note 1: It is very important to determine the cause of the solder pit problem so it can be corrected. This will help prevent chronic solder finishing difficulties. Note 2: (Production body fill applications): Extreme care should be maintained while melting the solder rods in the slush pan. Do not stir or mix for this creates air bubbles which cause solder pits.