JEDEC JESD22-A101D-2015 Steady-State Temperature-Humidity Bias Life Test.pdf

1、JEDEC STANDARD Steady-State Temperature-Humidity Bias Life Test JESD22-A101D (Revision of JESD22-A101C, March 2009) JULY 2015 JEDEC SOLID STATE TECHNOLOGY ASSOCIATION NOTICE JEDEC standards and publications contain material that has been prepared, reviewed, and approved through the JEDEC Board of Di

2、rectors level and subsequently reviewed and approved by the JEDEC legal counsel. JEDEC standards and publications are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of products, and ass

3、isting the purchaser in selecting and obtaining with minimum delay the proper product for use by those other than JEDEC members, whether the standard is to be used either domestically or internationally. JEDEC standards and publications are adopted without regard to whether or not their adoption may

4、 involve patents or articles, materials, or processes. By such action JEDEC does not assume any liability to any patent owner, nor does it assume any obligation whatever to parties adopting the JEDEC standards or publications. The information included in JEDEC standards and publications represents a

5、 sound approach to product specification and application, principally from the solid state device manufacturer viewpoint. Within the JEDEC organization there are procedures whereby a JEDEC standard or publication may be further processed and ultimately become an ANSI standard. No claims to be in con

6、formance with this standard may be made unless all requirements stated in the standard are met. Inquiries, comments, and suggestions relative to the content of this JEDEC standard or publication should be addressed to JEDEC at the address below, or refer to www.jedec.org under Standards and Document

7、s for alternative contact information. Published by JEDEC Solid State Technology Association 2015 3103 North 10th Street Suite 240 South Arlington, VA 22201-2107 This document may be downloaded free of charge; however JEDEC retains the copyright on this material. By downloading this file the individ

8、ual agrees not to charge for or resell the resulting material. PRICE: Contact JEDEC Printed in the U.S.A. All rights reserved PLEASE! DONT VIOLATE THE LAW! This document is copyrighted by JEDEC and may not be reproduced without permission. For information, contact: JEDEC Solid State Technology Assoc

9、iation 3103 North 10th Street Suite 240 South Arlington, VA 22201-2107 or refer to www.jedec.org under Standards-Documents/Copyright Information. JEDEC Standard No. 22-A101D Page 1 Test Method A101D (Revision of Test Method A101C) TEST METHOD A101D STEADY-STATE TEMPERATURE-HUMIDITY BIAS LIFE TEST (F

10、rom JEDEC Board Ballots JCB-96-64, JCB-09-10, and JCB-15-28, formulated under the cognizance of JC-14.1 Committee on Reliability Test Methods for Packaged Devices.) 1 Scope The Steady-State Temperature-Humidity Bias Life Test is performed to evaluate the reliability of non-hermetic packaged IC devic

11、es in humid environments. Temperature, humidity, and bias conditions are applied to accelerate the penetration of moisture through the external protective material (encapsulant or seal) or along the interface between the external protective material and the metallic conductors which pass through it.

12、 2 Apparatus The test requires a temperature-humidity test chamber capable of maintaining a specified temperature and relative humidity continuously, while providing electrical connections to the devices under test in a specified biasing configuration. 2.1 Temperature and relative humidity The chamb

13、er must be capable of providing controlled conditions of temperature and relative humidity during ramp-up to, and ramp-down from, the specified test conditions. NOTE Care should be taken to ensure the test chamber (dry-bulb) temperature exceeds the wet-bulb temperature at all times. 2.2 Devices unde

14、r stress Devices under stress must be physically located to minimize temperature gradients. NOTE Care should be taken to minimize relative humidity gradients and maximize air flow between devices. 2.3 Minimize release of contamination Care must be exercised in the choice of board and socket material

15、s to minimize release of contamination, and to minimize degradation due to corrosion and other mechanisms. 2.4 Ionic contamination Ionic contamination from the test apparatus (e.g., card cage, test boards, sockets, wiring, storage containers, etc.) shall be controlled to avoid test artifacts. 2.5 De

16、ionized water Deionized water with a minimum resistivity of 1 M-cm at room temperature shall be used. JEDEC Standard No. 22-A101D Page 2 Test Method A101D (Revision of Test Method A101C) 3 Test Conditions Test conditions consist of a temperature, relative humidity, and duration used in conjunction w

17、ith an electrical bias configuration specific to the device. 3.1 Temperature, Relative Humidity and Duration Temperature1dry-bulb C Relative Humidity1% Temperature2wet-bulb, C Vapor Pressure2kPa (psia) Duration3hours 85 2 85 5 81.0 49.1 (7.12) Typ. 1000 +168/-24 NOTE 1 Tolerances apply to the entire

18、 useable test area. NOTE 2 For information only. NOTE 3 The test conditions are to be applied continuously except during any interim readouts. For interim readouts, devices should be returned to stress within the time specified in 4.5. 3.2 Biasing guidelines Apply either of the two methods ofbias ac

19、cording to the following guidelines: a) Minimize power dissipation. b) Alternate pin bias as much as possible. c) Distribute potential differences across chip metallization as much as possible. d) Maximize voltage within operating range. NOTE The priority of the above guidelines depends on mechanism

20、 and specific device characteristics. e) Either of two methods of bias can be used to satisfy these guidelines, whichever is more severe: 1) Continuous bias: The dc bias shall be applied continuously. Continuous bias is more severe than cycled bias when the die temperature is 10 C higher than the ch

21、amber ambient temperature. If the die temperature is not known, when the heat dissipation of the device under test (DUT) is less than 200 mW. If the heat dissipation of the DUT exceeds 200 mW, then the die temperature should be calculated. If the die temperature exceeds the chamber ambient temperatu

22、re by more than 5 C then the die temperature rise above the chamber ambient should be included in reports of test results since acceleration of failure mechanisms will be affected. JEDEC Standard No. 22-A101D Page 3 Test Method A101D (Revision of Test Method A101C) 3.2 Biasing guidelines (contd) 2)

23、Cycled bias: The dc voltage applied to the devices under test shall be periodically interrupted with an appropriate frequency and duty cycle. If the biasing configuration results in a temperature rise above the chamber ambient, Tja, exceeding 10 C, then cycled bias, when optimized for a specific dev

24、ice type, will be more severe than continuous bias. Heating as a result of power dissipation tends to drive moisture away from the die and thereby hinders moisture-related failure mechanisms. Cycled bias permits moisture collection on the die during the off periods when device power dissipation does

25、 not occur. Cycling the DUT bias with one hour on and one hour off is optimal for most plastic-encapsulated microcircuits. The die temperature, as calculated on the basis of the known thermal impedance and dissipation, should be quoted with the results whenever it exceeds the chamber ambient by 5 C

26、or more. 3.2.1 Choosing and reporting Criteria for choosing continuous or cyclical bias, and whether or not to report the amount by which the die temperature exceeds the chamber ambient temperature, are summarized in the table: TjaCyclical Bias? Report Tja? Tja 5 C, or Power per DUT 200 mW No No (Tj

27、a 5 C or Power per DUT 200 mW), and Tja 10 C No Yes Tja 10 C Yes1Yes 1Cycling the DUT bias with one hour on and one hour off is optimal for most plastic-encapsulated microcircuits 4 Procedures The test devices shall be mounted in a manner that exposes them to a specified condition of temperature and

28、 humidity with a specified electrical biasing condition. Exposure of devices to excessively hot, dry ambient or conditions that result in condensation on devices and electrical fixtures shall be avoided, particularly during ramp-up and ramp-down. Appropriate attention should also be made to avoid an

29、y water dripping on the devices under stress. 4.1 Ramp-up The time to reach stable temperature and relative humidity conditions should be less than 3 hours. Condensation on the devices under stress and/or fixtures/hardware shall be avoided at all times by ensuring that their temperature is always hi

30、gher than the dew point temperature. JEDEC Standard No. 22-A101D Page 4 Test Method A101D (Revision of Test Method A101C) 4.2 Ramp-down Ramp-down should be less than 3 hours. Condensation shall be avoided by ensuring that the test chamber (dry-bulb) temperature exceeds the wet-bulb temperature at al

31、l times during ramp-down. NOTE For a DUT with a cavitiy in the package, condensation on the internal surface may occur due to length of ramp-down time. 4.3 Test Clock The test clock starts when the temperature and relative humidity reach the setpoints, and stops at the beginning of ramp-down. 4.4 Bi

32、as Bias application during ramp-up and ramp-down is optional. Bias should be verified after devices are loaded, prior to the start of the test clock. Bias should also be verified after the test clock stops, but before devices are removed from the chamber. 4.5 Readout Electrical test shall be perform

33、ed not later than 48 hours after the end of ramp-down. For intermediate readouts, devices shall be returned to stress within 96 hours of the end of ramp-down. The rate of moisture loss from devices after removal from the chamber can be reduced by placing the devices in sealed moisture barrier bags (

34、without desiccant). When devices are placed in sealed bags, the “test window clock“ runs at 1/3 of the rate of devices exposed to the laboratory ambient. Thus the test window can be extended to as much as 144 hours, and the time to return to stress to as much as 288 hours by enclosing the devices in

35、 moisture-proof bags. NOTE 1 The electrical test parameters should be chosen to preserve any defect (i.e., by limiting the applied test current). NOTE 2 Additional time-to-test delay or return-to-stress delay time may be allowed if justified by technical data 4.6 Handling Suitable hand-covering shal

36、l be used to handle devices, boards and fixtures. Contamination control is important in any accelerated moisture stress test. JEDEC Standard No. 22-A101D Page 5 Test Method A101D (Revision of Test Method A101C) 5 Failure Criteria A device will be considered to have failed the Steady-State Temperatur

37、e-Humidity Bias Life Test if parametric limits are exceeded, or if functionality cannot be demonstrated under nominal and worst-case conditions. Specific failure criteria may be found in other applicable document or data sheet. 6 Safety Follow equipment manufacturers recommendations and local safety

38、 regulations. 7 Summary The following details shall be specified in the applicable procurement document: a) Test duration, if other than as specified in 3.1. b) Measurements after test. c) Biasing configuration. d) Temperature of die during test if it is 5 C above the chamber ambient. e) Frequency a

39、nd duty cycle of bias if cycled bias is to be used. JEDEC Standard No. 22-A101D Page 6 Test Method A101D (Revision of Test Method A101C) Annex A (informative) Differences between JESD22-A101D and its predesessors These tables briefly describe most of the non-editorial changes made to entries that ap

40、pear in this standard, JESD22-A101D, compared to its predecessors, JESD22-A101C (March 2009) and JESD22-A101-B (April 1997). A.1 Differences between JESD22-A101D and JESD22-A101C Clause Description of change 3.1 Changed “psia/kPa” to “kPa (psia)”. This corrects an error made in JESD22-A101C when the

41、 order of the numbers was reversed, but the order of the units in the heading was not. 3.1 In table, last column: replaced “Note 4” with context of NOTE 4. 3.1 Removed NOTE 4. 4.1 Changed the phrase “shall be less than 3 hours” to “should be less than 3 hours”. 4.2 Changed the phrase “shall not exce

42、ed 3 hours” to “should be less than 3 hours”. A.2 Differences between JESD22-A101C and JESD22-A101-B (April 1997) Clause Description of change 1 deleted “for the purpose of evaluating” replaced with “to evaluate”. 1 deleted “solid-state” replaced with “IC”. 1 deleted “It employs conditions of” repla

43、ced with “.”. 1 deleted “which” replaced with “conditions are applied to”. 1 deleted “encapsulant” replaced with “encapsulate”. 2.1 Added note. 2.2 Added note. 2.4 deleted “of” replaced with “from” 3.1 Under duation hours, changed from “1000(-24,+168)” to “Note 4” 3.1 Added Note 4. 3.2 Added “either

44、 of the two methods of”. 3.2e deleted kinds” replaced with “methods”. 3.2.1 In table replaced “D” with “” in 3 places. 3.2.1 Added reference 1. 4 Add last sentence to paragraph beginning “Appropriate attention”. 4.1 Reworded second paragraph. 4.2 Added “during ramp-down” at end of first paragraph. 4

45、.2 Added note. 4.5 Added note. 5 Reworded paragraph. Standard Improvement Form JEDEC JESD22-A101D The purpose of this form is to provide the Technical Committees of JEDEC with input from the industry regarding usage of the subject standard. Individuals or companies are invited to submit comments to

46、JEDEC. All comments will be collected and dispersed to the appropriate committee(s). If you can provide input, please complete this form and return to: JEDEC Attn: Publications Department 3103 North 10th Street Suite 240 South Arlington, VA 22201-2107 Fax: 703.907.7583 1. I recommend changes to the

47、following: Requirement, clause number Test method number Clause number The referenced clause number has proven to be: Unclear Too Rigid In Error Other 2. Recommendations for correction: 3. Other suggestions for document improvement: Submitted by Name: Phone:Company: E-mail: Address: City/State/Zip: Date: